TWI755958B - Plating apparatus and plating method - Google Patents

Abstract

The present invention realizes a plating device capable of shielding a specific part of a substrate at a desired time, the plating device comprising: a plating tank 410 for accommodating a plating solution; an anode 430 arranged in the plating tank 410; When the surface to be plated faces downward, the substrate holder 440 for holding the substrate Wf; the rotation mechanism 447 for rotating the substrate holder 440; The shielding mechanism 460 that moves between the substrates Wf.

Description

Plating apparatus and plating method

The present application relates to a coating apparatus and a coating method.

An example of a conventional plating apparatus is a cup-type electrolytic plating apparatus. The cup-type electrolytic plating apparatus immerses a substrate (such as a semiconductor wafer) on a substrate holder with the surface to be plated facing downwards in a plating solution, and applies a voltage between the substrate and the anode to make a conductive film. Precipitate to the surface of the substrate.

Cup-type electrolytic plating apparatuses conventionally use shielding members to shield the electric field formed between the anode and the substrate. For example, Patent Document 1 discloses that, by arranging an anode mask ring between the anode and the substrate, the current density in the vicinity of the outer edge of the substrate is reduced, thereby suppressing the formation of thick plating around the outer edge of the substrate. Laminate. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2014-51697

(The problem that the invention intends to solve)

However, in the electrolytic plating apparatus of the prior art, the anode shield ring is fixed at any height of the inner wall of the coating tank, so the space between the anode and the outer edge of the substrate is always shielded by the anode shield ring. In this way, when a specific part of the substrate is always shielded, it is extremely difficult to form a plated film. Therefore, depending on the type of the substrate, it is necessary to always not shield the gap between the anode and the substrate, but only to shield a specific part of the substrate at a desired time. .

Therefore, an object of the present application is to realize a plating apparatus and a plating method that can shield a specific portion of a substrate at a desired time. (means to solve the problem)

An embodiment discloses a plating apparatus, comprising: a plating tank for accommodating a plating solution; an anode disposed in the plating tank; and a substrate holder for orienting the surface to be plated downward In this state, it is used to hold the substrate; the rotating mechanism is used to rotate the substrate holder, and the shielding mechanism is used to move the shielding member between the anode and the substrate according to the rotation angle of the substrate holder.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding elements are denoted by the same symbols, and repeated descriptions are omitted. <The overall structure of the coating device>

FIG. 1 is a perspective view showing the overall configuration of the coating apparatus of the present embodiment. FIG. 2 is a plan view showing the overall configuration of the coating apparatus of the present embodiment. As shown in FIGS. 1 and 2 , the plating apparatus 1000 includes a loading port 100 , a transfer robot 110 , an aligner 120 , a pre-wetting module 200 , a pre-preg module 300 , a plating module 400 , a cleaning module 500 , The spin-rinsing dryer 600 , the conveying device 700 , and the control module 800 .

The loading port 100 is a module for carrying substrates accommodated in cassettes such as FOUPs (front opening pods), not shown, into the plating apparatus 1000 , or a module for unloading substrates from the plating apparatus 1000 to the cassettes. In this embodiment, four load ports 100 are arranged in parallel in the horizontal direction, but the number and arrangement of the load ports 100 are not limited. The transfer robot 110 is a robot for transferring substrates, and is configured to transfer substrates between the load port 100 , the aligner 120 , and the transfer device 700 . When the transfer robot 110 and the transfer device 700 transfer substrates between the transfer robot 110 and the transfer device 700 , the transfer of the substrates can be performed via a temporary stage (not shown).

The aligner 120 is a module for aligning the positions of the orientation planes and grooves of the substrate in a specified direction. In this embodiment, two aligners 120 are arranged in parallel in the horizontal direction, but the number and arrangement of the aligners 120 are not limited. The pre-wetting module 200 replaces the air inside the pattern formed on the substrate surface with the treatment liquid by wetting the plated surface of the substrate before the plating treatment with a treatment liquid such as pure water or degassed water. The pre-wet module 200 is configured to perform a pre-wet treatment that facilitates supply of the plating solution inside the pattern by replacing the treatment solution inside the pattern with a plating solution during plating. In this embodiment, two pre-wetting modules 200 are arranged in parallel in the up-down direction, but the number and arrangement of the pre-wetting modules 200 are not limited.

