JPS5954928U - リ−ドフレ−ム固定装置 - Google Patents

リ−ドフレ−ム固定装置

Info

Publication number
JPS5954928U
JPS5954928U JP14887082U JP14887082U JPS5954928U JP S5954928 U JPS5954928 U JP S5954928U JP 14887082 U JP14887082 U JP 14887082U JP 14887082 U JP14887082 U JP 14887082U JP S5954928 U JPS5954928 U JP S5954928U
Authority
JP
Japan
Prior art keywords
lead frame
fixing device
frame fixing
holding member
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14887082U
Other languages
English (en)
Inventor
政義 山口
富雄 樫原
横井　清建
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP14887082U priority Critical patent/JPS5954928U/ja
Publication of JPS5954928U publication Critical patent/JPS5954928U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図はリードフレームを示す平面図、第２図ａ、　　
ｂは従来のリードフレーム固定装置を示す一部断面した
平面図およびその■−■線に沿う断面矢視図、第３図ａ
、　　ｂはその固定装置の固定によりボンディングした
ときの状態を示示す正面図および側面図、第４図はａ、
　　ｂこの考案の一実施例のリードフレーム固定装置を
示す一部断面した平面図およびそのＩＶ−ＩＶ線に沿う
断面矢視図である。 ２・・・半導体ペレット、３・・・リードフレーム、５
・・・押え板（第１の押え部材）、６・・・ヒータブロ
ック（第２の押え部材）、７・・・台部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 枠状に形成された第１の押え部材とブ冶ツク状に形成さ
    れた第２の押え部材とて半導体ペレットを搭載したリー
    ドフレームを挾持して固定するリードフレーム固定装置
    において、上記第２の押え部材の上記半導体ペレットに
    対応する部分に台部を突設したことを特徴とするリード
    フレーム固定装置。
JP14887082U 1982-09-30 1982-09-30 リ−ドフレ−ム固定装置 Pending JPS5954928U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14887082U JPS5954928U (ja) 1982-09-30 1982-09-30 リ−ドフレ−ム固定装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14887082U JPS5954928U (ja) 1982-09-30 1982-09-30 リ−ドフレ−ム固定装置

Publications (1)

Publication Number Publication Date
JPS5954928U true JPS5954928U (ja) 1984-04-10

Family

ID=30330626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14887082U Pending JPS5954928U (ja) 1982-09-30 1982-09-30 リ−ドフレ−ム固定装置

Country Status (1)

Country Link
JP (1) JPS5954928U (ja)

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