JPS5972749A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5972749A
JPS5972749A JP57183205A JP18320582A JPS5972749A JP S5972749 A JPS5972749 A JP S5972749A JP 57183205 A JP57183205 A JP 57183205A JP 18320582 A JP18320582 A JP 18320582A JP S5972749 A JPS5972749 A JP S5972749A
Authority
JP
Japan
Prior art keywords
semiconductor element
metal wiring
wiring layer
semiconductor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57183205A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322615B2 (cg-RX-API-DMAC10.html
Inventor
Takashi Miyamoto
隆 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57183205A priority Critical patent/JPS5972749A/ja
Priority to US06/511,935 priority patent/US4608592A/en
Publication of JPS5972749A publication Critical patent/JPS5972749A/ja
Publication of JPS6322615B2 publication Critical patent/JPS6322615B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W70/635—
    • H10W70/657—
    • H10W76/157—
    • H10W70/682—
    • H10W70/685—
    • H10W72/07551—
    • H10W72/07554—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/547—
    • H10W72/552—
    • H10W72/884—
    • H10W72/932—
    • H10W90/754—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57183205A 1982-07-09 1982-10-19 半導体装置 Granted JPS5972749A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57183205A JPS5972749A (ja) 1982-10-19 1982-10-19 半導体装置
US06/511,935 US4608592A (en) 1982-07-09 1983-07-08 Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57183205A JPS5972749A (ja) 1982-10-19 1982-10-19 半導体装置

Publications (2)

Publication Number Publication Date
JPS5972749A true JPS5972749A (ja) 1984-04-24
JPS6322615B2 JPS6322615B2 (cg-RX-API-DMAC10.html) 1988-05-12

Family

ID=16131610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57183205A Granted JPS5972749A (ja) 1982-07-09 1982-10-19 半導体装置

Country Status (1)

Country Link
JP (1) JPS5972749A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3626151A1 (de) * 1986-08-01 1988-02-04 Siemens Ag Spannungszufuehrung fuer eine integrierte halbleiterschaltung
JPH04133341A (ja) * 1990-09-25 1992-05-07 Matsushita Electric Works Ltd 半導体チップキャリア
US5206188A (en) * 1990-01-31 1993-04-27 Ibiden Co., Ltd. Method of manufacturing a high lead count circuit board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336468A (en) * 1976-09-17 1978-04-04 Hitachi Ltd Package for integrated circuit
JPS55165662A (en) * 1979-06-12 1980-12-24 Fujitsu Ltd Semiconductor device
JPS5619648A (en) * 1979-07-26 1981-02-24 Fujitsu Ltd Package for integrated circuit
JPS57211754A (en) * 1981-06-24 1982-12-25 Fujitsu Ltd Package
JPS5910240A (ja) * 1982-07-09 1984-01-19 Nec Corp 半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336468A (en) * 1976-09-17 1978-04-04 Hitachi Ltd Package for integrated circuit
JPS55165662A (en) * 1979-06-12 1980-12-24 Fujitsu Ltd Semiconductor device
JPS5619648A (en) * 1979-07-26 1981-02-24 Fujitsu Ltd Package for integrated circuit
JPS57211754A (en) * 1981-06-24 1982-12-25 Fujitsu Ltd Package
JPS5910240A (ja) * 1982-07-09 1984-01-19 Nec Corp 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3626151A1 (de) * 1986-08-01 1988-02-04 Siemens Ag Spannungszufuehrung fuer eine integrierte halbleiterschaltung
US5206188A (en) * 1990-01-31 1993-04-27 Ibiden Co., Ltd. Method of manufacturing a high lead count circuit board
JPH04133341A (ja) * 1990-09-25 1992-05-07 Matsushita Electric Works Ltd 半導体チップキャリア

Also Published As

Publication number Publication date
JPS6322615B2 (cg-RX-API-DMAC10.html) 1988-05-12

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