The prepreg module 300 is etched with a treatment solution such as sulfuric acid and hydrochloric acid to remove, for example, the oxide film with high resistance existing on the surface of the seed layer on the plated surface of the substrate before the plating treatment, and cleaning or activation of the surface of the plated substrate is performed. The prepreg treatment method is constituted. In this embodiment, two prepreg modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the prepreg modules 300 are not limited. The plating module 400 performs a plating process on the substrate. In the present embodiment, there are two sets of plating modules 400 in which three are arranged in parallel in the vertical direction and 12 out of four are arranged in parallel in the horizontal direction, and a total of 24 plating modules 400 are provided. The quantity and configuration are not limited.

The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove the plating solution and the like remaining on the substrate after the plating process. In this embodiment, two cleaning modules 500 are arranged side by side in the up-down direction, but the number and arrangement of the cleaning modules 500 are not limited. The spin-rinsing dryer 600 is a module for rotating and drying the substrate after the cleaning process at a high speed. In this embodiment, two spin-rinsing-dryers are arranged side by side in the vertical direction, but the number and arrangement of the spin-rinsing-dryers are not limited. The conveying apparatus 700 is an apparatus for conveying a substrate between a plurality of modules in the plating apparatus 1000 . The control module 800 is configured to control a plurality of modules of the coating apparatus 1000, and may be configured by, for example, a general computer or a dedicated computer having an input/output interface with the operator.

An example of a serial plating process by the plating apparatus 1000 will be described below. First, the substrates accommodated in the cassette are carried into the loading port 100 . Continuing, the transfer robot 110 takes out the substrate from the cassette of the loading port 100 and transfers the substrate to the aligner 120 . The aligner 120 aligns the positions of the orientation planes, grooves, etc. of the substrate in a specified direction. The transfer robot 110 sends the substrate whose direction is aligned by the aligner 120 to the transfer device 700 .

The transfer device 700 transfers the substrate received from the transfer robot 110 to the pre-wetting module 200 . The pre-wetting module 200 performs pre-wetting treatment on the substrate. The conveying device 700 conveys the pre-wetted substrate to the prepreg module 300 . The prepreg module 300 performs prepreg processing on the substrate. The conveying device 700 conveys the prepreg-treated substrate to the plating module 400 . The plating module 400 performs plating processing on the substrate.

The transfer device 700 transfers the substrate after the plating process to the cleaning module 500 . The cleaning module 500 performs cleaning processing on the substrate. The transfer device 700 transfers the substrate after the cleaning process to the spin rinse dryer 600 . The spin rinse dryer 600 performs drying processing on the substrate. The transfer device 700 sends the substrate after the drying process to the transfer robot 110 . The transfer robot 110 transfers the substrates received from the transfer device 700 to the cassettes of the loading port 100 . Finally, the cassette in which the substrates are accommodated is carried out from the load port 100 . <Constitution of the coating module>

Next, the structure of the plating module 400 will be described. The 24 plating modules 400 in the present embodiment have the same configuration, so only one plating module 400 will be described. FIG. 3 is a longitudinal sectional view schematically showing the structure of a coating module according to an embodiment, and shows a state in which the shielding member is retracted. As shown in FIG. 3 , the plating module 400 includes a plating tank 410 for accommodating a plating solution. The plating module 400 includes a diaphragm 420 that separates the inside of the plating tank 410 in the up-down direction. The inside of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by a membrane 420 .

The cathode region 422 and the anode region 424 are respectively filled with a plating solution. The plating module 400 includes: a nozzle 426 opened toward the cathode region 422 ; and a supply source 428 for supplying the plating solution to the cathode region 422 through the nozzle 426 . The plating module 400 is also provided with a mechanism for supplying a plating solution to the anode region 424 in the same manner as in the anode region 424, but the illustration is omitted. An anode 430 is provided on the bottom surface of the plating tank 410 in the anode region 424 . In the cathode region 422 , the resistor 450 is arranged to face the separator 420 . The resistor body 450 is a member for achieving uniform plating treatment on the plated surface Wf-a of the substrate Wf, and is constituted by a plate-shaped member having many holes formed therein.

