JPS5956759U - monolithic integrated circuit - Google Patents

monolithic integrated circuit

Info

Publication number
JPS5956759U
JPS5956759U JP15230282U JP15230282U JPS5956759U JP S5956759 U JPS5956759 U JP S5956759U JP 15230282 U JP15230282 U JP 15230282U JP 15230282 U JP15230282 U JP 15230282U JP S5956759 U JPS5956759 U JP S5956759U
Authority
JP
Japan
Prior art keywords
integrated circuit
monolithic integrated
heating element
electrode
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15230282U
Other languages
Japanese (ja)
Inventor
稲垣　明夫
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP15230282U priority Critical patent/JPS5956759U/en
Publication of JPS5956759U publication Critical patent/JPS5956759U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Bipolar Transistors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例を示す断面図、第２図は実施例
における発熱素子の上面図、第３図は実施例におシる制
御用素子の底面図である。 １・・・パワートランジスタ、２・・・制御用素子、３
・・・バンプ電極。FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a top view of a heating element in the embodiment, and FIG. 3 is a bottom view of a control element in the embodiment. 1... Power transistor, 2... Control element, 3
...Bump electrode.

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）発熱素子と制御用素子とを有する集積面路におい
て、発熱素子をプレーナ形半導体素子として制御用素子
と別個に構成し、該発熱素子に該制御用素子を突起電極
を介して接続・搭載することを特徴とするモノリシック
集積回路。(1) In an integrated surface path having a heating element and a control element, the heating element is configured as a planar semiconductor element separately from the control element, and the control element is connected to the heating element via a protruding electrode. A monolithic integrated circuit. （２）実用新案登録請求の範囲第１項記載のものにおい
て、突起電極は制御用素子の一重部に設けられたバンプ
電極であり、この電極は発熱素子の一重部に形成された
導体パターンと接続されることを特徴とするモノリシッ
ク集積回路。(2) Utility model registration In the item described in claim 1, the protruding electrode is a bump electrode provided on a single portion of the control element, and this electrode is connected to a conductor pattern formed on a single portion of the heating element. A monolithic integrated circuit characterized in that it is connected. （３）実用新案登録請求の範囲第１項記載のものにおい
て、突起電極は発熱素子の一重部に導体パターンを介し
て設けられたペデスタル電極であり、制御用素子の一重
部に設けられた電極と接続されたことを特徴とするモノ
リシック集積回路。(3) Utility model registration In the item described in claim 1, the projecting electrode is a pedestal electrode provided on a single part of the heating element via a conductor pattern, and the protruding electrode is a pedestal electrode provided on a single part of the control element. A monolithic integrated circuit characterized in that it is connected to a monolithic integrated circuit. （４）実用新案登録請求の範囲第１項記載のものにおい
て、発熱素子は金属ステムに熱伝的に接合されることを
特徴とするモノリシック集積回路。(4) Utility Model Registration The monolithic integrated circuit according to claim 1, wherein the heating element is thermally connected to the metal stem.
JP15230282U 1982-10-07 1982-10-07 monolithic integrated circuit Pending JPS5956759U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15230282U JPS5956759U (en) 1982-10-07 1982-10-07 monolithic integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15230282U JPS5956759U (en) 1982-10-07 1982-10-07 monolithic integrated circuit

Publications (1)

Publication Number Publication Date
JPS5956759U true JPS5956759U (en) 1984-04-13

Family

ID=30337259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15230282U Pending JPS5956759U (en) 1982-10-07 1982-10-07 monolithic integrated circuit

Country Status (1)

Country Link
JP (1) JPS5956759U (en)

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