JPH0366104A - Formation of protective film on resistor - Google Patents
Formation of protective film on resistorInfo
- Publication number
- JPH0366104A JPH0366104A JP1203522A JP20352289A JPH0366104A JP H0366104 A JPH0366104 A JP H0366104A JP 1203522 A JP1203522 A JP 1203522A JP 20352289 A JP20352289 A JP 20352289A JP H0366104 A JPH0366104 A JP H0366104A
- Authority
- JP
- Japan
- Prior art keywords
- printing
- protective film
- screen
- insulating material
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 26
- 230000015572 biosynthetic process Effects 0.000 title claims 2
- 239000011810 insulating material Substances 0.000 claims abstract description 31
- 238000007639 printing Methods 0.000 claims abstract description 23
- 238000001035 drying Methods 0.000 claims abstract description 6
- 238000010304 firing Methods 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 238000009966 trimming Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、絶縁基板面に印刷等により形成された抵抗体
上に所定の厚みの保護膜を形成するための抵抗体の保護
膜形成方法に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for forming a protective film on a resistor for forming a protective film of a predetermined thickness on a resistor formed by printing or the like on an insulating substrate surface. Regarding.
（従来の技術）
従来、この種の抵抗体の保護１疫は、第３図に示すよう
にアルミナ等の絶縁基板１１面に印刷等の手段で形成さ
れた抵抗体１２ｊ：に図示していない所定の線径のスク
リーンをあてがってグレーズ等の絶縁材料１３を１回だ
け印刷し、その絶縁材料１３を乾燥したのちに焼成して
形成するようにしていた。(Prior Art) Conventionally, the first protection for this type of resistor is as shown in FIG. The insulating material 13 such as glaze is printed only once by applying a screen having a predetermined wire diameter, and the insulating material 13 is dried and then fired.
（発明が解決しようとする課題）
上記のように保護膜は絶縁材料１３の１回のみの印刷で
形成されるため、所定の耐候性能を満足ささせるだけの
所定の厚みの保護膜を形成するには、必然的に線径の太
いスクリーンを用いて絶縁材料を印刷する必要がある。(Problem to be Solved by the Invention) As described above, since the protective film is formed by printing the insulating material 13 only once, it is necessary to form the protective film with a predetermined thickness that satisfies the predetermined weather resistance performance. , it is necessary to print insulating material using a screen with a large wire diameter.
ところが、線径の太いスクリーンを用いた場合は、その
線径が太くなる程、スクリーンの構成上、にじみが大き
くなるため、保護膜の寸法精度が低くなるという問題が
あった。However, when a screen with a large wire diameter is used, there is a problem that the larger the wire diameter, the larger the bleeding due to the structure of the screen, resulting in a lower dimensional accuracy of the protective film.
このような精度の問題を解決するには線径の細いスクリ
ーンを用いればよいことになるが、その場合では所定の
厚みの保護膜を形成することができず、所定の耐候性能
が保証できないことになる。To solve this problem of precision, it would be possible to use a screen with a thin wire diameter, but in that case, it would not be possible to form a protective film of the specified thickness, and the specified weather resistance performance could not be guaranteed. become.
本発明は、上記の課題に鑑みてなされものであって、寸
法精度および耐候性能ともに優れた抵抗体の保護膜形成
方法を提供することを目的としている。The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for forming a protective film for a resistor that is excellent in both dimensional accuracy and weather resistance.
（課題を解決ケるための手段）
上記のような目的を達成するために、本発明の抵抗体の
保護膜形成方法においては、抵抗体上に所定のＩ！、（
みよりも幾分薄い保護膜が形成されるような線径のスク
リーンを用いて第１回目の絶縁材料の印刷を行い、その
絶縁材料を乾燥したのちにその上から第１回目のものよ
りも線径の細いスクリーンを用いて第２回目の絶縁材料
の印刷を行い、その絶縁材料を乾燥したのちに第１回目
と第２回目に印刷した絶縁材料を同時に焼成するように
したことを特徴としている。(Means for Solving the Problems) In order to achieve the above objects, in the method for forming a protective film on a resistor of the present invention, a predetermined I! ,(
The first insulating material is printed using a screen with a wire diameter that allows a protective film to be formed a little thinner than the first one. The second insulating material is printed using a screen with a narrow wire diameter, and after that insulating material is dried, the first and second printed insulating materials are simultaneously fired. There is.
（作用）
第１回目の絶縁材料の印刷だけでは所定の厚みに近いと
いえども所定の厚みの保護膜は形成することができず、
寸法精度も低い。ところが、第２回口の絶縁材料の印刷
で厚みの不足分が柿われて所定の厚みの保護膜が形成で
きる上うになり、しかも線径の細いスクリーンを用いる
ために寸法精度も高くなる。(Function) Although the first printing of the insulating material is close to the desired thickness, it is not possible to form a protective film with the desired thickness.
Dimensional accuracy is also low. However, by printing the insulating material for the second time, the insufficient thickness is compensated for and a protective film of a predetermined thickness can be formed, and the dimensional accuracy is also improved because a screen with a thin wire diameter is used.