Moreover, the plating module 400 is provided with the board|substrate holder 440 for holding the board|substrate Wf in the state which faced the to-be-plated surface Wf-a downward. The substrate holder 440 is provided with a feeding contact for feeding power to the substrate Wf from a power source (not shown). The substrate holder 440 includes: a seal ring holder 442 for supporting the outer edge portion of the plated surface Wf-a of the substrate Wf; frame 446. Further, the substrate holder 440 includes: a back plate 444 for pressing the back surface of the plated surface Wf-a of the substrate Wf;

The plating module 400 is provided with: an elevating mechanism 443 for raising and lowering the substrate holder 440; A rotating mechanism 447 for rotating the substrate holder 440 in a way of rotating around. The elevating mechanism 443 and the rotating mechanism 447 can be realized by, for example, a known mechanism such as a motor. The plating module 400 uses the lifting mechanism 443 to immerse the substrate Wf in the plating solution of the cathode region 422, and applies a voltage between the anode 430 and the substrate Wf to apply the plating on the surface Wf-a of the substrate Wf The method of plating treatment is constituted.

The plating module 400 includes a shielding member 482 for shielding the electric field formed between the anode 430 and the substrate Wf when disposed between the anode 430 and the substrate Wf. The shielding member 482 may be, for example, a shielding plate formed in a plate shape. The shielding member 482 penetrates the side wall of the plating tank 410 and is inserted into the cathode region 422 , and a flange 484 is installed at the end on the side where the plating tank 410 is not inserted. The shielding member 482 of the present embodiment is not always arranged between the anode 430 and the substrate Wf, but is configured to shield a specific portion of the substrate Wf at a desired timing. Hereinafter, this point will be described.

FIG. 4 is a plan view schematically showing the structure of a coating module according to an embodiment, and shows a state in which the shielding member is retracted. As shown in FIGS. 3 and 4 , the plating module 400 includes a shielding mechanism 460 that moves the shielding member 482 between the anode 430 and the substrate Wf according to the angle at which the substrate holder 440 is rotated by the rotating mechanism 447 . The shielding mechanism 460 includes a cam member 461 attached to the substrate holder 440 . The cam member 461 includes a circular plate cam 462 mounted on the seal ring holder 442 . The shielding mechanism 460 includes a follower 470 that presses the shielding member 482 between the anode 430 and the substrate Wf according to the protrusion 462 a of the pressing cam member 461 (disc cam 462 ).

The follower 470 includes a follower 473 that is pressed by the protrusion 462 a of the disc cam 462 and moves in a direction away from the substrate holder 440 . A base 472 is attached to the outer wall of the upper part of the coating tank 410 , and the follower 473 is supported by the base 472 that can move back and forth in the radial direction with the shaft 448 as the center. The follower 473 is a rod-shaped member extending in a radial direction with the shaft 448 as the center. A first roll 471 that rotates around an axis parallel to the axis of rotation of the shaft 448 is attached to one end of the follower 473 . A second roller 475 is attached to the other end of the follower 473 to be rotatable around an axis perpendicular to both the direction of the rotation axis of the shaft 448 and the radial direction with the shaft 448 as the center.

The follower joint 470 is provided with a link 474 that rotates according to the pressing force from the follower 473 and presses the shielding member 482 between the anode 430 and the substrate Wf. The link 474 is a rod-shaped member, and is supported by a base 472 rotatable around a rotation shaft 476 provided on the base 472 . The rotation axis 476 is a rotation axis parallel to the rotation axis of the second roll 475 . The link 474 is supported by the base 472 so that one side of the rotation shaft 476 of the link 474 can be brought into contact with the second roll 475 . A third roll 478 rotatable around an axis parallel to the rotation axis of the second roll 475 is attached to the other end of the rotation shaft 476 sandwiching the link 474 therebetween. The link 474 is supported by the base 472 in such a manner that the third roller 478 can contact the flange 484 of the shielding member 482 .

The driven joint 470 includes a pressing member 479 that pushes the shielding member 482 back in a direction away from between the anode 430 and the substrate Wf when the shielding member 482 is not pressed by the link 474 . The pressing member 479 is, for example, a compression coil spring whose one end is attached to the outer wall of the plating tank 410 and the other end is attached to the flange 484 of the shielding member 482, but is not limited to this.

