JPS5979524A - Electrostatic chuck cassette for sample holding - Google Patents
Electrostatic chuck cassette for sample holdingInfo
- Publication number
- JPS5979524A JPS5979524A JP19010182A JP19010182A JPS5979524A JP S5979524 A JPS5979524 A JP S5979524A JP 19010182 A JP19010182 A JP 19010182A JP 19010182 A JP19010182 A JP 19010182A JP S5979524 A JPS5979524 A JP S5979524A
- Authority
- JP
- Japan
- Prior art keywords
- sample
- cassette
- electrostatic chuck
- holding
- inner frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electron Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技ヤｌＦｒ分野〕
本発明は、微細加工に供される試料を固定保持するカセ
ット装置の改良に係わり、詳しくは静電チャック機能を
備えた試料保持用静電チャックカセット装置に関する。Detailed Description of the Invention [Field of Techniques of the Invention] The present invention relates to the improvement of a cassette device for fixedly holding a sample to be subjected to microfabrication. The present invention relates to an electric chuck cassette device.
近時、半導体ウェハやマスク基板等の試料に微細パター
ンを形成するものとして、細く絞った電子ビームでパタ
ーンを描画する電子ビーム描画装置が開発されている。2. Description of the Related Art Recently, electron beam drawing apparatuses have been developed that draw patterns using a narrowly focused electron beam to form fine patterns on samples such as semiconductor wafers and mask substrates.
この装置では、第１図に示す如く試料室１内に移動自在
に設けられた試料台２上に描画すべき試料３が、に＋２
置される。そして、試料室１内を真空排気した状態で、
電子銃４から放射される電子ビームを電子光学鏡筒５で
収束・加速・偏向することによって、試料３上に所望の
ノターンが描画される。試別３は試料室１にダートバル
ブ６を介して連通された予備室７から出入れされる。こ
こで、試料３は一般に湧くで割れ易いものであシ、その
取扱いには十分な注意が必要である。このため、従来第
２図に示す如きカセット８を用い、このカセット８に試
料３を固定保持して前記４’＋（）１ｊ！ｉを行ってい
る。In this apparatus, as shown in FIG.
be placed. Then, with the inside of the sample chamber 1 evacuated,
By converging, accelerating, and deflecting the electron beam emitted from the electron gun 4 by the electron optical column 5, a desired notarne is drawn on the sample 3. The specimen 3 is taken in and taken out from a preliminary chamber 7 that communicates with the sample chamber 1 via a dart valve 6. Here, sample 3 is generally easily broken and must be handled with sufficient care. For this purpose, conventionally, a cassette 8 as shown in FIG. 2 is used, and the sample 3 is fixedly held in the cassette 8 to obtain the 4'+()1j! I am doing i.
ところで、電子ビーム描画装置を用いた微細パターン形
成技術では、半導体装置の畠舵度化及び高隼積化に伴い
描くべき・ぐターンの最小寸法が１ミクロン若しくはザ
ブミクロンと極めて小さくなり、試料の反り等による電
子ビームの焦点ずれが生じ、これが描画ＮｊＫを低下さ
せる要因となっている。このため、試料表面を平坦に保
持する必要が生じている。By the way, in fine pattern forming technology using an electron beam lithography system, the minimum dimension of the pattern to be drawn has become extremely small, 1 micron or submicron, as semiconductor devices have become more rigid and stacked, resulting in warpage of the sample. This causes a focus shift of the electron beam due to such factors, and this is a factor that lowers the writing NjK. For this reason, it is necessary to hold the sample surface flat.
試料表面を平坦に保持する手法の１例として、特公昭５
３−１８９６９号公報に記載されているように、描画前
に試料の裏面を平坦な基準面に接着剤を用いて接着する
方法がある。しかし、この方法では試料を基準面に接着
する煩雑さ、さらに描画後接着剤を剥がさなければなら
ない等のプロセスに与える負担が大きく、実際の生産現
場に採用できるものではない。１だ、別の手法として靜
′市チャックを用いて試料を平坦な面に固定保持する方
法があシ、この方法は真空中でも使用でき試別の脱着も
′極めて容易である。As an example of a method for keeping the sample surface flat,
As described in Japanese Patent No. 3-18969, there is a method of bonding the back surface of a sample to a flat reference surface using an adhesive before drawing. However, this method imposes a large burden on the process, such as the complexity of adhering the sample to the reference surface and the need to peel off the adhesive after drawing, and cannot be adopted in actual production sites. 1.Another method is to use a static chuck to securely hold the sample on a flat surface.This method can be used even in a vacuum and is extremely easy to attach and detach for testing.
