JPS5996122A - 熱硬化性エポキシ樹脂組成物 - Google Patents

熱硬化性エポキシ樹脂組成物

Info

Publication number
JPS5996122A
JPS5996122A JP20509082A JP20509082A JPS5996122A JP S5996122 A JPS5996122 A JP S5996122A JP 20509082 A JP20509082 A JP 20509082A JP 20509082 A JP20509082 A JP 20509082A JP S5996122 A JPS5996122 A JP S5996122A
Authority
JP
Japan
Prior art keywords
epoxy resin
parts
cured
resin composition
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20509082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6312489B2 (enExample
Inventor
Yoshiji Morita
好次 森田
Tsuneo Hanada
花田　恒雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Silicone Co Ltd filed Critical Toray Silicone Co Ltd
Priority to JP20509082A priority Critical patent/JPS5996122A/ja
Publication of JPS5996122A publication Critical patent/JPS5996122A/ja
Publication of JPS6312489B2 publication Critical patent/JPS6312489B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP20509082A 1982-11-22 1982-11-22 熱硬化性エポキシ樹脂組成物 Granted JPS5996122A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20509082A JPS5996122A (ja) 1982-11-22 1982-11-22 熱硬化性エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20509082A JPS5996122A (ja) 1982-11-22 1982-11-22 熱硬化性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS5996122A true JPS5996122A (ja) 1984-06-02
JPS6312489B2 JPS6312489B2 (enExample) 1988-03-19

Family

ID=16501258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20509082A Granted JPS5996122A (ja) 1982-11-22 1982-11-22 熱硬化性エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS5996122A (enExample)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6166712A (ja) * 1984-09-11 1986-04-05 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
JPS6172077A (ja) * 1984-09-14 1986-04-14 Shin Etsu Chem Co Ltd 接着促進剤
JPS62270617A (ja) * 1986-05-20 1987-11-25 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
JPS63251419A (ja) * 1987-04-08 1988-10-18 Toray Ind Inc 半導体封止用樹脂組成物
JPH02189357A (ja) * 1989-01-19 1990-07-25 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂成形材料
JPH02218736A (ja) * 1989-02-20 1990-08-31 Toray Ind Inc エポキシ系樹脂組成物
US5082891A (en) * 1988-02-29 1992-01-21 Dow Corning Toray Silicone Co., Ltd. Curable resin composition containing dispersed particles of a cured silicone rubber
EP0685508A1 (en) 1994-05-27 1995-12-06 Dow Corning Toray Silicone Company, Limited Curable resin compositions containing silica-coated microparticles of a cured organosiloxane composition
WO1996011988A1 (en) * 1994-10-14 1996-04-25 Dow Corning Toray Silicone Co., Ltd. Powder coating resin composition
JPH08239478A (ja) * 1995-01-24 1996-09-17 Wacker Chemie Gmbh オルガノシロキサン樹脂粉末、該オルガノシロキサン樹脂粉末の製造法およびオルガノポリシロキサン組成物の製造法
US6239245B1 (en) 1999-03-02 2001-05-29 Dow Corning Toray Silicone Company, Ltd. Resin additive, curable resin composition, and cured resin
US6465550B1 (en) 2000-08-08 2002-10-15 Dow Corning Corporation Silicone composition and electrically conductive, cured silicone product
EP2075280A1 (en) 2007-12-26 2009-07-01 Shin-Etsu Chemical Co., Ltd. White heat-curable silicone resin composition, optoelectric part case, and molding method
US8012381B2 (en) 2008-06-09 2011-09-06 Shin-Etsu Chemical Co., Ltd. White heat-curable silicone resin composition and optoelectronic part case
US8093345B2 (en) 2006-07-27 2012-01-10 Dow Corning Corporation Method of preparing a silicone resin
JP2012500878A (ja) * 2008-08-28 2012-01-12 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 温度安定性接着剤層の形成下での構成部材（Ｂａｕｔｅｉｌｅｎ）の接着法
US8173053B2 (en) 2008-06-09 2012-05-08 Shin-Etsu Chemical Co., Ltd. White heat-curable silicone resin composition and optoelectronic part case