Next, the operation of the shielding member 482 by the shielding mechanism 460 will be described. As shown in FIGS. 3 and 4 , when the protrusions 462 a of the disc cam 462 are not pressing the first roll 471 , the flange 484 is pressed in a direction away from the coating tank 410 by the force of the pressing member 479 . Thereby, the shielding member 482 is moved to a position retracted from between the anode 430 and the substrate Wf. In addition, when the flange 484 is pressed in a direction away from the coating tank 410, the link 474 is rotated in the counterclockwise direction by the flange 484 pressing the third roller 478. Then, one side of the link 474 sandwiching the rotating shaft 476 pushes the second roller 475 toward the center of the shaft 448 . Thereby, the follower 473 moves toward the center of the shaft 448 .

FIG. 5 is a longitudinal sectional view schematically showing the structure of a coating module according to an embodiment, and shows a state in which the shielding member is moved between the anode and the substrate. FIG. 6 is a plan view schematically showing the structure of a coating module according to an embodiment, and shows a state in which the shielding member is moved between the anode and the substrate. As shown in FIG. 5 and FIG. 6 , when the substrate holder 440 rotates within the range of a predetermined rotation angle, the protrusion 462a of the disc cam 462 pushes the first roller 471, whereby the first roller 471 is driven from the shaft. The center of 448 moves away from it. At the same time, the follower 473 moves in a direction away from the center of the shaft 448 , and the second roller 475 pushes one side of the link 474 that sandwiches the rotating shaft 476 . As a result, the link 474 rotates in the clockwise direction, and the third roller 478 pushes the flange 484 in a direction close to the coating tank 410 against the force of the pressing member 479 . As a result, the shielding member 482 is pressed between the anode 430 and the substrate Wf. When the substrate holder 440 is rotated beyond the range of the predetermined rotation angle, the shielding member 482 is moved to a position retracted from between the anode 430 and the substrate Wf as described with reference to FIGS. 3 and 4 .

Next, the relationship between the non-patterned area of the substrate and the shielding member will be described. FIG. 7 is a top view showing the relationship between the non-patterned area of the substrate and the shielding member. FIG. 7A is a top view showing the pattern area and the non-pattern area of the substrate. FIG. 7B is a top view showing the area of the substrate covered by the shielding member. 7A is a view of the state where the substrate holder 440 is within a specified rotation angle range as shown in FIGS. 5 and 6 when viewed from the plated surface Wf-a side of the substrate Wf, and the shielding member 482 is omitted. 7B is a view showing a state in which the shielding member 482 is pressed between the anode 430 and the substrate Wf as shown in FIGS. 5 and 6 from the side of the plated surface Wf-a of the substrate Wf.

As shown in FIG. 7A, the substrate Wf has grooves Wf-n (notches). The substrate Wf is provided on the substrate holder 440 in such a manner that the groove Wf-n and the protrusion 462a of the circular plate cam 462 have the same rotation angle. In addition, the plated surface Wf-a of the substrate Wf has: a pattern area Wf-b in which a pattern such as a circuit is formed; and a non-pattern area Wf-c in which a pattern such as a circuit is not formed around the groove Wf-n. As shown in FIG. 7B , the shielding mechanism 460 is formed by pressing the shielding member 482 between the anode 430 and the groove Wf-n of the substrate Wf when the groove Wf-n of the substrate Wf rotates within a specified angle range. . The shielding member 482 covers the grooves Wf-n and the non-patterned regions Wf-c around the grooves Wf-n when the shielding mechanism 460 is pressed between the anode 430 and the grooves Wf-n of the substrate Wf constitute. In addition, in this embodiment, the specific part of the substrate Wf is described by taking the groove Wf-n or the non-pattern region Wf-c as an example, but the specific part of the substrate Wf is not limited to these. In addition, in this embodiment, the specific area around the groove Wf-n is described by taking the non-pattern area Wf-c as an example, but the specific area around the groove Wf-n is not limited to this.

