JPH0864737A - Resin-sealed semiconductor device and lead frame - Google Patents

Abstract

PURPOSE: To provide a resin-sealed semiconductor device and a lead frame with which leads can be inserted easily into the lead holes of a circuit board, the misalignment of a resin package after the lead insertion can be eliminated, the deformations of the leads which are produced when a plurality of semiconductor devices are mounted in a case and, further, the dimension of the resin package in a width direction can be reduced. CONSTITUTION: Recesses 18 are provided between the tip positions, which are the stopper parts, of the outside planes 17A of the widened parts 12 of leads at the outermost positions in a lead arrangement unit 100 and inner lead parts and a tie-bar 15 is connected between the recesses 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed semiconductor device and a lead frame, and more particularly to a resin-sealed semiconductor device having a tie bar cutting residue which is used by inserting and mounting a lead in a lead insertion hole of a circuit board. And a lead frame used in the device.

[0002]

2. Description of the Related Art When a SIP (single in-line) type resin-sealed semiconductor device, in which leads are led out from only one direction of a package, is mounted on a circuit board, it is positioned at a certain height from the surface of the circuit board. Need to let.

For this reason, the lead has a stopper portion at the tip of the wide portion connected to the narrow portion inserted into the lead insertion hole of the circuit board.

That is, when the stopper portion comes into contact with the surface of the circuit board, the resin package encapsulating the semiconductor pellets can be positioned at a predetermined height away from the surface of the circuit board. Further, the stoppers prevent the leads of the semiconductor device from biting into the lead insertion holes and causing the semiconductor device to fall while the circuit board is transported to the soldering (solder reflow) step.

Conventionally, in a SIP type semiconductor device, a lead frame as shown in FIG. 5A is used.
In the figure, the internal lead portion 11 including the island 11A
The wide portion 12 is connected to the lead portion 12E, the tip portion 12E is used as a stopper portion, and the narrow portion 13 is narrowed from both side surfaces of the stopper portion 12E and the narrow portion 13 extends in the Y direction (first direction). Are continuous in the X direction (second direction) perpendicular to the Y direction.

The ends of the narrow portions 13 are commonly connected by an outer frame 14 having a sprocket hole 16, and the wide portions 12 of adjacent leads are connected by a tie bar 15.

A semiconductor pellet is mounted on the island 11A of the lead frame, connected to the internal lead portion 11 with a metal wire, and then sealed with a sealing resin 20 as shown in FIG. 5 (B).

Then, as shown in FIG.
To separate the leads into individual ones, and further cut the narrow portion 13 of the leads from the outer frame 14 to obtain a resin-sealed semiconductor device as shown in FIG.

FIG. 7 shows how the tie bar 15 is cut.
Will be described with reference to.

A die (punch) used when cutting the tie bar
The widths (dimensions in the Y direction) of 41A and 41B are generally made wider than the widths (dimensions in the Y direction) of the tie bars 15 in order to complete the tie bar cutting.

Therefore, as shown in FIG. 7A, the lead frame bites into the wide portion 12 due to the lateral displacement between the lead frame and the mold 41A, and this bite portion 1
2R is thinly scraped, but this cutting waste 12R does not fall off from the lead, but remains attached to the lead and hangs downward in a burr state. In this state, the manufacturing process of the subsequent process is performed, and thereby There is a risk of short circuit or dent on the lead.

[0012] In order to eliminate this bite and cut,
As shown in FIG. 7 (B), the length of the mold 41B (dimension in the X direction) is set to the interval between the wide portions 12 of the adjacent leads,
That is, it is necessary to make it smaller than the length (dimension in the X direction) of the tie bar 15. For example, considering the manufacturing variation of the lead frame, the die 41B is designed so that one side has a clearance of ΔX = about 0.1 to 0.2 mm.

Although it is possible to prevent the lead from biting into the wide portion 12, the tie bar cutting residue 19 is projected from the wide portion 12 of the lead by about 0.1 to 0.2 mm.

As described above, the length of the punch has to be shorter than the lead interval, which inevitably causes a tie bar cutting residue protruding in the X direction.

[0015]

In the conventional resin-encapsulated semiconductor device, the tie bar cutting residue is projected from the outer surface of the wide portion of the lead located at the outermost part of the lead array,
Since the width (dimension in the X direction) of the resin package of the semiconductor device cannot be made shorter than the dimension of the left and right outermost leads of the tie bar remaining after cutting, there is a problem in reducing the size of the resin package of the semiconductor device in the width direction. Have a point.

That is, referring to FIG. 8, the resin package 2
When the tie bar cutting residue 19 is projected outward from the line 30 obtained by extending the X-direction side end surface 20E in the Y direction in FIG.
In the case where the semiconductor devices are horizontally aligned in the case as shown in FIG. 3, the tie bar cutting remainders 19 come into contact with each other at the position X before the resin packages 20 come into contact with each other, which causes lead deformation. This is because it will end up.

