JPS5965439A - ボンデイングワイヤ− - Google Patents

ボンデイングワイヤ−

Info

Publication number
JPS5965439A
JPS5965439A JP57175498A JP17549882A JPS5965439A JP S5965439 A JPS5965439 A JP S5965439A JP 57175498 A JP57175498 A JP 57175498A JP 17549882 A JP17549882 A JP 17549882A JP S5965439 A JPS5965439 A JP S5965439A
Authority
JP
Japan
Prior art keywords
gold
purity
strontium
wire
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57175498A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0131691B2 (cg-RX-API-DMAC10.html
Inventor
Yutaka Kato
豊 加藤
Kunio Watanabe
邦夫 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP57175498A priority Critical patent/JPS5965439A/ja
Publication of JPS5965439A publication Critical patent/JPS5965439A/ja
Publication of JPH0131691B2 publication Critical patent/JPH0131691B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/5522—

Landscapes

  • Wire Bonding (AREA)
JP57175498A 1982-10-06 1982-10-06 ボンデイングワイヤ− Granted JPS5965439A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57175498A JPS5965439A (ja) 1982-10-06 1982-10-06 ボンデイングワイヤ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57175498A JPS5965439A (ja) 1982-10-06 1982-10-06 ボンデイングワイヤ−

Publications (2)

Publication Number Publication Date
JPS5965439A true JPS5965439A (ja) 1984-04-13
JPH0131691B2 JPH0131691B2 (cg-RX-API-DMAC10.html) 1989-06-27

Family

ID=15997086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57175498A Granted JPS5965439A (ja) 1982-10-06 1982-10-06 ボンデイングワイヤ−

Country Status (1)

Country Link
JP (1) JPS5965439A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61220343A (ja) * 1985-03-26 1986-09-30 Sumitomo Metal Mining Co Ltd 金テ−プ
US4993622A (en) * 1987-04-28 1991-02-19 Texas Instruments Incorporated Semiconductor integrated circuit chip interconnections and methods
WO2009060662A1 (ja) * 2007-11-06 2009-05-14 Tanaka Denshi Kogyok. K. ボンディングワイヤ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61220343A (ja) * 1985-03-26 1986-09-30 Sumitomo Metal Mining Co Ltd 金テ−プ
US4993622A (en) * 1987-04-28 1991-02-19 Texas Instruments Incorporated Semiconductor integrated circuit chip interconnections and methods
WO2009060662A1 (ja) * 2007-11-06 2009-05-14 Tanaka Denshi Kogyok. K. ボンディングワイヤ

Also Published As

Publication number Publication date
JPH0131691B2 (cg-RX-API-DMAC10.html) 1989-06-27

Similar Documents

Publication Publication Date Title
JPS62278241A (ja) ボンデイングワイヤ
JPS62228440A (ja) 半導体素子ボンデイング用金線
JPS62127438A (ja) 半導体素子用ボンディング線
JPS6030158A (ja) ボンデイングワイヤ−
JPS60162741A (ja) ボンデイングワイヤ−
JPS5965439A (ja) ボンデイングワイヤ−
JPH0520494B2 (cg-RX-API-DMAC10.html)
JPH0713273B2 (ja) 半導体素子用ボンディング線およびその製造方法
JP3323185B2 (ja) 半導体素子接続用金線
JPH0123540B2 (cg-RX-API-DMAC10.html)
JPH0131692B2 (cg-RX-API-DMAC10.html)
JPS6030159A (ja) ボンデイングワイヤ−
JPH0572750B2 (cg-RX-API-DMAC10.html)
JP3484823B2 (ja) ボンディングワイヤ
JPS6160841A (ja) ボンデイングワイヤ−
JPS5826662B2 (ja) 半導体素子のボンデイング用金線
JP3312348B2 (ja) ボンディング用金合金線
JP3615901B2 (ja) 半導体素子ボンディング用金合金線
JPS6030160A (ja) ボンデイングワイヤ−
JP3586909B2 (ja) ボンディングワイヤ
JPS6160842A (ja) ボンデイングワイヤ−
JPS61110735A (ja) 耐熱性に優れた金合金
JPS62127436A (ja) 半導体素子用ボンディング線
JP2721259B2 (ja) ワイヤボンディング方法及びそれに使用する銅系リードフレーム
JPS62216238A (ja) 耐食性に優れた半導体素子用銅ボンデイング線