JPS5972195A - 噴流式自動半田付け方法及び装置 - Google Patents

噴流式自動半田付け方法及び装置

Info

Publication number
JPS5972195A
JPS5972195A JP18159982A JP18159982A JPS5972195A JP S5972195 A JPS5972195 A JP S5972195A JP 18159982 A JP18159982 A JP 18159982A JP 18159982 A JP18159982 A JP 18159982A JP S5972195 A JPS5972195 A JP S5972195A
Authority
JP
Japan
Prior art keywords
solder
molten solder
injection
printed circuit
injection chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18159982A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0357637B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
八治 横田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOTA KIKAI KK
Original Assignee
YOKOTA KIKAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKOTA KIKAI KK filed Critical YOKOTA KIKAI KK
Priority to JP18159982A priority Critical patent/JPS5972195A/ja
Publication of JPS5972195A publication Critical patent/JPS5972195A/ja
Publication of JPH0357637B2 publication Critical patent/JPH0357637B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP18159982A 1982-10-16 1982-10-16 噴流式自動半田付け方法及び装置 Granted JPS5972195A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18159982A JPS5972195A (ja) 1982-10-16 1982-10-16 噴流式自動半田付け方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18159982A JPS5972195A (ja) 1982-10-16 1982-10-16 噴流式自動半田付け方法及び装置

Publications (2)

Publication Number Publication Date
JPS5972195A true JPS5972195A (ja) 1984-04-24
JPH0357637B2 JPH0357637B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-09-02

Family

ID=16103622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18159982A Granted JPS5972195A (ja) 1982-10-16 1982-10-16 噴流式自動半田付け方法及び装置

Country Status (1)

Country Link
JP (1) JPS5972195A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010120063A (ja) * 2008-11-20 2010-06-03 Nippon Dennetsu Co Ltd はんだ付け噴流波形成装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5291755A (en) * 1976-01-30 1977-08-02 Hitachi Ltd Local soldering device
JPS5744670U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1980-08-19 1982-03-11

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5291755A (en) * 1976-01-30 1977-08-02 Hitachi Ltd Local soldering device
JPS5744670U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1980-08-19 1982-03-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010120063A (ja) * 2008-11-20 2010-06-03 Nippon Dennetsu Co Ltd はんだ付け噴流波形成装置

Also Published As

Publication number Publication date
JPH0357637B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-09-02

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