According to the present embodiment, instead of arranging the shielding member 482 between the anode 430 and the substrate Wf at all times, the shielding mechanism 460 is provided which moves the shielding member 482 between the anode 430 and the substrate Wf according to the rotation angle of the substrate holder 440 . . Therefore, a specific portion of the substrate Wf to be covered by the shielding member 482 can be shielded at a desired time. For example, when a specific part of the substrate Wf is the non-patterned area Wf-c around the groove Wf-n, the groove Wf-n and the non-patterned area Wf-c around the groove Wf-n can be shielded at a desired time. The non-patterned region Wf-c is different from the patterned region Wf-b because the substrate Wf is exposed and the electric field is concentrated in the non-patterned region Wf-c, resulting in uneven thickness of the coating film in the patterned region Wf-b. In addition, in this embodiment, since the non-pattern region Wf-c can be covered with the shielding member 482 at a desired time, the concentration of the electric field on the non-pattern region Wf-c can be appropriately suppressed, and as a result, the plated film of the pattern region Wf-b can be Thickness uniformity. In addition, the present embodiment shows an example of covering the grooves Wf-n and the non-patterned regions around the grooves Wf-n by the shielding member 482, but it is not limited to this, and a specific portion of the substrate Wf may be covered at a desired time. .

In addition, the present embodiment shows an example in which one projection 462a of the disc cam 462 is provided, but it is not limited to this. A plurality of projections 462a of the disc cams 462 are provided in the arrangement of a specific portion of the Wf. In addition, although the present embodiment shows that one shielding mechanism 460 is provided, it is not limited to this, and a plurality of shielding mechanisms 460 may be provided along the circumferential direction of the coating tank 410 . Thereby, when the specific part of the substrate Wf is within a plurality of different predetermined rotation angle ranges, the specific part of the substrate Wf can be covered by the shielding member 482 . For example, the number and arrangement angle of the shielding mechanisms 460 may be adjusted so that the thickness of the plating film in the pattern region Wf-b becomes uniform.

Fig. 8 is a plan view showing the structure of a disc cam according to an embodiment. The above-described embodiment shows an example in which the disc cam 462 is formed integrally, but it is not limited to this. As shown in FIG. 8 , the disc cam 462 may also include: a body member 463 mounted on the substrate holder 440 (seal ring holder 442 ); and a protruding member 464 detachably mounted on the body member 463 . As shown in FIG. 8 , the protruding member 464 includes: a first protruding member 464-1; and a second protruding member 464-2 having a shape different from that of the first protruding member 464-1. According to the embodiment of FIG. 8, the protruding member 464 can be replaced for different types of substrates. Since the protrusion sizes of the first protrusion member 464-1 and the second protrusion member 464-2 are different, the amount of movement of the shielding member 482 between the anode 430 and the substrate Wf can be made different. Therefore, for example, when the size of a specific part of the substrate Wf is different, it is not necessary to replace the shielding mechanism 460 or replace the entire disc cam 462, only the protruding member 464 needs to be replaced.

Next, the plating method using the plating module 400 of the present embodiment will be described. FIG. 9 is a flow chart of a coating method using the coating module of one embodiment. In addition, the following plating method is started without attaching the protrusion member 464 to the main body member 463 of the disk cam 462.

In the plating method of the present embodiment, first, among a plurality of protruding members (for example, the first protruding member 464-1 and the second protruding member 464-2) having the disc cams 462 of different protruding sizes, are selected and held at the The protruding member corresponding to the type of the substrate Wf of the substrate holder 440 is attached to the main body member 463 of the disc cam 462 (step 101 ). At this time, the first protruding member 464 - 1 is attached to the main body member 463 . Continuing, the plating method places the substrate Wf on the substrate holder 440 (step 102). Step 102 can be performed by, for example, setting the substrate Wf with the plated surface Wf-a facing downward on the seal ring holder 442 by a robot (not shown), and pressing the back surface of the substrate Wf by the back plate 444 .

Continuing, the plating method lowers the substrate holder 440 into the plating tank 410 by means of the lifting mechanism 443 (lowering step 103 ). Continuing, the plating method rotates the substrate holder 440 by the rotation mechanism 447 (rotation step 104).

The plating method moves the shielding member 482 between the anode 430 and the substrate Wf according to the rotation angle of the substrate holder 440 in the rotating step 104 (shielding step 105 ). Masking step 105 may be performed by masking mechanism 460 . Details of the masking step 105 will be described later. Continuing, the plating method continues to perform the spinning step 104 and the masking step 105, and by applying a voltage between the anode 430 disposed in the plating bath 410 and the substrate Wf held in the substrate holder 440, the plated surface Wf is -a Carry out a plating process (plating step 106 ).