このような静電チャックに関しては、例えは特開昭５５
−１４５３５１号公報、英国唱゛許第１４４３２１号、
文献としてＲ，ｗａｒｄ ；Ｄｅｖｅｌｏｐｍｅｎｔｓ
１ｎｅｌｅｃｔｒｏｎ ｉｍａｇｅ ｐｒｏｄｕｃｔ
ｉｏｎ 、 Ｊ、Ｖａｃ、ｓｃｉ。Regarding such an electrostatic chuck, for example,
-145351 Publication, British Patent No. 144321,
As a document, R, ward; Developments
1electron image product
ion, J., Vac., sci.
Ｔｅｃｈｎｏｌ １６ （６） １９７９等がある。し
かし、これらの特許は静π４、チャックの製作方法及び
使用方法について述べたものであり、また文献では静電
チャックは試料台上に固定されておシ、試料を直接試別
台上に送るか、或いは試別台を試料室外に取り出さなけ
ればならない。このため、操作性が悪く実用的でない。Technol 16 (6) 1979, etc. However, these patents describe a method for manufacturing and using an electrostatic chuck, and in the literature, the electrostatic chuck is fixed on the sample stage, and the sample is directly transferred onto the sample stage. , or the sample table must be taken out of the sample chamber. Therefore, the operability is poor and it is not practical.
このように従来、試料を固定保持して真空中の試第１台
上に搬送する静電チャック内蔵のカセット構造について
は、何ら述べられていないのである。さらに、この種の
カセットにおいては、試料の位置決めのだめの位置決め
様構、侍ト軍チャックに供給する電圧の絶縁方法等の全
てを満足する構造は未だ開発されていない。As described above, there has been no mention of a cassette structure with a built-in electrostatic chuck for holding a sample fixedly and transporting it onto the first test stand in a vacuum. Furthermore, in this type of cassette, no structure has yet been developed that satisfies all of the requirements such as the positioning mechanism for the sample positioning receptacle and the method for insulating the voltage supplied to the Samurai chuck.
本発明の目的は、電子ビーム描画装置等の慮細加工装置
に使用可能な静電チャック内蔵のカセット構造を実現し
、操作性の向上をはかり得る試料保持用静電チャックカ
セット装置を提供することにある。An object of the present invention is to provide an electrostatic chuck cassette device for holding a sample that can realize a cassette structure with a built-in electrostatic chuck that can be used in delicate processing equipment such as an electron beam drawing device, and can improve operability. It is in.
本発明の骨子は、試料を静電チャックするだめの、静電
チャック板をカセット本体内に収容保持し、この静電チ
ャック板とカセット本体とを確実に絶縁すると共に、試
料の平坦度及び設定位置を保持することにある。The gist of the present invention is to house and hold an electrostatic chuck plate in a cassette body for electrostatically chucking a sample, to reliably insulate the electrostatic chuck plate and the cassette body, and to improve the flatness and setting of the sample. It's about holding position.
すなわち本発明は、微細加工に供される試料を固定保持
し微細加工装ｆ灯の試料台上に搬送載置される試料保持
用カセット装置において、導電性基板の全面を一部端子
を除いて絶縁誘電層で被欅してなりその表面に上記試料
が載置される静１４Ｊ、チャ、り板と、との静電チャッ
ク板を収容保持するカセット本体と、このカセット本体
と上記静１１１；チャック板の裏面との間に設けられ上
記静電チャ、り板を前り己試料側に押圧する弾性部材と
、上記カセット本体の基準面に５ｆｔ脱自在に取１ｍ−
され前記試料の上面に当接して試料面の高さを規定する
押え治具と、前記カセット本体の一部に固定され前記試
料に当接して該試料の位ｉハ″を規定する位置決め部材
と、前記ｔｊＰ電チャック板を回１ｔＩｂ Ｌ前記試料
の傾きを補正する回動機構と、前記静電チャック板の導
電性基板とｍＪ記試料との間に電圧を印加する手段とを
設けるようにしたものである。That is, the present invention provides a sample holding cassette device that fixes and holds a sample to be subjected to microfabrication and is transported and placed on a sample stage of a microfabrication device f-light, in which the entire surface of a conductive substrate is partially removed except for the terminals. a cassette body that accommodates and holds an electrostatic chuck plate, which is covered with an insulating dielectric layer and on which the sample is placed; a cassette body and the static chuck plate 111; An elastic member is provided between the electrostatic chuck and the back surface of the chuck plate and presses the chuck plate toward the sample side, and a 5ft removably attached 1m-
a holding jig that contacts the top surface of the sample to define the height of the sample surface; and a positioning member that is fixed to a part of the cassette body and comes into contact with the sample to define the position of the sample. , a rotation mechanism for correcting the inclination of the sample by rotating the electrostatic chuck plate, and means for applying a voltage between the conductive substrate of the electrostatic chuck plate and the sample mJ are provided. It is something.
