JPS5982733A - 樹脂封止半導体装置の不要樹脂除去装置 - Google Patents

樹脂封止半導体装置の不要樹脂除去装置

Info

Publication number
JPS5982733A
JPS5982733A JP57193793A JP19379382A JPS5982733A JP S5982733 A JPS5982733 A JP S5982733A JP 57193793 A JP57193793 A JP 57193793A JP 19379382 A JP19379382 A JP 19379382A JP S5982733 A JPS5982733 A JP S5982733A
Authority
JP
Japan
Prior art keywords
lead frame
resin
stripper plate
unnecessary resin
unnecessary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57193793A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6219056B2 (enExample
Inventor
Hideji Aoki
青木　秀二
Junichi Yoshioka
吉岡　順一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57193793A priority Critical patent/JPS5982733A/ja
Publication of JPS5982733A publication Critical patent/JPS5982733A/ja
Publication of JPS6219056B2 publication Critical patent/JPS6219056B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP57193793A 1982-11-02 1982-11-02 樹脂封止半導体装置の不要樹脂除去装置 Granted JPS5982733A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57193793A JPS5982733A (ja) 1982-11-02 1982-11-02 樹脂封止半導体装置の不要樹脂除去装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57193793A JPS5982733A (ja) 1982-11-02 1982-11-02 樹脂封止半導体装置の不要樹脂除去装置

Publications (2)

Publication Number Publication Date
JPS5982733A true JPS5982733A (ja) 1984-05-12
JPS6219056B2 JPS6219056B2 (enExample) 1987-04-25

Family

ID=16313872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57193793A Granted JPS5982733A (ja) 1982-11-02 1982-11-02 樹脂封止半導体装置の不要樹脂除去装置

Country Status (1)

Country Link
JP (1) JPS5982733A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02150520A (ja) * 1988-11-30 1990-06-08 Fanuc Ltd モータ用電磁ブレーキ装置

Also Published As

Publication number Publication date
JPS6219056B2 (enExample) 1987-04-25

Similar Documents

Publication Publication Date Title
US20160181122A1 (en) Making a flat no-lead package with exposed electroplated side lead surfaces
US10739383B2 (en) Shunt strip
US20010001936A1 (en) Trimming apparatus having punches with air flow routes for removal of gate scraps
KR102057807B1 (ko) 픽 앤 플레이스 장치의 마그네틱 콜렛
JPS5982733A (ja) 樹脂封止半導体装置の不要樹脂除去装置
US5338705A (en) Pressure differential downset
JP3524982B2 (ja) 半導体モールド装置
US4109373A (en) Method for manufacturing semiconductor devices
US7211215B1 (en) Mould, encapsulating device and method of encapsulation
US3941532A (en) Apparatus for manufacturing semiconductor devices
MY100530A (en) Semiconductor device, method of manufacturing the same apparatus for carrying out the method, and assembly facility
CN116387219B (zh) 一种半导体引线框架封装转移架
JPH07335807A (ja) 電子部品の製造方法およびこれを用いたリード端子の成形装置
JP2809806B2 (ja) リードフレームの切断フォーミング装置
JP2521669B2 (ja) 半導体製造装置
KR0144313B1 (ko) 반도체 패키지의 히트싱크 도금방지용 테이프 접착장치
US5155901A (en) Integrated circuit lead frame positioner apparatus and method
KR0142941B1 (ko) 반도체 패키지의 리드포밍방법 및 그 포밍장치
JPH0351973Y2 (enExample)
JPH09134988A (ja) 半導体装置製造用金型装置
JPH1079463A (ja) 半導体装置製造用切断装置
JPH0620794B2 (ja) 電子装置の樹脂モ−ルド装置
KR100289278B1 (ko) 에프-비지에이의 싱귤레이션 금형 방법과 그 금형장치
KR0119728Y1 (ko) 테이프 부착 장치
JPH09312368A (ja) 半導体装置の製造方法およびそれに使用されるリードフレーム