JPS60106971A - ポリアミド樹脂成形品のめっき方法 - Google Patents
ポリアミド樹脂成形品のめっき方法Info
- Publication number
- JPS60106971A JPS60106971A JP58215493A JP21549383A JPS60106971A JP S60106971 A JPS60106971 A JP S60106971A JP 58215493 A JP58215493 A JP 58215493A JP 21549383 A JP21549383 A JP 21549383A JP S60106971 A JPS60106971 A JP S60106971A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- polyamide resin
- etching
- molded article
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 32
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims description 27
- 238000005530 etching Methods 0.000 claims abstract description 37
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims abstract description 14
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 claims abstract description 13
- 239000007864 aqueous solution Substances 0.000 claims description 15
- 238000011282 treatment Methods 0.000 claims description 13
- 239000002253 acid Substances 0.000 claims description 7
- 239000011260 aqueous acid Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 238000004873 anchoring Methods 0.000 abstract 2
- 238000004090 dissolution Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 23
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 22
- 239000003054 catalyst Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910000510 noble metal Inorganic materials 0.000 description 4
- 229910052882 wollastonite Inorganic materials 0.000 description 4
- 239000010456 wollastonite Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- -1 ribbon Substances 0.000 description 3
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000005374 Kerr effect Effects 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical group OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58215493A JPS60106971A (ja) | 1983-11-16 | 1983-11-16 | ポリアミド樹脂成形品のめっき方法 |
| CA000467757A CA1250543A (en) | 1983-11-16 | 1984-11-14 | Method for plating polyamide resin molded article |
| US06/671,305 US4563242A (en) | 1983-11-16 | 1984-11-14 | Method for plating polyamide resin molded article |
| DE8484113834T DE3472976D1 (en) | 1983-11-16 | 1984-11-15 | Method for plating polyamide resin molded article |
| EP84113834A EP0146767B1 (en) | 1983-11-16 | 1984-11-15 | Method for plating polyamide resin molded article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58215493A JPS60106971A (ja) | 1983-11-16 | 1983-11-16 | ポリアミド樹脂成形品のめっき方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60106971A true JPS60106971A (ja) | 1985-06-12 |
| JPS6221870B2 JPS6221870B2 (cg-RX-API-DMAC7.html) | 1987-05-14 |
Family
ID=16673294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58215493A Granted JPS60106971A (ja) | 1983-11-16 | 1983-11-16 | ポリアミド樹脂成形品のめっき方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4563242A (cg-RX-API-DMAC7.html) |
| EP (1) | EP0146767B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JPS60106971A (cg-RX-API-DMAC7.html) |
| CA (1) | CA1250543A (cg-RX-API-DMAC7.html) |
| DE (1) | DE3472976D1 (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63270475A (ja) * | 1987-04-28 | 1988-11-08 | Toyoda Gosei Co Ltd | ナイロン樹脂のメツキ前処理方法 |
| JP2015221917A (ja) * | 2014-05-22 | 2015-12-10 | 日立マクセル株式会社 | メッキ膜を有する成形体の製造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5350487A (en) * | 1993-05-03 | 1994-09-27 | Ameen Thomas J | Method of etching polyimide |
| JP4954126B2 (ja) * | 2008-03-12 | 2012-06-13 | 日立マクセル株式会社 | 樹脂成型体を含む複合材料の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57100140A (en) * | 1980-12-16 | 1982-06-22 | Mitsubishi Rayon Co Ltd | Metallizing of polyamide resin |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3235426A (en) * | 1961-08-01 | 1966-02-15 | Du Pont | Method of rendering thermoplastic resins receptive to coatings |
| US4315045A (en) * | 1978-12-19 | 1982-02-09 | Crown City Plating Co. | Conditioning of polyamides for electroless plating |
-
1983
- 1983-11-16 JP JP58215493A patent/JPS60106971A/ja active Granted
-
1984
- 1984-11-14 US US06/671,305 patent/US4563242A/en not_active Expired - Fee Related
- 1984-11-14 CA CA000467757A patent/CA1250543A/en not_active Expired
- 1984-11-15 DE DE8484113834T patent/DE3472976D1/de not_active Expired
- 1984-11-15 EP EP84113834A patent/EP0146767B1/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57100140A (en) * | 1980-12-16 | 1982-06-22 | Mitsubishi Rayon Co Ltd | Metallizing of polyamide resin |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63270475A (ja) * | 1987-04-28 | 1988-11-08 | Toyoda Gosei Co Ltd | ナイロン樹脂のメツキ前処理方法 |
| JP2015221917A (ja) * | 2014-05-22 | 2015-12-10 | 日立マクセル株式会社 | メッキ膜を有する成形体の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3472976D1 (en) | 1988-09-01 |
| US4563242A (en) | 1986-01-07 |
| EP0146767B1 (en) | 1988-07-27 |
| EP0146767A1 (en) | 1985-07-03 |
| JPS6221870B2 (cg-RX-API-DMAC7.html) | 1987-05-14 |
| CA1250543A (en) | 1989-02-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO1998045505A1 (ja) | 非導電性プラスチック成形品への電気めっき方法 | |
| US3881049A (en) | Process for depositing copper layers on shaped articles of a polyimide | |
| GB2167445A (en) | Metal plating of thermoplastic resin articles | |
| JPWO1998033959A1 (ja) | 非導電性材料への電気めっき方法 | |
| US20040132300A1 (en) | Procedure for activation of substrates for plastic galvanizing | |
| JP2000144439A (ja) | 不導体素材へのめっき処理方法とそのための無電解処理液組成物 | |
| US4315045A (en) | Conditioning of polyamides for electroless plating | |
| US4452858A (en) | Production of plated shaped product of polyamide | |
| JPS60106971A (ja) | ポリアミド樹脂成形品のめっき方法 | |
| US3725108A (en) | Chemical reduction metal plated diallylphthalate polymer and preparation process | |
| JPH0238578A (ja) | ポリフェニレンエーテル／ポリアミドアロイ樹脂成形品の表面処理方法 | |
| US4309462A (en) | Conditioning of caprolactam polymers for electroless plating | |
| JPH03223468A (ja) | ポリイミドの無電解メッキのための前処理方法 | |
| US3547785A (en) | Treatment of resin surfaces prior to non-electrolytic plating | |
| US3516848A (en) | Process and solution for sensitizing substrates for electroless plating | |
| KR100912921B1 (ko) | 내식성이 우수한 도금층과 그 형성방법 그리고 그 도금층을갖는 물품 | |
| JPS6235475B2 (cg-RX-API-DMAC7.html) | ||
| US3595761A (en) | Chemical reduction metal plated diallylphthalate polymer and preparation process | |
| JPH03270099A (ja) | 電磁波シールド層の形成方法 | |
| US3741881A (en) | Surface treatment of polyurethane for plating | |
| US5547559A (en) | Process for plating metals onto various substrates in an adherent fashion | |
| JPH02153087A (ja) | 電鋳型の製作方法 | |
| JPS633950B2 (cg-RX-API-DMAC7.html) | ||
| JPH0210226B2 (cg-RX-API-DMAC7.html) | ||
| JP2003013244A (ja) | 樹脂基材表面への無電解めっき用触媒付与方法 |