本発明によれば、静電チャック機能を備えたカセット４
１゛・￥造を実現しているので、試料の反りを確実に除
去した状態で微細加工等に試料を供することができ、か
つその操作性を極めて容易にすることができる。捷だ、
静電チャック板として導電性基板の略全面を絶縁誘電層
で被接した構造としているので、安全性にも優れている
。According to the present invention, the cassette 4 with an electrostatic chuck function
Since it is possible to produce 1゛/¥, it is possible to provide the sample for microfabrication, etc., with the warpage of the sample reliably removed, and its operability can be made extremely easy. It's Kade.
Since the electrostatic chuck plate has a structure in which substantially the entire surface of the conductive substrate is covered with an insulating dielectric layer, it is also excellent in safety.
さらに、弾性部材で静電チャック板の上下移動を許容し
ているので、試料の厚さ変化による試料描画面の高さ変
化を吸収することができる。Furthermore, since the elastic member allows the electrostatic chuck plate to move up and down, changes in the height of the sample drawing surface due to changes in the thickness of the sample can be absorbed.
また、位置決め部材及び回動機構を設けているので、試
料の位置ずれや傾き等を確実に補正することができる。Furthermore, since a positioning member and a rotation mechanism are provided, it is possible to reliably correct misalignment, inclination, etc. of the sample.
さらに、全体構成を小型化することができ、電子ビーム
描画装置等の微細加工装置に適用して極めて有用性が高
い等の効果が得られる。Further, the overall configuration can be miniaturized, and effects such as being extremely useful when applied to microfabrication devices such as electron beam lithography devices can be obtained.
第３図は本発明の一実施例の析（、略構成を一部切欠し
て示す平面図であり、第４図は第３図の矢視Ａ−Ａ断面
を示す図である。カセット本体１０はカセット外枠１１
と、この外枠１）内に配置される円環状のカセット内枠
１２とから構成されている。カセット内枠１２はその底
部とカセット外枠１１との間に設けられだスプリング１
３により上方向に押圧され、その一部（少なくとも３点
）がカセット外枠１１の基準面に押し付けられて固定保
持されている。カセット内枠１２の一部はビン１４を介
してカセット外枠１１の底部に回動自在に取着されてい
る。カセット内枠１２の側面とカセット外枠１１の左側
部との間にはスプリング１５が設けられ、このスプリン
グ１５によシカセット内枠１２は右方向に押圧されてい
る。寸だ、カセット外枠１１の右側部にはその先端がカ
セット内枠１２の側面に当接するｈｌ＾ｊ整用ボルト１
６が螺合されており、この日？ルト１６によりカセット
内枠１２は上記抑圧に抗して左方向に付勢されている４
、そして、ボルト１６のねじ込みによって、カセット内
枠１２は前記ビン１４を中心に回動するものとなってい
る。つまり、ビン１４．スプリング１５及びＭｌ＋１ｊ
整用ボルト１６からなる回動機構によって、カセット内
枠１２が回動され、その傾きが±ＩＸ１．０ ［ｒａ
ｄ：］の範囲で補正されるものとなっている。FIG. 3 is a partially cutaway plan view showing an analysis of an embodiment of the present invention, and FIG. 4 is a cross-sectional view taken along arrow A-A in FIG. 3. Cassette body 10 is the cassette outer frame 11
and an annular cassette inner frame 12 disposed within the outer frame 1). The cassette inner frame 12 is provided with a spring 1 between its bottom and the cassette outer frame 11.
