JPS598721A - 半導体封止用液状エポキシ樹脂組成物 - Google Patents
半導体封止用液状エポキシ樹脂組成物Info
- Publication number
- JPS598721A JPS598721A JP11938082A JP11938082A JPS598721A JP S598721 A JPS598721 A JP S598721A JP 11938082 A JP11938082 A JP 11938082A JP 11938082 A JP11938082 A JP 11938082A JP S598721 A JPS598721 A JP S598721A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- liquid epoxy
- resin composition
- curing
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11938082A JPS598721A (ja) | 1982-07-07 | 1982-07-07 | 半導体封止用液状エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11938082A JPS598721A (ja) | 1982-07-07 | 1982-07-07 | 半導体封止用液状エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS598721A true JPS598721A (ja) | 1984-01-18 |
| JPS6238365B2 JPS6238365B2 (enExample) | 1987-08-18 |
Family
ID=14760074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11938082A Granted JPS598721A (ja) | 1982-07-07 | 1982-07-07 | 半導体封止用液状エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS598721A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60190418A (ja) * | 1984-03-12 | 1985-09-27 | Mitsubishi Electric Corp | 半導体封止用液状エポキシ樹脂組成物 |
| JPS612726A (ja) * | 1984-06-14 | 1986-01-08 | Sumitomo Bakelite Co Ltd | 液状エポキシ樹脂組成物 |
| US6495270B1 (en) | 1998-02-19 | 2002-12-17 | Hitachi Chemical Company, Ltd. | Compounds, hardening accelerator, resin composition, and electronic part device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54127458A (en) * | 1978-03-27 | 1979-10-03 | Sumitomo Bakelite Co Ltd | Colorless and transparent epoxy resin composition |
-
1982
- 1982-07-07 JP JP11938082A patent/JPS598721A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54127458A (en) * | 1978-03-27 | 1979-10-03 | Sumitomo Bakelite Co Ltd | Colorless and transparent epoxy resin composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60190418A (ja) * | 1984-03-12 | 1985-09-27 | Mitsubishi Electric Corp | 半導体封止用液状エポキシ樹脂組成物 |
| JPS612726A (ja) * | 1984-06-14 | 1986-01-08 | Sumitomo Bakelite Co Ltd | 液状エポキシ樹脂組成物 |
| US6495270B1 (en) | 1998-02-19 | 2002-12-17 | Hitachi Chemical Company, Ltd. | Compounds, hardening accelerator, resin composition, and electronic part device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6238365B2 (enExample) | 1987-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH06345847A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JPS598721A (ja) | 半導体封止用液状エポキシ樹脂組成物 | |
| JP3102276B2 (ja) | エポキシ樹脂組成物の製造方法及び半導体封止用エポキシ樹脂組成物 | |
| JP3080399B2 (ja) | 半導体装置およびそれに用いる半導体封止用エポキシ樹脂組成物ならびにその製法 | |
| JPS598722A (ja) | 半導体封止用液状エポキシ樹脂組成物 | |
| JPH0977958A (ja) | エポキシ樹脂組成物および半導体装置 | |
| JPH11172075A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JPH0782343A (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
| JPS60190418A (ja) | 半導体封止用液状エポキシ樹脂組成物 | |
| JPS6231735B2 (enExample) | ||
| JPH1045872A (ja) | エポキシ樹脂組成物 | |
| JPH11286594A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JPS62240312A (ja) | 封止用樹脂組成物 | |
| JP2002194064A (ja) | 半導体封止用樹脂組成物、およびそれを用いた半導体装置 | |
| JPH01188518A (ja) | エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置 | |
| JPH06239976A (ja) | エポキシ樹脂組成物および半導体封止装置 | |
| JPH1112442A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JP3417283B2 (ja) | 封止用のエポキシ樹脂組成物および半導体装置封止方法 | |
| JPS6222822A (ja) | 封止用樹脂組成物 | |
| JPH03115455A (ja) | 封止用樹脂組成物及び樹脂封止型半導体装置 | |
| JPH04328117A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JPS6317926A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JPS6333416A (ja) | 封止用樹脂組成物 | |
| JPS6289721A (ja) | 封止用樹脂組成物 | |
| JPH1112446A (ja) | 封止用樹脂組成物および半導体封止装置 |