（実施例）
以下、本発明の実施例を図面を参ｊ１■して詳細に説明
する。(Embodiments) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
本発明方法においては、まず第１図に示すように絶縁裁
板１面に印刷等の手段で形成されてトリミングが施され
た抵抗体２」―に図示していないスクリーンをあてがい
グレーズ等の絶縁材料３を印刷する。この第１回目の印
刷は、その絶縁材料３を焼成したときに得られる保護膜
の厚みが最終的に得ようとする所定の厚みよりも幾分薄
い厚み（例えば、所定の厚みの６０〜９叫の厚み）とな
るような線径のスクリーンを用いて行う、。In the method of the present invention, first, as shown in FIG. 1, a screen (not shown) is applied to the resistor 2, which has been formed by printing or other means on one surface of an insulating cutting board and has been trimmed. Print material 3. This first printing is performed so that the thickness of the protective film obtained when the insulating material 3 is fired is somewhat thinner than the final desired thickness (for example, 60 to 90% of the predetermined thickness). This is done using a screen with a wire diameter that gives the same thickness.
つぎに、絶縁材料３を乾燥したのちに、その絶縁材料３
上に図示していないスクリーンをあてがい、その絶縁材
料３の全体を覆うようにグレーズ等の絶縁材料４を印刷
する。この第２回目の印刷は、第１回目のものよりも線
径の細いスクリーンを用いて行い、それにより第１回目
の印刷時の不足している厚みを補うような厚みの絶縁材
料が形成されることになる。Next, after drying the insulating material 3,
A screen (not shown) is applied on top, and an insulating material 4 such as a glaze is printed so as to cover the entire insulating material 3. This second printing is performed using a screen with a smaller wire diameter than the first printing, thereby forming an insulating material with a thickness that compensates for the lack of thickness during the first printing. That will happen.
ついで、この絶縁材料４を乾燥したのちに、第１回目と
第２回目に印刷した絶縁材料３．４を同時に焼成する。Next, after drying this insulating material 4, the first and second printed insulating materials 3.4 are fired simultaneously.
これにより、保護膜が形成されるが、その厚みは第２回
目の印刷によって所定の値になるとともに、その保護膜
の寸法精度は第２回目の印刷に用いる線径の細いスクリ
ーンによって決まるため、その寸法精度も高いものとな
る。As a result, a protective film is formed, but its thickness reaches a predetermined value by the second printing, and the dimensional accuracy of the protective film is determined by the thin wire diameter screen used for the second printing. Its dimensional accuracy is also high.
なお、上記の実施例においては説明していないが、通常
は抵抗体２の上にトリミンググレーズを施すことが多く
、トリミンググレーズを必要とする場合は、本発明にお
いてはそのトリミンググレーズを含めて抵抗体と呼ぶこ
ととする。また、第２図に示すように絶縁基板１面に複
数箇の抵抗体２が形成されている場合には、これらの複
数箇の抵抗体２のすべてにまたがって絶縁材料３，４を
設けるようにしてもよい。Although not explained in the above embodiment, a trimming glaze is usually applied on the resistor 2, and if a trimming glaze is required, the resistor including the trimming glaze is used in the present invention. Let's call it the body. Furthermore, when a plurality of resistors 2 are formed on one surface of an insulating substrate as shown in FIG. You may also do so.
（発明の効果）
以上説明したことから明らかなように本発明によれば、
２回の印刷により保護膜を形成するようにしたから、第
２回目の絶縁材料の印刷で厚みの不足分が補われて所定
の厚みの保護膜が形成されるとともに、第２回目の印刷
は線径の細いスクリーンを用いるために寸法精度も高い
ものとなる。(Effects of the Invention) As is clear from the above explanation, according to the present invention,
Since the protective film is formed by printing twice, the lack of thickness is compensated for by the second printing of the insulating material and a protective film of a predetermined thickness is formed. Since a screen with a small wire diameter is used, dimensional accuracy is also high.
第１図および第２図は本発明の実施例に係る抵抗体の保
護膜形成方法の説明に０（する抵抗体の要部断面図、第
３図は従来例の抵抗体の保護膜形成方法の説明に伏する
抵抗体の要部断面図である。
ｌ・・・絶縁基板、２・・・抵抗体、３．４・・・絶縁
材料。1 and 2 are cross-sectional views of essential parts of a resistor according to an embodiment of the present invention, and FIG. 3 is a conventional method for forming a protective film on a resistor. It is a sectional view of a main part of a resistor which is used in the explanation of 1. Insulating substrate, 2. Resistor, 3.4. Insulating material.
Claims (1)
の保護膜を形成するための抵抗体の保護膜形成方法であ
って、 抵抗体上に所定の厚みよりも幾分薄い保護膜が形成され
るような線径のスクリーンを用いて第１回目の絶縁材料
の印刷を行い、その絶縁材料を乾燥したのちにその上か
ら第１回目のものよりも線径の細いスクリーンを用いて
第２回目の絶縁材料の印刷を行い、その絶縁材料を乾燥
したのちに第１回目と第２回目に印刷した絶縁材料を同
時に焼成することを特徴とする抵抗体の保護膜形成方法
。(1) A resistor protective film forming method for forming a protective film of a predetermined thickness on a resistor formed on an insulating substrate surface, the protective film being somewhat thinner than the predetermined thickness on the resistor. The first insulating material is printed using a screen with a wire diameter that allows the formation of A method for forming a protective film for a resistor, comprising printing an insulating material a second time, drying the insulating material, and then simultaneously firing the first and second printed insulating materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1203522A JPH0366104A (en) | 1989-08-04 | 1989-08-04 | Formation of protective film on resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1203522A JPH0366104A (en) | 1989-08-04 | 1989-08-04 | Formation of protective film on resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0366104A true JPH0366104A (en) | 1991-03-20 |
Family
ID=16475544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1203522A Pending JPH0366104A (en) | 1989-08-04 | 1989-08-04 | Formation of protective film on resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0366104A (en) |
-
1989
- 1989-08-04 JP JP1203522A patent/JPH0366104A/en active Pending
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