3, and a portion (at least three points) thereof is pressed against the reference surface of the cassette outer frame 11 and held fixed. A portion of the cassette inner frame 12 is rotatably attached to the bottom of the cassette outer frame 11 via a pin 14. A spring 15 is provided between the side surface of the cassette inner frame 12 and the left side of the cassette outer frame 11, and the cassette inner frame 12 is pressed rightward by the spring 15. On the right side of the cassette outer frame 11 is a hl^j alignment bolt 1 whose tip abuts against the side of the cassette inner frame 12.
6 are screwed together, and on this day? The cassette inner frame 12 is urged to the left by the bolt 16 against the above-mentioned oppression.
By screwing in the bolts 16, the cassette inner frame 12 rotates around the bin 14. That is, bin 14. Spring 15 and Ml+1j
The cassette inner frame 12 is rotated by a rotation mechanism consisting of maintenance bolts 16, and its inclination is ±IX1.0 [ra
d: ].
一方、静電チャック板１７はＡｔやＣｕ等のｄ７電性基
板１８の全面を酸化膜等の絶縁ｄタタミ層１９でネ反＋
ｔＭ してなるもので、この前十′出゛、チャック板１
８ばその上面に試料２０を載置して前記カセット内枠１
２内に固定保持される。すなわち、静電チャック板１７
はその裏面とカセット内枠１２の底部との間に設けられ
だ板ばね（弾性部材）２１によυ上方向に押圧され、試
料２０の上面を押え治具２２に押し付けて固定保持され
ている。押え治具２２は円環状の板体からなるもので、
カセット内枠１２の上面（基準■１）に滑脱自在に取着
されている。また、カセット内枠１２の内面には、試料
２０の１＋ｌＩ ｌｉｉに当接して試料２０の位置を規
定する３個のローラ（位置決め部材）２３が設けられて
いる。寸だ、静電チャック板１７の下面中央部にはボル
ト宿からなる型締端子２４がねじ込まれており、この端
子２４はリード線２５を介してカセット外枠１ノの底部
に設けられた接点２６に接続されている。なお、図中２
７は絶縁物、２８は流孔を示している。On the other hand, the electrostatic chuck plate 17 covers the entire surface of a d7 conductive substrate 18 made of At, Cu, etc. with an insulating dtack layer 19 such as an oxide film.
tM It is made by 10 minutes ago, chuck plate 1
8. Place the sample 20 on the upper surface of the cassette inner frame 1.
It is held fixed within 2. That is, the electrostatic chuck plate 17
is pressed upward by a plate spring (elastic member) 21 provided between its back surface and the bottom of the cassette inner frame 12, and the upper surface of the sample 20 is pressed against the holding jig 22 and held fixed. . The presser jig 22 is made of an annular plate,
It is detachably attached to the upper surface of the cassette inner frame 12 (reference 1). Further, on the inner surface of the cassette inner frame 12, three rollers (positioning members) 23 are provided which contact 1+lI lii of the sample 20 and define the position of the sample 20. A mold clamping terminal 24 consisting of a bolt socket is screwed into the center of the lower surface of the electrostatic chuck plate 17, and this terminal 24 is connected to a contact point provided at the bottom of the cassette outer frame 1 via a lead wire 25. 26. In addition, 2 in the figure
7 indicates an insulator, and 28 indicates a flow hole.
このような構成であれば、前記第４図に示した状態でカ
セット本体１ｏと接点２６との間に高’［１＞’、圧（
例えば４００Ｖ ）を印加することによって、静電チャ
ック板１７の導電性基板１８と試料２０との間に上記高
電圧が印加され、試料２０は静電チャック板１７上に静
電チャックされることになる。したがって、試料２ｏを
カセット本体１θ内に固定保持した状態で試料２゜の反
りを除去することができる。With such a configuration, high pressure '[1>' and pressure (
For example, by applying 400 V), the high voltage is applied between the conductive substrate 18 of the electrostatic chuck plate 17 and the sample 20, and the sample 20 is electrostatically chucked onto the electrostatic chuck plate 17. Become. Therefore, the warp of the sample 2° can be removed while the sample 2o is fixedly held within the cassette body 1θ.
