JPS5965409A - Method of producing multilayer thick film resistor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a so-called multilayer thick film resistor in which resistors are formed in multiple layers using a resistor paste.

Conventional Structures and Problems Generally, when manufacturing a multilayer thick film resistor, as shown in Figs. Forming layer 2 by printing, drying, and baking, printing a third layer ^antibody 3 between the conductor layers 2,
Form by drying and firing; and then apply a laser beam or the like to the resistor 3 to form a notch 4 in a part of the resistor 3, and adjust the resistance value of the resistor 3 to a specified value; Thereafter, in order to protect the resistor 3 and separate it from the upper layer, the resistor 3. A glass insulating layer 5 with a low dielectric constant is printed on the entire surface including the conductor layer 2.

Formed by drying and firing. After that, a second conductive layer 6 is formed on the upper surface of the insulating layer 5. The resistors 7 are formed by printing, drying, and baking in the same manner as the first layer, and the second layer
Notches 8 are formed in the resistor 7 of the first layer in the same way as the resistor 3 of the first layer, and the resistance value thereof is adjusted to a specified value.

In this way, the resistor is formed in multiple layers, such as the third layer and then the fourth layer, and finally the top layer of the resistor is coated with a glass material for overcoating to protect it. The insulating layer is printed, dried, and fired. Then, a laser beam is applied to the uppermost layer of the resistor through the overcoat insulating layer to form a notch for adjusting the resistance value.

In the specific example shown in FIGS. 1 and 2, only two layers of resistors are formed, so the resistor 7 in the second layer is the uppermost resistor, and therefore is used for overcoating. The insulating layer 9 is formed immediately after the resistor 7 is formed. The cutout 8 is usually formed by forming an overcoat insulating layer 9 and then applying a laser beam to the resistor 7 through the overcoat insulating layer 9.

By the way, in the conventional manufacturing method of this type of multilayer thick film resistor, a resistor is formed in each layer and a notch is immediately formed to adjust the resistance value. When forming the body, there was a problem in that the resistance value, once adjusted, could go out of order. That is, even in the two-layer thick film resistor shown in FIGS. 1 and 2, the first layer of resistor 3 is formed between the insulating layer 6 and the second conductor layer 6. During the firing process where the resistors overlap by 70 degrees, their resistance value may change significantly, and even if the resistance value is accurately adjusted to the specified value by the notch 4, the resistance value may ultimately be lower than the specified value. There was a problem that there was a large deviation.

OBJECTS OF THE INVENTION The present invention eliminates the above-mentioned conventional drawbacks, and provides an excellent multilayer thick film resistor that can accurately regulate the resistance value with a simple configuration, and a method for manufacturing the same.

Structure of the Invention The present invention is structured such that after forming all the conductor layers and resistors in each layer, a laser beam is applied to the resistors in each layer to form a notch in each resistor to adjust its resistance value. It is. Therefore, according to the present invention, the resistance value can be adjusted simply and easily, and the present invention has the advantage that it is extremely advantageous in practice.

DESCRIPTION OF EMBODIMENTS FIGS. 3 and 4 show an embodiment of the multilayer thick film resistor of the present invention.
The same reference numerals as in the figures indicate the same parts as in Figs. 1 and 2, 1, and 10, which is formed in the part of the insulating layer 6 formed between the layers facing the resistor 3. Through hole, 1
Reference numeral 1 denotes an insulating layer for overcoat formed on the upper surface of the resistor 3 so as to cover the 1° of the through hole.

Incidentally, the insulating layers 9 and 11 for overcoating are both resistors 7 and 11.
The wavelength 0.3, which is normally used when forming the notches 8 and 4 in 3.
Its absorption rate is 10 for laser beams of 5 to 0.2 μm.
% or more.

The multilayer thick film resistor shown in FIGS. 3 and 4 is manufactured by the following steps. First, a conductor layer 2 constituting a first layer circuit pattern is formed on a ceramic substrate 1 made of alumina or the like by printing, drying, and firing. Then, this conductor layer 2, 2
In between, the first layer of resistor 3 is printed, dried, and fired. Thereafter, an insulating layer 6 made of a low dielectric constant material such as glass is printed on the entire surface of the resistor 3 except for all or part thereof.

It is formed by drying and firing to form an interlayer insulating layer 6 having a through hole 1o in a portion facing the resistor 3.

Thereafter, a second conductive layer 6 is placed on the upper surface of this insulating layer 5. The resistor 7 is connected to the first conductor layer 2. As with resistor 3, they are formed by printing, drying, and firing separately.