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7426283B2 (ja) 2020-04-28 2024-02-01 信越化学工業株式会社 ポリエーテル／ポリシロキサン架橋ゴム球状粒子及びこれを製造する方法、並びにポリエーテル／ポリシロキサン架橋複合粒子及びこれを製造する方法
JP7706959B2 (ja) 2021-07-01 2025-07-14 信越化学工業株式会社 シリコーンゴム球状粒子用液状組成物、シリコーンゴム球状粒子およびその製造方法、およびシリコーン複合粒子およびその製造方法
JP2025027238A (ja) 2023-08-14 2025-02-27 信越化学工業株式会社 エラストマー複合粒子及びその製造方法並びにエラストマー球状粒子の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825739A (enExample) * 1971-08-09 1973-04-04
JPS5454168A (en) * 1977-10-07 1979-04-28 Hitachi Ltd Epoxy resin composition
JPS553412A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Epoxy resin composition
JPS5614556A (en) * 1979-07-13 1981-02-12 Hitachi Ltd Curing method of thermosetting resin composition
JPS5756954A (en) * 1980-09-22 1982-04-05 Hitachi Ltd Resin-sealed electronic parts
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS6228971A (ja) * 1985-07-31 1987-02-06 Nec Corp 磁気ヘツド

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825739A (enExample) * 1971-08-09 1973-04-04
JPS5454168A (en) * 1977-10-07 1979-04-28 Hitachi Ltd Epoxy resin composition
JPS553412A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Epoxy resin composition
JPS5614556A (en) * 1979-07-13 1981-02-12 Hitachi Ltd Curing method of thermosetting resin composition
JPS5756954A (en) * 1980-09-22 1982-04-05 Hitachi Ltd Resin-sealed electronic parts
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS6228971A (ja) * 1985-07-31 1987-02-06 Nec Corp 磁気ヘツド

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6166712A (ja) * 1984-09-11 1986-04-05 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
JPS6172077A (ja) * 1984-09-14 1986-04-14 Shin Etsu Chem Co Ltd 接着促進剤
JPS62270617A (ja) * 1986-05-20 1987-11-25 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
JPS63251419A (ja) * 1987-04-08 1988-10-18 Toray Ind Inc 半導体封止用樹脂組成物
US5082891A (en) * 1988-02-29 1992-01-21 Dow Corning Toray Silicone Co., Ltd. Curable resin composition containing dispersed particles of a cured silicone rubber
JPH02189357A (ja) * 1989-01-19 1990-07-25 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂成形材料
JPH02218736A (ja) * 1989-02-20 1990-08-31 Toray Ind Inc エポキシ系樹脂組成物
US5691401A (en) * 1994-05-27 1997-11-25 Dow Corning Toray Silicone Co., Ltd. Curable resin compositions containing silica-coated microparticles of a cured organosiloxane composition
EP0685508A1 (en) 1994-05-27 1995-12-06 Dow Corning Toray Silicone Company, Limited Curable resin compositions containing silica-coated microparticles of a cured organosiloxane composition
WO1996011988A1 (en) * 1994-10-14 1996-04-25 Dow Corning Toray Silicone Co., Ltd. Powder coating resin composition
US6090890A (en) * 1994-10-14 2000-07-18 Dow Corning Toray Silicone Co., Ltd. Resin composition for powder paints
JPH08239478A (ja) * 1995-01-24 1996-09-17 Wacker Chemie Gmbh オルガノシロキサン樹脂粉末、該オルガノシロキサン樹脂粉末の製造法およびオルガノポリシロキサン組成物の製造法
US6239245B1 (en) 1999-03-02 2001-05-29 Dow Corning Toray Silicone Company, Ltd. Resin additive, curable resin composition, and cured resin
US6465550B1 (en) 2000-08-08 2002-10-15 Dow Corning Corporation Silicone composition and electrically conductive, cured silicone product
US8093345B2 (en) 2006-07-27 2012-01-10 Dow Corning Corporation Method of preparing a silicone resin
US8013056B2 (en) 2007-12-26 2011-09-06 Shin-Etsu Chemical Co., Ltd. White heat-curable silicone resin composition, optoelectronic part case, and molding method
EP2075280A1 (en) 2007-12-26 2009-07-01 Shin-Etsu Chemical Co., Ltd. White heat-curable silicone resin composition, optoelectric part case, and molding method
US8012381B2 (en) 2008-06-09 2011-09-06 Shin-Etsu Chemical Co., Ltd. White heat-curable silicone resin composition and optoelectronic part case
US8173053B2 (en) 2008-06-09 2012-05-08 Shin-Etsu Chemical Co., Ltd. White heat-curable silicone resin composition and optoelectronic part case
JP2012500878A (ja) * 2008-08-28 2012-01-12 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 温度安定性接着剤層の形成下での構成部材（Ｂａｕｔｅｉｌｅｎ）の接着法
US8709201B2 (en) 2008-08-28 2014-04-29 Robert Bosch Gmbh Method for gluing components, forming a temperature-resistant adhesive layer

Also Published As

Publication number Publication date
JPS6312489B2 (enExample) 1988-03-19

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