JPS5988851A - 電子回路用炭化珪素質基板の製造方法 - Google Patents

電子回路用炭化珪素質基板の製造方法

Info

Publication number
JPS5988851A
JPS5988851A JP57197765A JP19776582A JPS5988851A JP S5988851 A JPS5988851 A JP S5988851A JP 57197765 A JP57197765 A JP 57197765A JP 19776582 A JP19776582 A JP 19776582A JP S5988851 A JPS5988851 A JP S5988851A
Authority
JP
Japan
Prior art keywords
thin plate
silicon carbide
ceramic
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57197765A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0131697B2 (enExample
Inventor
Akira Enomoto
亮 榎本
Hidetoshi Yamauchi
山内　英俊
Shoji Tanigawa
庄司 谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP57197765A priority Critical patent/JPS5988851A/ja
Publication of JPS5988851A publication Critical patent/JPS5988851A/ja
Publication of JPH0131697B2 publication Critical patent/JPH0131697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
JP57197765A 1982-11-12 1982-11-12 電子回路用炭化珪素質基板の製造方法 Granted JPS5988851A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57197765A JPS5988851A (ja) 1982-11-12 1982-11-12 電子回路用炭化珪素質基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57197765A JPS5988851A (ja) 1982-11-12 1982-11-12 電子回路用炭化珪素質基板の製造方法

Publications (2)

Publication Number Publication Date
JPS5988851A true JPS5988851A (ja) 1984-05-22
JPH0131697B2 JPH0131697B2 (enExample) 1989-06-27

Family

ID=16379975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57197765A Granted JPS5988851A (ja) 1982-11-12 1982-11-12 電子回路用炭化珪素質基板の製造方法

Country Status (1)

Country Link
JP (1) JPS5988851A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0813243A3 (en) * 1996-06-14 1998-12-02 Sumitomo Electric Industries, Ltd. Material for a semiconductor device carrier substrate and method of producing the same
WO2002036521A1 (en) * 2000-10-27 2002-05-10 Yamatake Corporation Jointing material and joining method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5594975A (en) * 1979-01-16 1980-07-18 Asahi Glass Co Ltd Low expansion powder composition for bonding use
JPS5742580A (en) * 1980-08-27 1982-03-10 Asahi Glass Co Ltd Ceramic bonding composition and bonding method therefor
JPS57117261A (en) * 1981-01-14 1982-07-21 Kyocera Corp Package for semicondutor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5594975A (en) * 1979-01-16 1980-07-18 Asahi Glass Co Ltd Low expansion powder composition for bonding use
JPS5742580A (en) * 1980-08-27 1982-03-10 Asahi Glass Co Ltd Ceramic bonding composition and bonding method therefor
JPS57117261A (en) * 1981-01-14 1982-07-21 Kyocera Corp Package for semicondutor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0813243A3 (en) * 1996-06-14 1998-12-02 Sumitomo Electric Industries, Ltd. Material for a semiconductor device carrier substrate and method of producing the same
US6183874B1 (en) 1996-06-14 2001-02-06 Sumitomo Electric Industries, Ltd. Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
US6388273B1 (en) 1996-06-14 2002-05-14 Sumitomo Electric Industries, Ltd. Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
US6534190B1 (en) 1996-06-14 2003-03-18 Sumitomo Electric Industries, Ltd. Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
WO2002036521A1 (en) * 2000-10-27 2002-05-10 Yamatake Corporation Jointing material and joining method
US7198666B2 (en) 2000-10-27 2007-04-03 Yamatake Corporation Jointing material comprising a mixture of boron oxide and aluminum oxide and method of jointing utilizing said jointing material
CN100427436C (zh) * 2000-10-27 2008-10-22 株式会社山武 一种嵌缝材料和接合方法

Also Published As

Publication number Publication date
JPH0131697B2 (enExample) 1989-06-27

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