Continuing, the plating method determines whether the plating process should be terminated (step 107 ). In the plating method, for example, when it is determined that the plating treatment should not be terminated (step 107 , No), the process returns to the rotation step 106 and continues the process, because the predetermined time has not elapsed from the start of the plating treatment.

In addition, in the plating method, for example, when the plating process is started and the predetermined time elapses and it is determined that the plating process should be terminated (step 107 , Yes), the rotation of the substrate holder 440 by the rotation mechanism 447 is stopped (step 108 ). Continuing, in the plating method, the substrate holder 440 is raised by the elevating mechanism 443 (step 109 ), and the plating process is ended.

Next, the details of the masking step 105 will be described. FIG. 10 is a flowchart of a masking step in a coating method using a coating module of an embodiment. In the masking step 105, when the substrate holder 440 is within a specified rotation angle range, specifically, when the groove Wf-n of the substrate Wf is rotated within the specified angle range, the circular plate cam 462 installed on the substrate holder 440 is used The first protruding member 464-1 of the 100 , moves the follower 473 in a direction away from the substrate holder 440 (step 105-1).

Continuing, the shielding step 105 rotates the connecting rod 474 according to the push from the follower 473, and squeezes between the anode 430 and the substrate Wf, specifically, between the anode 430 and the groove Wf-n of the substrate Wf Shield member 482 (step 105-2). Thereby, the grooves Wf-n and the non-pattern regions Wf-c around the grooves Wf-n are covered by the shielding member 482 . Continuing, in the shielding step 105, when the shielding member 482 is not pressed between the anode 430 and the substrate Wf, that is, when the substrate holder 440 rotates outside the specified rotation angle range, the shielding member 482 is pushed by the pressing member 479. Push back from the direction away from between the anode 430 and the substrate Wf (step 105 - 3 ). In the masking step 105, while the substrate holder 440 is rotated by the rotation mechanism 447, the steps 105-1 to 105-3 are repeatedly performed.

According to the plating method of the present embodiment, the shielding member 482 is not always disposed between the anode 430 and the substrate Wf, but the shielding member 482 is arranged between the anode 430 and the substrate according to the rotation angle of the substrate holder 440 in the shielding step 105. Move between Wf. Therefore, a specific portion of the substrate Wf to be covered by the shielding member 482 can be shielded at a desired time.

Although some embodiments of the present invention have been described above, the embodiments of the present invention described above are for the purpose of facilitating the understanding of the present invention and are not intended to limit the present invention. The present invention can be changed and improved without departing from the scope of the gist, and it is needless to say that the equivalents thereof are included in the present invention. In addition, within the scope of at least a part of solving the above problems, or the scope of achieving at least a part of the effect, the various elements described in the scope of the patent application and the specification can be arbitrarily combined or omitted.

An embodiment of the present application discloses a coating apparatus, which includes: a coating tank, which is used to accommodate a plating solution; an anode, which is arranged in the coating tank; and a substrate holder, which is fastened to be The plated surface is used to hold the substrate when the plated surface is facing downward; the rotating mechanism is used to rotate the substrate holder, and the shielding mechanism is based on the rotation angle of the substrate holder, so that the shielding member is used for the anode and the substrate. move between.

Further, an embodiment of the present application discloses a coating device, wherein the shielding mechanism comprises: a cam member, which is mounted on the substrate holder; and a follower, which is pressed by the protrusion of the cam member, The shielding member is pressed between the anode and the substrate.

Further, an embodiment of the present application discloses a coating device, wherein the cam member has a plurality of protrusions, and the driven link is pressed between the anode and the substrate every time it is pressed by the plurality of protrusions It is constituted by pressing the above-mentioned shielding member.

Further, an embodiment of the present application discloses a coating device, wherein the cam member includes a circular plate cam, and the driven joint includes: a follower that is pushed by the protrusion of the circular plate cam, and is pushed from the above-mentioned circular plate cam. The substrate holder moves in the direction away from; the connecting rod rotates according to the pressing force from the follower, and presses the shielding member between the anode and the substrate; and a pressing member is the shielding member When not being pressed by the link, the shielding member is pushed back in a direction away from between the anode and the substrate.