水袋ｊ１・″を’Ｆｔ（ｒ子ビーム描画装備°に使用す
る場合、まず前記押え治具２２をカセット内枠１２がら
取り外し、試料２ｏをｆ？ｐ電チャック板１７上に前記
ローラ２３に押し当てるようにして置く。When using the water bag j1. Place it so that it is pressed against it.
その後、押え治具２２をカセット内枠１２に固定し、カ
セット本体１ｏと接点２６との間に高電圧を印加して試
料２°０を静電チャック板１７上に吸着せしめる。次い
で、電圧を切りカセット本体１０を前記予備室ｚ内に収
納する。この予備室７内では、上記カセット本体１ｏと
接点２６との間に高電圧が印加されるものとなっている
。試料室１内の試料台２上には、第３図に示る如く搬送
用アーム２９を用いてカセット本体１０を送り込むが、
この間は電圧の供給が中断される。試料台２上には電極
端子３ｏが設けられており、試料台２上にカセット本体
１ｏが載置されると、電極端子３ｏと接点２６とが接触
し、接点２６とカセット本体１ｏとの間に高電圧が印加
される。このように、電圧の供給が中断しても再ひ電圧
が印加されると、試料２゜の平坦度が最初の状態になる
ことが確認された。Thereafter, the holding jig 22 is fixed to the cassette inner frame 12, and a high voltage is applied between the cassette body 1o and the contact 26 to attract the sample 2°0 onto the electrostatic chuck plate 17. Then, the voltage is turned off and the cassette body 10 is stored in the preliminary chamber z. In this preliminary chamber 7, a high voltage is applied between the cassette main body 1o and the contact 26. As shown in FIG. 3, the cassette body 10 is sent onto the sample stage 2 in the sample chamber 1 using the transport arm 29.
During this time, the voltage supply is interrupted. An electrode terminal 3o is provided on the sample stage 2, and when the cassette body 1o is placed on the sample stage 2, the electrode terminal 3o and the contact 26 come into contact, and a gap between the contact 26 and the cassette body 1o is formed. A high voltage is applied to the In this way, it was confirmed that even if the voltage supply was interrupted, when the voltage was applied again, the flatness of the sample 2° returned to the initial state.
かくして本実施例によれば、静電チャック内蔵のカセッ
ト構造を実現することができ、その操作性の向上をはか
Ｄ イ４）る。また、試料２ｏの平坦度を保持でき、か
つ試料の位渦出しを６７Ｆ実に行い得る。さらに、安全
性にも優れる等の利点があり、電子ビーム描画装置に使
用して極めて高い有用性を有するものである。Thus, according to this embodiment, a cassette structure with a built-in electrostatic chuck can be realized, and its operability can be improved. In addition, the flatness of the sample 2o can be maintained, and the sample can be vortexed at exactly 67F. Furthermore, it has advantages such as excellent safety, and has extremely high utility when used in an electron beam lithography apparatus.
なお、本発明は上述した実施例に限定されるものではな
い。例えば、前記静電チャック板を４＋１々成する導電
性基板及び絶縁誘電層の材質は側ら実施例に限定される
ものではなく、仕様に応じて適宜変更可能である。また
、静電チャック板を回動する回動機構、静電チャック板
を試別側に押圧する弾性部材の種類、さらには静電チャ
ック板からの電極取出し手段等も各ｆ！Ｉｆ変形するこ
とが可能である。また、電子ビーム露光装置に限らず、
各種の微細加工装備′に適用できるのも勿論のことであ
る。その他、本発明の要旨を逸脱しない範囲で、種々変
形して実施することができる。Note that the present invention is not limited to the embodiments described above. For example, the materials of the conductive substrate and the insulating dielectric layer that make up the 4+1 electrostatic chuck plate are not limited to those in the embodiments, but can be changed as appropriate according to specifications. In addition, the rotating mechanism for rotating the electrostatic chuck plate, the type of elastic member that presses the electrostatic chuck plate toward the sample, and the means for taking out the electrode from the electrostatic chuck plate are also different. It is possible to transform If. In addition, it is not limited to electron beam exposure equipment.
Of course, it can be applied to various types of microfabrication equipment. In addition, various modifications can be made without departing from the gist of the present invention.