On the other hand, the width direction of the resin package (X direction)
10, the outermost lead is a wide portion 22 having an outer surface that matches the outer surface of the narrow portion 13, and the stopper portion formed by the tip portion 22E of the wide portion 22 is There is also one that secures the spacer remaining after cutting the tie bar by making it exist only on the inner surface and eliminating the stopper part on the outer surface.

However, such a one-sided stopper is hard to perform the insertion work because the lead is pushed toward the side without the stopper portion by the force when the stopper portion comes into contact with the lead hole when the lead is inserted into the lead hole of the circuit board. Become.
Also, because the lead hole only bites into one side, if you cut or bend the lead on the back side of the board after inserting the lead, the lead will be twisted due to the bending force. There is a problem that the position of the resin package of the device is also displaced.

Therefore, an object of the present invention is to facilitate the work of inserting the leads into the lead holes of the circuit board, eliminate the positional deviation of the resin package after the leads are inserted, and lead the semiconductor device when mounting a plurality of semiconductor devices on the case. It is an object of the present invention to provide a resin-encapsulated semiconductor device capable of preventing the deformation of the above and reducing the size of the resin package in the width direction, and a lead frame used for the device.

[0020]

A feature of the present invention is that a plurality of leads led out from one end surface of a resin package encapsulating a semiconductor pellet in a first direction have a second direction perpendicular to the first direction. In a resin-encapsulated semiconductor device that is arranged in a direction to form a lead array, each of the leads is a wide portion derived from an end surface of the resin package and a tip portion of the wide portion, that is, both sides of a stopper portion. An outer surface of the wide portion of the lead located at the outermost part of the lead array body and having a narrow portion narrowed inward from the surface and protruding outward in the first direction. In the resin-sealed semiconductor device, a notch is provided between the tip portion and the resin package, and the tie bar cutting residue is located inside the notch. Where the second
In the direction of, the tie bar cutting residue preferably does not project outward from the tip portion of the wide portion. Alternatively, even if the tip of the remaining tie bar is slightly projected from the tip, this is in the second direction,
The resin package may not protrude outward from both end surfaces that are perpendicular to the one end surface.

Another feature of the present invention is that the inner lead portion, the wide portion which is connected to the inner lead portion and extends in the first direction, and inward from both side surfaces of the tip portion of the wide portion. A lead body having a narrowed portion that is narrowed and extends in the first direction; and a plurality of the narrowed portions of the lead body arranged in a second direction perpendicular to the first direction. An outer frame extending in the second direction with common tips connected, and a tie bar extending in the second direction by connecting between the wide portions of the adjacent lead bodies, 1 In a lead frame in which a plurality of unit lead array bodies each including a plurality of lead bodies for forming one semiconductor device are arranged in the second direction to form an array of the plurality of lead bodies, The wide width of the lead body located at the outermost part of the array body Recesses between the tip portion of the outer surface and the inner lead portion is provided in, in the lead frame where the tie bar is connected to the recess. Here, an island for mounting a semiconductor pellet may be formed on a specific internal lead portion of the plurality of internal lead portions belonging to the unit lead array. A sprocket hole for transporting the lead frame may be formed in the outer frame.

[0022]

As described above, according to the present invention, since the notch portion and the recess portion are provided on the outer surface of the wide portion of the lead located on the outermost side of the lead array to form the tie bar connecting portion, there is a problem of lead deformation due to tie bar cutting residue. It is possible to reduce the dimension of the resin package main body in the width direction by approaching the tip end portion of the wide portion of the lead, that is, the side surface of the stopper portion, without causing the occurrence. In addition, since the narrow portion is formed from both side surfaces of the leading end portion of the wide portion of the lead toward the inside and is inserted into the lead hole of the circuit board, the stopper portion is formed on both sides from the narrow portion. Therefore, it is possible to facilitate the work of inserting the lead into the lead hole and eliminate the displacement of the resin package after the lead is inserted.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

FIG. 1 is a front view showing a lead frame of a first embodiment of the present invention.

Island 11 for mounting semiconductor pellets
The wide portion 12 is connected to the inner lead portion 11 including A and extends in the Y direction (first direction), and is narrowed inward from both side surfaces of the tip portion 12E of the wide portion 12 in the Y direction. An extending narrow portion 13 is formed.

Internal lead portion 1 including island 11A
1, a wide portion 12 and a narrow portion 13 including the tip portion 12E
Each lead body is composed of
They are arranged in the X direction (second direction) perpendicular to the direction.
That is, a total of three lead bodies forming the island 11A and the lead bodies on both sides thereof constitute a unit lead array body 100 used for one semiconductor device, and a plurality of unit lead array bodies 100 are arranged in the X direction. ing.