Further, an embodiment of the present application discloses a coating apparatus, wherein the circular plate cam includes: a body member mounted on the substrate holder; and a protruding member detachably mounted on the body member.

Further, an embodiment of the present application discloses a coating device, wherein the shielding mechanism is configured to press the shielding between the anode and the specific portion of the substrate when the specific portion of the substrate rotates within a specified angle range the way components are constructed.

Further, an embodiment of the present application discloses a coating device, wherein the specific portion is a groove of the substrate, and the shielding member is pressed between the anode and the groove of the substrate by the shielding mechanism At the same time, it is formed by covering the groove of the substrate and a specific area around the groove of the substrate.

Further, an embodiment of the present application discloses a plating apparatus, wherein a specific area around the groove of the substrate includes an area around the groove of the substrate that is not patterned.

Further, an embodiment of the present application discloses a coating apparatus, wherein a plurality of the shielding mechanisms are provided along the circumferential direction of the coating tank.

Further, an embodiment of the present application discloses a plating method, which includes: a lowering step, in which the substrate holder for holding the substrate is lowered into the plating tank when the surface to be plated faces downward; the rotating step, The above-mentioned substrate holder is rotated; the shielding step is performed by moving the shielding member between the above-mentioned anode and the above-mentioned substrate according to the rotation angle of the above-mentioned substrate holder during the above-mentioned rotating step; and the plating step is performed by A voltage is applied between the anode arranged in the plating tank and the substrate held by the substrate holder, and the plating treatment is performed on the plating surface.

Further, an embodiment of the present application discloses a plating method, wherein the masking step includes the following steps: by means of the protrusions of the circular plate cam installed on the substrate holder, the follower is moved away from the substrate holder in a position away from the substrate holder. moving in the direction; and according to the push from the follower, the connecting rod rotates, and the shielding member is pressed between the anode and the base plate.

Further, an embodiment of the present application discloses a plating method, wherein the shielding step further comprises: when the shielding member is not pressed between the anode and the substrate, in a direction away from the anode and the substrate Push back the previous step of the shielding member.

Further, an embodiment of the present application discloses a plating method, further comprising selecting a protruding member corresponding to the type of substrate held in the substrate holder from a plurality of protruding members of the circular plate cam having different protruding sizes, The step of installing the body member of the aforementioned circular plate cam.

100: Load port 110: Transfer Robot 120: Aligner 200: Pre-wet module 300: Prepreg module 400: Plating module 410: Plating tank 420: Diaphragm 422: Cathode area 424: Anode area 426: Nozzle 428: Supply Source 430: Anode 440: Substrate holder 442: Seal Ring Retainer 443: Lifting mechanism 444: Back Panel 446: Frame 447: Rotary Mechanism 448: Shaft 450: Resistor body 460: Shading Mechanism 461: Cam member 462: Disc Cam 462a: Protrusion 463: Body Components 464: Protruding member 464-1: First protruding member 464-2: Second protruding member 470: Driven Festival 471: First Roll 472: Pedestal 473: Follower 474: Connecting rod 475: Second Roll 476: Rotary axis 478: Third Roll 479: Push member 482: Shading member 484: Flange 500: Cleaning Module 600: Spin Rinse Dryer 700: Conveyor 800: Control Module 1000: Coating device Wf: substrate Wf-n: Groove Wf-b: Pattern area Wf-c: non-patterned area

FIG. 1 is a perspective view showing the overall configuration of the coating apparatus of the present embodiment. FIG. 2 is a plan view showing the overall configuration of the coating apparatus of the present embodiment. FIG. 3 is a longitudinal sectional view schematically showing the structure of a coating module according to an embodiment, and shows a state in which the shielding member is retracted. FIG. 4 is a plan view schematically showing the structure of a coating module according to an embodiment, and shows a state in which the shielding member is retracted. FIG. 5 is a longitudinal sectional view schematically showing the structure of a coating module according to an embodiment, and shows a state in which the shielding member is moved between the anode and the substrate. FIG. 6 is a plan view schematically showing the structure of a coating module according to an embodiment, and shows a state in which the shielding member is moved between the anode and the substrate. FIG. 7A is a top view showing the pattern area and the non-pattern area of the substrate. FIG. 7B is a top view showing the area of the substrate covered by the shielding member. Fig. 8 is a plan view showing the structure of a disc cam according to an embodiment. FIG. 9 is a flow chart of a coating method using the coating module of one embodiment. FIG. 10 is a flowchart of a masking step in a coating method using a coating module of an embodiment.

