JPS5972195A - 噴流式自動半田付け方法及び装置 - Google Patents
噴流式自動半田付け方法及び装置Info
- Publication number
- JPS5972195A JPS5972195A JP18159982A JP18159982A JPS5972195A JP S5972195 A JPS5972195 A JP S5972195A JP 18159982 A JP18159982 A JP 18159982A JP 18159982 A JP18159982 A JP 18159982A JP S5972195 A JPS5972195 A JP S5972195A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- molten solder
- injection
- printed circuit
- injection chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims description 27
- 238000000034 method Methods 0.000 title claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 80
- 238000002347 injection Methods 0.000 claims description 60
- 239000007924 injection Substances 0.000 claims description 60
- 230000001105 regulatory effect Effects 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18159982A JPS5972195A (ja) | 1982-10-16 | 1982-10-16 | 噴流式自動半田付け方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18159982A JPS5972195A (ja) | 1982-10-16 | 1982-10-16 | 噴流式自動半田付け方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5972195A true JPS5972195A (ja) | 1984-04-24 |
| JPH0357637B2 JPH0357637B2 (enrdf_load_stackoverflow) | 1991-09-02 |
Family
ID=16103622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18159982A Granted JPS5972195A (ja) | 1982-10-16 | 1982-10-16 | 噴流式自動半田付け方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5972195A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010120063A (ja) * | 2008-11-20 | 2010-06-03 | Nippon Dennetsu Co Ltd | はんだ付け噴流波形成装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5291755A (en) * | 1976-01-30 | 1977-08-02 | Hitachi Ltd | Local soldering device |
| JPS5744670U (enrdf_load_stackoverflow) * | 1980-08-19 | 1982-03-11 |
-
1982
- 1982-10-16 JP JP18159982A patent/JPS5972195A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5291755A (en) * | 1976-01-30 | 1977-08-02 | Hitachi Ltd | Local soldering device |
| JPS5744670U (enrdf_load_stackoverflow) * | 1980-08-19 | 1982-03-11 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010120063A (ja) * | 2008-11-20 | 2010-06-03 | Nippon Dennetsu Co Ltd | はんだ付け噴流波形成装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0357637B2 (enrdf_load_stackoverflow) | 1991-09-02 |
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