JPS60102780A - 磁気抵抗素子 - Google Patents
磁気抵抗素子Info
- Publication number
- JPS60102780A JPS60102780A JP58209014A JP20901483A JPS60102780A JP S60102780 A JPS60102780 A JP S60102780A JP 58209014 A JP58209014 A JP 58209014A JP 20901483 A JP20901483 A JP 20901483A JP S60102780 A JPS60102780 A JP S60102780A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- metal foil
- magnetoresistive element
- thin film
- ferromagnetic thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
Landscapes
- Hall/Mr Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58209014A JPS60102780A (ja) | 1983-11-09 | 1983-11-09 | 磁気抵抗素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58209014A JPS60102780A (ja) | 1983-11-09 | 1983-11-09 | 磁気抵抗素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60102780A true JPS60102780A (ja) | 1985-06-06 |
| JPH0478035B2 JPH0478035B2 (enExample) | 1992-12-10 |
Family
ID=16565839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58209014A Granted JPS60102780A (ja) | 1983-11-09 | 1983-11-09 | 磁気抵抗素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60102780A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4933305A (en) * | 1987-07-31 | 1990-06-12 | Nec Corporation | Process of wire bonding for semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5296877A (en) * | 1976-02-10 | 1977-08-15 | Denki Onkyo Co Ltd | Magnetic center device |
-
1983
- 1983-11-09 JP JP58209014A patent/JPS60102780A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5296877A (en) * | 1976-02-10 | 1977-08-15 | Denki Onkyo Co Ltd | Magnetic center device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4933305A (en) * | 1987-07-31 | 1990-06-12 | Nec Corporation | Process of wire bonding for semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0478035B2 (enExample) | 1992-12-10 |
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