410: Plating tank

420: Diaphragm

422: Cathode area

424: Anode area

426: Nozzle

428: Supply Source

430: Anode

440: Substrate holder

442: Seal Ring Retainer

443: Lifting mechanism

444: Back Panel

446: Frame

447: Rotary Mechanism

448: Shaft

450: Resistor body

460: Shading Mechanism

461: Cam member

462: Disc Cam

462a: Protrusion

470: Driven Festival

471: First Roll

472: Pedestal

473: Follower

474: Connecting rod

475: Second Roll

476: Rotary axis

478: Third Roll

479: Push member

482: Shading member

484: Flange

Wf: substrate

Claims (11)

A plating device includes: a plating tank for accommodating a plating solution; an anode disposed in the plating tank; a substrate holder for use in a state where the surface to be plated faces downwards for holding the substrate; a rotation mechanism for rotating the substrate holder; a shielding member for shielding the electric field formed between the anode and the substrate when disposed between the anode and the substrate, and the shielding mechanism, According to the rotation angle of the substrate holder, the shielding member moves between the anode and the substrate; wherein the shielding mechanism comprises: a cam member, which is mounted on the substrate holder; and a driven joint, which is The shielding member is pressed between the anode and the substrate in response to being pressed by the protrusion of the cam member. The coating apparatus according to claim 1, wherein the cam member has a plurality of protrusions, and the driven link presses the shielding member between the anode and the substrate every time it is pressed by the plurality of protrusions constitute. The coating apparatus according to claim 1 or 2, wherein the cam member includes a disc cam, and the follower section includes a follower that is pushed by the protrusion of the disc cam and is moved away from the substrate holder move in the direction of a connecting rod that rotates in response to a pressing force from the follower to press the shielding member between the anode and the base plate; and a pressing member that is connected to the shielding member that is not pressed by the connecting rod At the time, the shielding member is pushed back in a direction away from between the anode and the substrate. The coating apparatus of claim 3, wherein the circular plate cam comprises: a body member attached to the substrate holder; and a protrusion member detachably attached to the body member. The coating apparatus according to claim 1 or 2, wherein the shielding mechanism is formed by pressing the shielding member between the anode and the specific portion of the substrate when the specific portion of the substrate is rotated within a specified angle range . The coating apparatus of claim 5, wherein the specific portion is a groove of the substrate, and the shielding member is used to cover the groove of the substrate when the anode is pressed between the anode and the groove of the substrate by the shielding mechanism. The groove and the specific area around the groove of the substrate are formed. The coating apparatus of claim 6, wherein the specific area around the groove of the substrate includes an area around the groove of the substrate where no pattern is formed. The coating apparatus according to claim 1 or 2, wherein a plurality of the shielding mechanisms are provided along the circumferential direction of the coating tank. A plating method, comprising: a lowering step of lowering a substrate holder holding a substrate into a plating tank when the surface to be plated faces downwards; a rotating step of rotating the substrate holder; a shielding step, which is to move a shielding member between the anode and the substrate in response to the rotation angle of the substrate holder during the rotating step; A voltage is applied between the anode and the substrate held in the substrate holder, and a plating process is performed on the plated surface; wherein the shielding step includes the following steps: by the protrusion of the circular plate cam installed on the substrate holder, make The follower moves in a direction away from the substrate holder; and the connecting rod is rotated in response to the push from the follower, and the shielding member is pressed between the anode and the substrate. The plating method of claim 9, wherein the shielding step further comprises: pushing back the shielding member in a direction away from between the anode and the substrate when the shielding member is not pressed between the anode and the substrate A step of. The plating method of claim 10, further comprising: selecting a protruding member corresponding to the type of substrate held in the substrate holder from among the plurality of protruding members of the circular plate cam having different protruding sizes, and installing it on the circular plate The steps of the body member of the plate cam.

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