JPS5993878A - スパツタ装置 - Google Patents

スパツタ装置

Info

Publication number
JPS5993878A
JPS5993878A JP20289982A JP20289982A JPS5993878A JP S5993878 A JPS5993878 A JP S5993878A JP 20289982 A JP20289982 A JP 20289982A JP 20289982 A JP20289982 A JP 20289982A JP S5993878 A JPS5993878 A JP S5993878A
Authority
JP
Japan
Prior art keywords
target
sputtering
holder
shaped
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20289982A
Other languages
English (en)
Japanese (ja)
Other versions
JPS626639B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Yamamoto
寛 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Priority to JP20289982A priority Critical patent/JPS5993878A/ja
Publication of JPS5993878A publication Critical patent/JPS5993878A/ja
Publication of JPS626639B2 publication Critical patent/JPS626639B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP20289982A 1982-11-20 1982-11-20 スパツタ装置 Granted JPS5993878A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20289982A JPS5993878A (ja) 1982-11-20 1982-11-20 スパツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20289982A JPS5993878A (ja) 1982-11-20 1982-11-20 スパツタ装置

Publications (2)

Publication Number Publication Date
JPS5993878A true JPS5993878A (ja) 1984-05-30
JPS626639B2 JPS626639B2 (enrdf_load_stackoverflow) 1987-02-12

Family

ID=16465037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20289982A Granted JPS5993878A (ja) 1982-11-20 1982-11-20 スパツタ装置

Country Status (1)

Country Link
JP (1) JPS5993878A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6115966A (ja) * 1984-06-30 1986-01-24 Shimadzu Corp スパツタリング装置
US5069770A (en) * 1990-07-23 1991-12-03 Eastman Kodak Company Sputtering process employing an enclosed sputtering target

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6115966A (ja) * 1984-06-30 1986-01-24 Shimadzu Corp スパツタリング装置
US5069770A (en) * 1990-07-23 1991-12-03 Eastman Kodak Company Sputtering process employing an enclosed sputtering target

Also Published As

Publication number Publication date
JPS626639B2 (enrdf_load_stackoverflow) 1987-02-12

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