JPS5981076U - Circuit board mounting structure - Google Patents
Circuit board mounting structureInfo
- Publication number
- JPS5981076U JPS5981076U JP17808182U JP17808182U JPS5981076U JP S5981076 U JPS5981076 U JP S5981076U JP 17808182 U JP17808182 U JP 17808182U JP 17808182 U JP17808182 U JP 17808182U JP S5981076 U JPS5981076 U JP S5981076U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- mounting structure
- board mounting
- plates
- splash
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の一実施例の正面図、第2図a。
bは本実施例の組立て方を示す側IS面図、第3図a、
bは本考案の第2の実施例の正面図および裏面図で
ある。図において、
1・・・・・・回路基板、2・・・・・・キャリヤの底
板、3・・・ □・・・キャリヤのばね板、4. 4
’・・・・・・導体パターン、5・・・・・・キャリヤ
の取付穴、6・・・・・・切欠部である。FIG. 1 is a front view of an embodiment of the present invention, and FIG. 2a is a front view of an embodiment of the present invention. b is a side IS view showing how to assemble this embodiment, Fig. 3a,
b is a front view and a back view of a second embodiment of the present invention. In the figure, 1... circuit board, 2... bottom plate of carrier, 3... □... spring plate of carrier, 4. 4
'... Conductor pattern, 5... Carrier mounting hole, 6... Notch.
Claims (1)
と、これら金属板と前記はね板との間に挿入され両面に
導体パターンを有する回路基板とを備え、前記回路基板
の正面導体パターンと前記はね板とをはんだ付接続する
ことによって機械的把持と接地を兼ねたことを特徴とす
る回路基板実装構造。 ゛A plurality of grounding metal plates to which finker-shaped splash plates are bonded, and a circuit board inserted between these metal plates and the splash plates and having conductor patterns on both sides, the front conductor of the circuit board A circuit board mounting structure characterized in that the pattern and the splash plate are connected by soldering to serve both mechanical gripping and grounding.゛
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17808182U JPS5981076U (en) | 1982-11-25 | 1982-11-25 | Circuit board mounting structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17808182U JPS5981076U (en) | 1982-11-25 | 1982-11-25 | Circuit board mounting structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5981076U true JPS5981076U (en) | 1984-05-31 |
Family
ID=30386727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17808182U Pending JPS5981076U (en) | 1982-11-25 | 1982-11-25 | Circuit board mounting structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5981076U (en) |
-
1982
- 1982-11-25 JP JP17808182U patent/JPS5981076U/en active Pending
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