Further, the wide portions 12 of the adjacent lead bodies are connected to each other by a tie bar 15, while the tips of the narrow portions 13 of the respective lead bodies are commonly connected to the outer frame 14. The outer frame 14 is formed with a sprocket hole 16 used for carrying the lead frame.

The lead body, the tie bar, and the outer frame are integrally formed of an iron plate having a thickness of 0.4 mm, and are entirely plated with solder.

Further, the wide portions 12 of the lead bodies (lead bodies on both sides of the lead body in which the island is formed in this embodiment) respectively located at the outermost part of the unit lead array body 100.
Of the outer side surface (outer side surface of the unit lead array body) 17A and the inner side surface (inner side surface of the unit lead array body) 17B, a recess 18 having a depth of 0.2 to 0.3 mm in the X direction is formed in the outer side surface 17A. Is formed, and the tie bar-1
5 is connected. That is, from the outer side surface 17A of the distal end portion 12E of the wide portion which becomes the stopper portion, 0.2 to 0.
A tie bar 15 is formed and connected at a position retracted inward by 3 mm. Since the recesses of this size are minute, the lead strength does not decrease.

The semiconductor pellets 31 are mounted on the islands 11A of each unit lead array 100, and the electrodes of the semiconductor pellets and the internal lead portions 1 are connected by the metal wires 32.
After connecting 1 and 1, it is sealed with a sealing resin 20 (FIG. 2).
(A)).

After that, the tie bar 15 connecting between the wide portions 12 of the adjacent lead bodies is cut to obtain the state of FIG. 2 (B).

When cutting the tie bar 15, FIG.
As described in (B), from the root of the tie bar 15 to 0.
Since it is necessary to use a die (punch) spaced 1 to 0.2 mm, the tie bar cutting residue 19 is 0.1 to 0.1 mm from the root.
Project 0.2 mm.

However, since the concave portions 18 having a depth of 0.2 to 0.3 mm are formed on the outer side surfaces of the wide portions 12 of the lead bodies respectively positioned at the outermost portions of the unit lead array 100, the concave portions 18 are formed. The tie bar cutting residue 19 of the tie bar 15 which is connected with the bottom surface as the root does not protrude from the outer side surface 17A of the tip portion 12E of the wide portion serving as the stopper portion. Further, even if the lead frame and the mold are slightly displaced from each other in the left-right direction, the adjacent unit lead arrays 100
Even when the tie bar cutting residue 19 from one of the outermost lead bodies is larger than the other and protrudes slightly from the recess 18, the side end surface 20E in the X direction of the resin package 20 is extended in the Y direction. The tie bar cutting residue 19 does not project outward from the line 30.

FIG. 3A shows the resin-sealed semiconductor device of the first embodiment in which the narrow portion 13 of the lead body is cut from the outer frame 14 and taken out from the lead frame from the state of FIG. 2B. FIG. 3B is a front view showing a state in which this resin-sealed semiconductor device is set on a circuit board.

Three lead bodies are led out as external leads in the Y direction only from one end surface (lower side surface) of the resin package 20 to form a SIP type semiconductor device. In this semiconductor device, as described with reference to FIG. 2B, the notch 18 or the recess 18 is formed in the X direction on the outer side surfaces of the outermost outer leads, and the tie bar cutting residue 19 is cut from the bottom surface to the X side. Because of the shape protruding in the direction, the tip of the tie bar cutting residue 19 is located inside from the line 30 that extends the side end surface 20E of the resin package 20 in the X direction in the Y direction. Therefore, even when the semiconductor devices are horizontally aligned and placed in a case as shown in FIG. 9, since the side end surfaces of the resin package 20 are in contact with each other and the tie bar cutting remainders 19 are not in contact with each other, the leads (external leads) are It does not deform.

Also, both outermost leads have a shape in which the narrow portion 13 is formed by narrowing inward from both side surfaces of the tip portion 12E of the wide portion 12 as in the central lead. The stopper portions at the tip end portions are present on both sides above the narrow portion 13.

Therefore, as shown in FIG. 3B, when the narrow portion 13 of the outer lead is inserted into the lead hole 36 of the circuit board 35, a force is applied to one side in the X direction, which makes the insertion work difficult. There is no problem that the lead is twisted and the position of the resin package is displaced when only one side is inserted into the lead hole.

FIG. 4 is a front view showing a semiconductor device according to a second embodiment of the present invention. The notch (recessed portion) 18 has a tie bar cutting residue 19 and a resin package 20 between the tie bar cutting residue 19 and the tip portion 12E. The deeper portion 18A is formed, and the inner side surface 17B between the tie bar cutting residue 19 and the resin package 20 is shifted inward by that amount, and the lead interval in the portion near the resin package 20 is narrowed.

