JPS60101956A - Lead frame for semiconductor device - Google Patents

Abstract

PURPOSE:To use only one metal die for cutting and removing the end part of lead by forming an external lead located at the outer most side of frame as the dummy in place of the lead extending into the interior of resin on the occasion of forming many resin-covered regions on the lead frame and providing external leads in parallel to both sides thereof. CONSTITUTION:A plural pairs of resin-covered region 16 and external lead 17 of both side in parallel thereto which are required for a kind of semiconductor device are formed on the one lead frame. In such a structure, the external lead 18 provided at the outer most side does not employ such a shape if lead that the tie bar 20 forming the external lead is extending in the resin-covered region 19 but the shape of so-called dummy structure. Thereby, only one metal die is required for cutting and removing the remaining resin of internal wall 19 of tie bar, the tie bar 20 and end part of lead 21 in the successding manufacturing processes and the metal die can be generally used in wider application field.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in lead frames for semiconductor devices used in the manufacture of integrated circuits and the like.

Conventionally, in the external lead portion of this type of resin-sealed semiconductor lead frame, as shown in FIG. 1, the necessary number of external leads 11 for a type of semiconductor device are arranged within a resin-coated region 12 and led out to the outside. It is made by +i%. Then, in the later finishing process, a cutting mold was used for cutting and molding the outer lead, and a cutting mold was used to form the cutter necessary to cut and remove the resin leakage of the tie bar inner wall portion 13, the tie bar portion 14, and the lead tip portion 15. ] (I In order to uniformly prepare and perform the post-processes shown above for other types of lead frames, a cutting mold with a unique cutting tool that matches the other types of lead frames is required, and furthermore, the lead frame external shape Due to the different dimensions, it was necessary to adjust the cableless machine and replace parts, which required advanced technology and a large number of man-hours.

The object of the invention is to eliminate the above-mentioned drawbacks and to provide a lead frame with improved versatility.

In the lead frame of the present invention, at least one outer lead of a group of external leads arranged in one direction does not have a lead shape that extends inside the resin, but has a so-called dummy shape. .

The lead frame according to the present invention is formed such that the lead pins are connected to each other so that semiconductor devices having a plurality of different lead pins can be processed using only one mold.

According to the present invention, it is possible to obtain a lead frame for a semiconductor device having a structure in which a plurality of external leads are connected to each other in the same shape and in the same direction.

Next, the present invention will be explained in detail with reference to the drawings. FIG. 2 shows an embodiment of a lead frame according to the present invention. In the 17-de-7 frame of this embodiment, the required number of external leads 17 as a type of semiconductor device are arranged within the resin-coated region 16, and a plurality of semiconductor devices are configured outside the resin-coated region 16, that is, the internal semiconductor Only the external leads 18 that are unrelated to the connection with the pellet are arranged. By adopting such a lead frame structure, it is possible to eliminate the need for a cutting tool to cut and remove the resin leakage of the tie bar inner wall portion 19, the tie bar portion 20, and the lead tip portion 21 in the external lead processing process that is a later manufacturing process. If the constructed cutting mold is prepared so that a plurality of semiconductor devices can be manufactured, processing can be performed using only one cutting mold. In addition, when manufacturing a semiconductor device in city i, the grease-resistant exposed area 16 is widened to 0k, where the external lead 18 enters the area.

According to the adhesive method of the present invention, the external leads of a semiconductor device having the same shape and coefficient in the same direction as the external leads of a kind of semiconductor device can be connected to each other to facilitate subsequent manufacturing processes. The versatility of the cutting mold used is impressive,
Adjustment and parts reception of moving Kaburesu machine stock] f, Condyle! Understand the advantages of I being difficult and important.

Note that this invention is not limited to the embodiments described above,
Needless to say, it can be applied to lead frames of any shape.

[Brief explanation of drawings]

FIG. 1 is a plan view of a lead frame for a semiconductor device with a 9t-size resin-sealed die, and FIG. 2 is a plan view showing an embodiment of the present invention. In the figure, 11, 17.18...external lead, 12.16...resin, 13.19...
...Resin scum, 14.20・River...Tie bar, 15.
21. Old: This is the tip of the external lead. 73 12 14 Figure 1 Figure 2

Claims (1)

[Claims] 1. A lead frame for a semiconductor device, wherein at least one outer lead among a group of external leads arranged in a row in one direction does not have a lead shape extending inside a resin.