DE3472976D1 - Method for plating polyamide resin molded article - Google Patents

Method for plating polyamide resin molded article

Info

Publication number
DE3472976D1
DE3472976D1 DE8484113834T DE3472976T DE3472976D1 DE 3472976 D1 DE3472976 D1 DE 3472976D1 DE 8484113834 T DE8484113834 T DE 8484113834T DE 3472976 T DE3472976 T DE 3472976T DE 3472976 D1 DE3472976 D1 DE 3472976D1
Authority
DE
Germany
Prior art keywords
molded article
polyamide resin
resin molded
plating
plating polyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484113834T
Other languages
German (de)
English (en)
Inventor
Hideyuki Shigemitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Application granted granted Critical
Publication of DE3472976D1 publication Critical patent/DE3472976D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
DE8484113834T 1983-11-16 1984-11-15 Method for plating polyamide resin molded article Expired DE3472976D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58215493A JPS60106971A (ja) 1983-11-16 1983-11-16 ポリアミド樹脂成形品のめっき方法

Publications (1)

Publication Number Publication Date
DE3472976D1 true DE3472976D1 (en) 1988-09-01

Family

ID=16673294

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484113834T Expired DE3472976D1 (en) 1983-11-16 1984-11-15 Method for plating polyamide resin molded article

Country Status (5)

Country Link
US (1) US4563242A (cg-RX-API-DMAC7.html)
EP (1) EP0146767B1 (cg-RX-API-DMAC7.html)
JP (1) JPS60106971A (cg-RX-API-DMAC7.html)
CA (1) CA1250543A (cg-RX-API-DMAC7.html)
DE (1) DE3472976D1 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63270475A (ja) * 1987-04-28 1988-11-08 Toyoda Gosei Co Ltd ナイロン樹脂のメツキ前処理方法
US5350487A (en) * 1993-05-03 1994-09-27 Ameen Thomas J Method of etching polyimide
JP4954126B2 (ja) * 2008-03-12 2012-06-13 日立マクセル株式会社 樹脂成型体を含む複合材料の製造方法
JP6318001B2 (ja) * 2014-05-22 2018-04-25 マクセルホールディングス株式会社 メッキ膜を有する成形体の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3235426A (en) * 1961-08-01 1966-02-15 Du Pont Method of rendering thermoplastic resins receptive to coatings
US4315045A (en) * 1978-12-19 1982-02-09 Crown City Plating Co. Conditioning of polyamides for electroless plating
JPS57100140A (en) * 1980-12-16 1982-06-22 Mitsubishi Rayon Co Ltd Metallizing of polyamide resin

Also Published As

Publication number Publication date
JPS60106971A (ja) 1985-06-12
US4563242A (en) 1986-01-07
EP0146767B1 (en) 1988-07-27
EP0146767A1 (en) 1985-07-03
JPS6221870B2 (cg-RX-API-DMAC7.html) 1987-05-14
CA1250543A (en) 1989-02-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee