JPS5989428A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

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Publication number
JPS5989428A
JPS5989428A JP58189537A JP18953783A JPS5989428A JP S5989428 A JPS5989428 A JP S5989428A JP 58189537 A JP58189537 A JP 58189537A JP 18953783 A JP18953783 A JP 18953783A JP S5989428 A JPS5989428 A JP S5989428A
Authority
JP
Japan
Prior art keywords
wire
connection terminal
external connection
capillary
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58189537A
Other languages
English (en)
Other versions
JPS6059735B2 (ja
Inventor
Naoto Kimura
直人 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP58189537A priority Critical patent/JPS6059735B2/ja
Publication of JPS5989428A publication Critical patent/JPS5989428A/ja
Publication of JPS6059735B2 publication Critical patent/JPS6059735B2/ja
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05601—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/05611—Tin [Sn] as principal constituent
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    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/7828—Resistance welding electrodes, i.e. for ohmic heating
    • H01L2224/78282—Resistance welding electrodes, i.e. for ohmic heating in the upper part of the bonding apparatus, e.g. in the capillary or wedge
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    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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    • H01L2224/852—Applying energy for connecting
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 この発明は半導体装置の製造方法にかかシ、とくに半導
体素子の電極と外部端子とのワイヤボンディング方法に
関する。
半導体装置における素子電極と端子この間を結線するた
めにワイヤーボンディング方法が広く使用されている。
かかるワイヤーボンディング方法では金ｍ１アルミ線等
をワイヤーとして用い、このワイヤーをキャビ２リーを
介して引き出し、ワイヤーの一端を素子電極に熱圧着さ
せた後、他端を外部端子に圧着させるものである。上記
キャピラリーはガラスあるいはタングステカーバイドか
ら作られたものが使用されていた。この方法で・は外部
端子との接続も圧着でなされるために、外部端子を金メ
ッキする必要があ＃）、経済的にも好まＬ７いものでは
なかった。
本発明の目的はかかる従来技術の欠点を除去した有効な
半導体装置の製造方法な提供することである。
すなわち本発明の特徴は、半導体素子の電極とワイヤー
（！：金熟熱圧着接続し、このワイヤーを外部端子に電
気溶接で接続した半導体装置の製造方法にある。又、こ
の方法に用いられるキャピラリーは、内部をセラミック
等の絶縁材によって構成し、外部をキャピラリー先端に
いたるまで導電性材料によυ構成することが好ましい〇 このような本発明の方法によれば素子側電極への接続は
従来と同様に熱圧着で行なうが、外部端子との接続はキ
ャピラリーを介して電流を供給する電気スポット溶接が
可能となり、外部端子の金メッキが不要となる。
次に本発明の一実施例を図面を用いて説明する。
第１図に示すように、本発明の実施例に用いられるキャ
ピラリーは内部が絶縁材料であるセラミック１で作られ
、外部は導電材料であるタングステン２で作られている
。これら２種材料は任意の方法で接合され、先端部分は
同一面として形成されている。
第２図′（ａ）　ｅ　（ｂ）によシこのキャピラリイを
用いたボンディング方法を示す。半導体素子４側のボン
ディングは熱圧着にて行ない、さらに第２図（ｂ）に示
すように外部端子５例のボンディングはキャピラリイの
導電材料のタングステン２に電流を流すことで金、！ｉ
１３を外部接続端子５に電気スポット溶接する。本実施
例においてキャピラリー内部にセラミック１をその材料
としたのは金線３がキャピラリー内を通るときに摩擦に
よって付着しにくくするためである。
以上の様に、この発明により半導体の内部接続を行なう
と次のような効果がある。
ベレット側ボンディングは従来通シ熱圧着で行なうが、
外部端子５側のボンディングは、電気スポット溶接で行
なうことによシ、外部接続端子５のボンディング面に金
メッキを施こす必要がなく直接スズメッキが行なえて、
このスズメッキ面に金線３を接合できる。
従りて、金メツキネ用となシコスト低減ができる。
【図面の簡単な説明】
第１図は本発明の実施例に用いるキャピラリイを示す断
面図、第２図（ａ）　、　（１，）は本発明の実施例を
示すもので第２図りはベレット側ボンディングの状態を
示す図、第２図（ｂ）は外部端子側ボンディングの状態
を示す図である。 １絶縁材料（セラミック）、２導亀材料（タングステン
）、３金線、本ベレット、ａ外部接続端子０ ・ε′・・。 代理人　弁理士　内　原　　（１，、晋・、・ｊ／ 第１図 （Ｕ７ 第２図

Claims (2)

    【特許請求の範囲】
  1. （１）半導体素子の電極とワイヤーとを熱圧着で接続し
    、該ワイヤーを外部端子に電気溶接で接続することｆ、
    特徴とする半導体装置の製造方法。
  2. （２）前記熱圧着および電気溶接の接続に用いられるキ
    ャピラリーは内部を絶縁材料、外部を導電金属で構成し
    たことを特徴とする特許請求の範囲第（１）項記載の半
    導体装置の製造方法。
JP58189537A 1983-10-11 1983-10-11 半導体装置の製造方法 Expired JPS6059735B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58189537A JPS6059735B2 (ja) 1983-10-11 1983-10-11 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58189537A JPS6059735B2 (ja) 1983-10-11 1983-10-11 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5989428A true JPS5989428A (ja) 1984-05-23
JPS6059735B2 JPS6059735B2 (ja) 1985-12-26

Family

ID=16242964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58189537A Expired JPS6059735B2 (ja) 1983-10-11 1983-10-11 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6059735B2 (ja)

Also Published As

Publication number Publication date
JPS6059735B2 (ja) 1985-12-26

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