In the embodiment shown in FIGS. 3 and 4, the second layer is the uppermost layer, so that after the resistor 7 of this layer is formed, it is exposed through the upper surface of the resistor 7 and the through hole 1o. Overcoat insulating layers 9 and 11 having a laser beam absorption rate of 10% or more are respectively formed on the upper surface of the first layer resistor 3. Thereafter, a laser beam is applied to the resistors 7 and 3 through the overcoat insulating layers 9 and 10, respectively, and a notch 8 is formed in the resistors 7 and 3, respectively. β is formed and the resistance values of the resistors 7 and 3 are adjusted to a specified value.

In this way, the resistance value of the first layer resistor 3 can be adjusted accurately without being affected by the interlayer insulation layers. That is, according to the above embodiment, the first layer resistor 3
A through hole 10 is formed in the interlayer insulating layer 5 opposite to the insulating layer 5, and an overcoat insulating layer 11 having a laser beam absorption coefficient of 10 or more is formed therein, and then the overcoat layer 11 is formed on the resistor 3. Since the laser beam is applied to the resistor through the insulating layer 11, the laser beam always accurately hits the resistor regardless of the material of the insulating layer 6 between the layers. 3. I don't want to be exposed to radiation.
The notch 4 is accurately formed in the resistor 3. According to the above embodiment, the notches are formed after all the resistors in each layer are formed, so that the insulating layer, conductor layer, and resistor formed between the layers that are formed later are the same as those formed earlier. Even if the resistance value changes greatly during the firing process, the change in resistance value can be finally absorbed by the notch, and it has the advantage that a resistor with an accurate resistance value can always be obtained.

Incidentally, in the embodiment shown in FIGS. 3 and 4, the conductor layer.

Although only two layers of each resistor were formed, three layers and four layers were formed.
The same structure can be achieved even if the structure is formed into multiple layers. Further, in the embodiment shown in FIGS. 3 and 4, a through hole 10 is formed in the interlayer insulating layer 6, and an overcoat insulating layer 11 is formed in the through hole 10.
However, if the interlayer insulating layer 6 is made of a material with a laser beam absorption coefficient of 10 or more like the overcoat insulating layer 9, the above-mentioned through hole 1o and the above-mentioned overcoat insulating layer are formed. A similar configuration can be made even if 11 is not formed.

Effects of the Invention As is clear from the above embodiments, the present invention has a conductor layer of each layer,
The resistor is formed in multiple layers with an insulating layer between each layer,
Thereafter, a laser beam is applied to the resistor to form a notch in the resistor for adjusting its resistance value, which is formed first in the process of firing the conductor layer and resistor of each layer. Even if the resistance value of the resistor changes, the change in resistance value can be absorbed by the notch and the resistance value can be accurately adjusted to the specified value, making it easy to obtain an accurate resistance value. It has the advantage that it is possible to obtain a resistor of Further, according to the present invention, there is no need to form a notch each time a resistor is formed in each layer, and the notches can be formed in one process, which greatly facilitates manufacturing. have

[Brief explanation of the drawing]

FIG. 1 is a schematic front view of a conventional multilayer thick film resistor, FIG. 2 is a cross-sectional view of the same resistor at Mu A', and FIG. 3 is a schematic front view of a conventional multilayer thick film resistor. A schematic front view of the embodiment, FIG. 4 (is a BB' sectional view of the same embodiment. 1...Substrate, 2, 6... Conductor layer, 3,
7... Resistance layer, 4゛, 8... Notch, 6
...Interlayer insulating layer, 9゜11...Overcoat insulating layer, 10...Through hole. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 Figure 4

Claims (1)

[Scope of Claims] (1) After forming conductor layers and resistors in all layers by sequentially printing, drying, and firing conductor layers and resistors in multiple layers via a low dielectric constant interlayer insulating layer. A method for manufacturing a multilayer thick film resistor, comprising: irradiating the resistors in each layer with a laser beam to form cutouts in each of the resistors to adjust their resistance values. ? ) When forming a low dielectric constant interlayer insulating layer, a part or all of the mechanical body is removed from the interlayer insulating layer so that a through hole is formed facing a part or all of the resistor existing thereunder. Print and dry the insulation layer. Firing, and then forming an overcoat glass layer having a laser beam absorption rate of 10 cm or more in the through holes formed in the interlayer insulating layer. A method of manufacturing a multilayer thick film resistor. (3) The method for manufacturing a multilayer thick film resistor according to claim 1, wherein the interlayer insulating layer is formed of a material having a laser beam absorption rate of 10 or more.