According to this embodiment, the width (dimension in the X direction) of the resin package 20 is reduced to the distance between both outer side surfaces 17A of the stopper portions (tip portions of the wide portion) 12E of the left and right outermost leads. In addition, since the distance between the outermost lead and the side end surface 20E of the resin package at the location where the outermost lead has entered the resin package 20 can be made long, the quality can be improved.

[0040]

As described above, the semiconductor device of the present invention has the stopper portions on both sides of the lead, but the outer surface of the lead located at the outermost portion recedes inward around the tie bar. Since the tie bar cutting residue can be set to be inside the stopper part, the width of the resin package can be reduced to a dimension close to the dimension between the outer surfaces of the stopper part of the outermost lead without impairing the effectiveness of the stopper. Has the effect.

[Brief description of drawings]

FIG. 1 is a front view showing a lead frame according to a first embodiment of the present invention.

2A and 2B are diagrams showing a method of manufacturing a semiconductor device using the lead frame in FIG. 1 in order of steps, in which FIG. 2A is a front view after resin sealing and FIG. 2B is a front view after tie bar cutting. It is a figure.

3A is a front view showing a resin-sealed semiconductor device according to a first embodiment of the present invention using the lead frame of FIG. 1, and FIG. 3A is a front view showing a state where the device is set on a circuit board. is there.

FIG. 4 is a front view showing a resin-sealed semiconductor device according to a second embodiment of the present invention.

FIG. 5 is a front view showing a conventional lead frame (A).
FIG. 7B is a front view showing a state after resin sealing when a semiconductor device is manufactured using the lead frame of FIGS.

FIG. 6 is a front view of the state after cutting the tie bar in the case where a semiconductor device is manufactured using the lead frame of the conventional technique of FIG. 5 (A).

FIG. 7 is a plan view showing the relationship between the position and size of a mold and a tie bar in cutting the tie bar.

FIG. 8 is a front view showing a conventional resin-sealed semiconductor device.

FIG. 9 is a front view showing a problem of a conventional resin-sealed semiconductor device.

FIG. 10 is a front view showing another conventional resin-encapsulated semiconductor device.

[Explanation of symbols]

 11 Inner lead part 11A Island 12,22 Wide part 12E, 22E Tip part (stopper part) 12R Mold biting part 13 Narrow part 14 Outer frame 15 Tie bar 16 Sprocket hole 17A Tip part (stopper part) outer surface 17B Tip Inner side surface of the part (stopper part) 18 Recessed part (notched part) 18A Deeper part of the recessed part 19 Tie bar cutting residue 20 Resin package 20E Side end surface of resin package 31 Semiconductor pellet 32 Metal wire 41A, 41B Mold (punch) 100 Unit lead Array

Claims (7)

[Claims] 1. A lead array body is formed by arranging a plurality of leads extending from one end face of a resin package encapsulating a semiconductor pellet in a first direction in a second direction perpendicular to the first direction. In the resin-sealed semiconductor device, each of the leads is narrowed inward from both side surfaces of the wide portion extending from the end surface of the resin package and the tip portion of the wide portion, and the first direction A narrow portion projecting outward, and a notch portion between the resin package and the tip end portion of the outer surface of the wide portion of the lead located at the outermost part of the lead array. And a tie bar cutting residue is located inside the cutout portion. 2. The resin-encapsulated semiconductor device according to claim 1, wherein in the second direction, the tie bar cutting residue does not project outward from a tip portion of the wide portion. 3. The resin-encapsulated semiconductor according to claim 1, wherein in the second direction, the tie bar cutting residue does not protrude outward from both end surfaces of the resin package that are perpendicular to the one end surface. apparatus. 4. The resin-encapsulated semiconductor device according to claim 1, wherein a tip end portion of the wide portion is a stopper portion that serves as positioning when the resin-encapsulated semiconductor device is attached to a substrate. 5. An inner lead portion, a wide portion connected to the inner lead portion and extending in a first direction, and narrowed inward from both side surfaces of a tip portion of the wide portion to form the first portion. A lead body having a narrow portion extending in the direction of, and a plurality of lead bodies arranged in a second direction orthogonal to the first direction, the tips of the narrow portions being commonly connected. By connecting the outer frame extending in the second direction and the wide portions of the adjacent lead bodies to each other.
A plurality of unit lead arrays for forming one semiconductor device are arranged in the second direction, and a tie bar extending in the second direction is provided. In the lead frame forming the array, a concave portion is provided between the inner lead portion and the tip portion of the outer surface of the wide portion of the lead body located at the outermost portion of the unit lead array body, A lead frame, wherein the tie bar is connected in the recess. 6. The lead frame according to claim 5, wherein an island for mounting a semiconductor pellet is formed on a specific inner lead portion among a plurality of inner lead portions belonging to the unit lead array. . 7. The lead frame according to claim 5, wherein a sprocket hole for carrying the lead frame is formed in the outer frame.