JPS6011105B2 - アルミニウムの無電流触媒析出方法 - Google Patents

アルミニウムの無電流触媒析出方法

Info

Publication number
JPS6011105B2
JPS6011105B2 JP52094070A JP9407077A JPS6011105B2 JP S6011105 B2 JPS6011105 B2 JP S6011105B2 JP 52094070 A JP52094070 A JP 52094070A JP 9407077 A JP9407077 A JP 9407077A JP S6011105 B2 JPS6011105 B2 JP S6011105B2
Authority
JP
Japan
Prior art keywords
substrate
catalyst
aluminum
solution
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52094070A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5321045A (en
Inventor
ジ−クフリ−ト・ビルクレ
リヒアルト・デ−ツア−
エフア・リツセル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS5321045A publication Critical patent/JPS5321045A/ja
Publication of JPS6011105B2 publication Critical patent/JPS6011105B2/ja
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886Multistep pretreatment
    • C23C18/1889Multistep pretreatment with use of metal first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1803Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837Multistep pretreatment
    • C23C18/1841Multistep pretreatment with use of metal first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/208Multistep pretreatment with use of metal first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Surface Treatment Of Glass (AREA)
JP52094070A 1976-08-09 1977-08-05 アルミニウムの無電流触媒析出方法 Expired JPS6011105B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2635798.2 1976-08-09
DE2635798A DE2635798C3 (de) 1976-08-09 1976-08-09 Verfahren zum stromlosen katalytischen Abscheiden von Aluminium, Katalysierbad und Aluminierbad

Publications (2)

Publication Number Publication Date
JPS5321045A JPS5321045A (en) 1978-02-27
JPS6011105B2 true JPS6011105B2 (ja) 1985-03-23

Family

ID=5985064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52094070A Expired JPS6011105B2 (ja) 1976-08-09 1977-08-05 アルミニウムの無電流触媒析出方法

Country Status (12)

Country Link
US (1) US4144360A (enExample)
JP (1) JPS6011105B2 (enExample)
AT (1) AT361268B (enExample)
BE (1) BE857577A (enExample)
CA (1) CA1111721A (enExample)
CH (1) CH634602A5 (enExample)
DE (1) DE2635798C3 (enExample)
FR (1) FR2361473A1 (enExample)
GB (1) GB1558692A (enExample)
IT (1) IT1085404B (enExample)
NL (1) NL7708608A (enExample)
SE (1) SE444325B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3104107C2 (de) * 1981-02-06 1984-08-02 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Verfahren zum Herstellen von lötfähigen Überzügen
JPS62127746A (ja) * 1985-11-28 1987-06-10 Ricoh Co Ltd 電子写真感光体用電極
GB9021042D0 (en) * 1990-09-27 1990-11-07 Copeland Jones Anthony Coating of substrates
GB2337765A (en) * 1998-05-27 1999-12-01 Solicitor For The Affairs Of H Aluminium diffusion of copper coatings
JP6111385B2 (ja) * 2012-12-21 2017-04-12 マフレン株式会社 ガラスメッキ方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3462288A (en) * 1966-06-20 1969-08-19 Dow Chemical Co Aluminum plating process
US3563787A (en) * 1968-10-07 1971-02-16 Dow Chemical Co Aluminum plating process
US3639139A (en) * 1968-10-07 1972-02-01 Dow Chemical Co Aluminum plating process
US3537878A (en) * 1969-04-14 1970-11-03 Allied Res Prod Inc Electroless plating process
US3705051A (en) * 1970-12-10 1972-12-05 Ethyl Corp Metal plating process
US3963841A (en) * 1975-01-06 1976-06-15 International Business Machines Corporation Catalytic surface preparation for electroless plating

Also Published As

Publication number Publication date
SE7708516L (sv) 1978-02-10
DE2635798C3 (de) 1980-10-16
IT1085404B (it) 1985-05-28
AT361268B (de) 1981-02-25
FR2361473B1 (enExample) 1983-04-08
FR2361473A1 (fr) 1978-03-10
BE857577A (fr) 1977-12-01
NL7708608A (nl) 1978-02-13
CH634602A5 (de) 1983-02-15
SE444325B (sv) 1986-04-07
JPS5321045A (en) 1978-02-27
ATA543377A (de) 1980-07-15
US4144360A (en) 1979-03-13
DE2635798B2 (de) 1980-02-28
GB1558692A (en) 1980-01-09
CA1111721A (en) 1981-11-03
DE2635798A1 (de) 1978-02-16

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