第１図は電子ビーム露光装置の概略構成を示す模式図、
第２図は上記装置に使用される従来カセットを示す平面
図、第３図は本発明の一実施例に係わる試料保持用静電
チャックカセット装置６のｌｉｔ略構成を一部切欠して
示す平面図、第４図は第３図の矢視Ａ−Ａ断面を示す図
、第５図は上記実施例装置を電子ビーム露光装置に使用
した例を示す模式図である。
１０・・・カセット本体、１ノ・・・カセット外枠、１
２・・・カセット内枠、１４・・・ピン、１５・・・ス
プリング、１６・・・ｉＪ：’、！整用ボルト、１７・
・・静電チャック板、１８・・・嗜；電性基板、１９・
・・絶祿誘１１１１層、２０・・・試料、２１・・・板
ばね（弾性部材）、２２・・・押え治具、２３・・・ロ
ーラ（位置決め部材）、２４．３０・・・電極端子、２
５・・・リードに６）、２６・・・接点。FIG. 1 is a schematic diagram showing the general configuration of an electron beam exposure device.
FIG. 2 is a plan view showing a conventional cassette used in the above device, and FIG. 3 is a partially cutaway plan view showing a schematic structure of a sample holding electrostatic chuck cassette device 6 according to an embodiment of the present invention. FIG. 4 is a cross-sectional view taken along the line A--A in FIG. 3, and FIG. 5 is a schematic diagram showing an example in which the above embodiment apparatus is used in an electron beam exposure apparatus. 10...Cassette body, 1...Cassette outer frame, 1
2...Cassette inner frame, 14...pin, 15...spring, 16...iJ:',! Maintenance bolt, 17.
・・Electrostatic chuck plate, 18・・Electric substrate, 19・
... 1111 layers of Zetsukiyaku, 20... Sample, 21... Leaf spring (elastic member), 22... Holding jig, 23... Roller (positioning member), 24.30... Electrode terminal, 2
5...Lead 6), 26...Contact.
Claims (4)
微細加工装（ｉｔの試料台上に搬送載置される試料保持
用カセット装信において、導電性基板の全面を一部端子
を除いて絶縁誘電層で技棟してなりその表面に」二泥試
料が載置される静電チャック板と、この静電チャック板
を収容保持するカセット本体と、このカセット本体と上
記靜′屯チャック板の黒面との間に設けられ上記？＃電
チャック板を前記試料側に押圧する弾性部材と、上記カ
セット本体の基準面に着脱自在に取着され前記試料の上
面に当接して試料面の高さを規定する押え治具と、前記
カセット本体の一部に固定され前記試料に側方から当接
して該試料の位置を規定する付置決め部材と、前記静電
チャック板を回動し前記試料の傾きを補正する回動機＋
ｔＪｊと、前記静電チャック板の導電性基板と前記試料
との間に電圧を印加する手段とを具（＋Ｎｆ してなる
ことを特徴とする試料保持用静電チャノクカセ ッ ト
装Ｒ鳴゛ 。(1) In a sample holding cassette device that fixedly holds the sample to be subjected to copying #Ill processing and is transported and placed on the sample stage of a microfabrication device (IT), the entire surface of the conductive substrate is partially removed except for the terminals. An electrostatic chuck plate on which the second sample is placed, a cassette body that accommodates and holds this electrostatic chuck plate, and a cassette body and the above-mentioned chuck. An elastic member is provided between the black surface of the plate and presses the ? a holding jig that defines the height of the cassette; a positioning member that is fixed to a part of the cassette body and abuts the sample from the side to define the position of the sample; and a holding jig that rotates the electrostatic chuck plate. Rotator for correcting the inclination of the sample +
An electrostatic chuck cassette for holding a sample is characterized in that the electrostatic chuck cassette for holding a sample comprises: tJj and means for applying a voltage between the conductive substrate of the electrostatic chuck plate and the sample (+Nf).
袂数個の一ン或いはローラからなるものであることを特
徴とする特ＪＰ請求の睡四２１３１項記載の試ｆｌ保持
用静電チャックカセット装信。(2) The electrostatic chuck for holding a sample fl as set forth in Paragraph 42131 of Patent JP Claim, wherein the positioning member is composed of several pins or rollers that come into contact with the side surface of the sample. Cassette belief.
を保持した前記カセット本体の内枠の一部を前記カセッ
ト本体の外枠に回動自在にＭ・１定するピン、上記内枠
と外枠との間に設けられ内枠を一方向に押圧する弾性部
材、及び上記外枠に螺合され上記内枠を上記弾性部材の
抑圧に抗して付勢するねじからなるものであることを特
徴とする特許請求の範囲第１項記載の試料保持用静′６
チヤツクカセツト装置。(3) The rotation devices 14 are provided with M-1 pins that rotatably fix a part of the inner frame of the cassette body holding the A/f, electric charger, and slide plate to the outer frame of the cassette body. , an elastic member provided between the inner frame and the outer frame to press the inner frame in one direction, and a screw screwed into the outer frame to urge the inner frame against the oppression of the elastic member. The sample holding station '6 according to claim 1, characterized in that
Check cassette device.
電チャック板の導電性基板にリード端子を接続すると共
に前記試料台上に電極端子を設置し、これらリード端子
及び電極端子を接触させた状態で、上記電極端子と前記
カセット本体との間に電圧を印加するものであることを
特徴とする特許請求の範囲第１項記載の試料保持用静電
チャックカセット装置１宵。(4) The means for applying the voltage is
A lead terminal is connected to the conductive substrate of the electric chuck plate, and an electrode terminal is installed on the sample stage, and with these lead terminals and electrode terminals in contact, a voltage is applied between the electrode terminal and the cassette body. An electrostatic chuck cassette device for holding a sample according to claim 1, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57190101A JP2633516B2 (en) | 1982-10-29 | 1982-10-29 | Sample processing apparatus and sample transport method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57190101A JP2633516B2 (en) | 1982-10-29 | 1982-10-29 | Sample processing apparatus and sample transport method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5979524A true JPS5979524A (en) | 1984-05-08 |
| JP2633516B2 JP2633516B2 (en) | 1997-07-23 |
Family
ID=16252387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57190101A Expired - Lifetime JP2633516B2 (en) | 1982-10-29 | 1982-10-29 | Sample processing apparatus and sample transport method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2633516B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61181126A (en) * | 1985-02-06 | 1986-08-13 | Hitachi Ltd | Sample holder for electron beam lithography equipment |
| JPS62172149U (en) * | 1986-03-28 | 1987-10-31 | ||
| JP2007266361A (en) * | 2006-03-29 | 2007-10-11 | Nuflare Technology Inc | Grounding mechanism of substrate, and charged particle beam drawing apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3894562B2 (en) | 2003-10-01 | 2007-03-22 | キヤノン株式会社 | Substrate adsorption apparatus, exposure apparatus, and device manufacturing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54151175U (en) * | 1978-04-14 | 1979-10-20 | ||
| JPS5544355U (en) * | 1978-09-14 | 1980-03-22 | ||
| JPS5552675U (en) * | 1978-09-30 | 1980-04-08 | ||
| JPS575330A (en) * | 1980-06-11 | 1982-01-12 | Toshiba Corp | Specimen cassette for microminiature machining apparatus |
| JPS5764950A (en) * | 1980-10-08 | 1982-04-20 | Fujitsu Ltd | Electrostatically attracting device and method therefor |
| JPS58122746A (en) * | 1982-01-05 | 1983-07-21 | エテック・システムズ・インコーポレイテッド | Electrostatic cassette assembly unit |
-
1982
- 1982-10-29 JP JP57190101A patent/JP2633516B2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54151175U (en) * | 1978-04-14 | 1979-10-20 | ||
| JPS5544355U (en) * | 1978-09-14 | 1980-03-22 | ||
| JPS5552675U (en) * | 1978-09-30 | 1980-04-08 | ||
| JPS575330A (en) * | 1980-06-11 | 1982-01-12 | Toshiba Corp | Specimen cassette for microminiature machining apparatus |
| JPS5764950A (en) * | 1980-10-08 | 1982-04-20 | Fujitsu Ltd | Electrostatically attracting device and method therefor |
| JPS58122746A (en) * | 1982-01-05 | 1983-07-21 | エテック・システムズ・インコーポレイテッド | Electrostatic cassette assembly unit |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61181126A (en) * | 1985-02-06 | 1986-08-13 | Hitachi Ltd | Sample holder for electron beam lithography equipment |
| JPS62172149U (en) * | 1986-03-28 | 1987-10-31 | ||
| JP2007266361A (en) * | 2006-03-29 | 2007-10-11 | Nuflare Technology Inc | Grounding mechanism of substrate, and charged particle beam drawing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2633516B2 (en) | 1997-07-23 |
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