JPS5946701A - 絶縁性セラミツクペ−スト用無機組成物 - Google Patents
絶縁性セラミツクペ−スト用無機組成物Info
- Publication number
- JPS5946701A JPS5946701A JP57157471A JP15747182A JPS5946701A JP S5946701 A JPS5946701 A JP S5946701A JP 57157471 A JP57157471 A JP 57157471A JP 15747182 A JP15747182 A JP 15747182A JP S5946701 A JPS5946701 A JP S5946701A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- powder
- paste
- insulating
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 34
- 239000000203 mixture Substances 0.000 title claims description 27
- 239000011521 glass Substances 0.000 claims description 45
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 12
- 229910052863 mullite Inorganic materials 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 241000951471 Citrus junos Species 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 description 52
- 239000010410 layer Substances 0.000 description 33
- 239000004020 conductor Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 19
- 238000009413 insulation Methods 0.000 description 14
- 239000002245 particle Substances 0.000 description 11
- 238000002425 crystallisation Methods 0.000 description 10
- 230000008025 crystallization Effects 0.000 description 10
- 239000010931 gold Substances 0.000 description 10
- 238000007747 plating Methods 0.000 description 10
- 239000011247 coating layer Substances 0.000 description 7
- 238000005187 foaming Methods 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000002241 glass-ceramic Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 2
- -1 Ag) Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 2
- 229940088601 alpha-terpineol Drugs 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- BYFGZMCJNACEKR-UHFFFAOYSA-N aluminium(i) oxide Chemical compound [Al]O[Al] BYFGZMCJNACEKR-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 238000004017 vitrification Methods 0.000 description 2
- RUJPNZNXGCHGID-UHFFFAOYSA-N (Z)-beta-Terpineol Natural products CC(=C)C1CCC(C)(O)CC1 RUJPNZNXGCHGID-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- QJVXKWHHAMZTBY-GCPOEHJPSA-N syringin Chemical compound COC1=CC(\C=C\CO)=CC(OC)=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 QJVXKWHHAMZTBY-GCPOEHJPSA-N 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Glass Compositions (AREA)
- Inorganic Insulating Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57157471A JPS5946701A (ja) | 1982-09-10 | 1982-09-10 | 絶縁性セラミツクペ−スト用無機組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57157471A JPS5946701A (ja) | 1982-09-10 | 1982-09-10 | 絶縁性セラミツクペ−スト用無機組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5946701A true JPS5946701A (ja) | 1984-03-16 |
JPH046045B2 JPH046045B2 (enrdf_load_stackoverflow) | 1992-02-04 |
Family
ID=15650396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57157471A Granted JPS5946701A (ja) | 1982-09-10 | 1982-09-10 | 絶縁性セラミツクペ−スト用無機組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5946701A (enrdf_load_stackoverflow) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60190679A (ja) * | 1984-03-12 | 1985-09-28 | Masao Kanazawa | 重力・浮力差による空気圧縮装置 |
US4624934A (en) * | 1984-05-04 | 1986-11-25 | Asahi Glass Company Ltd. | Ceramic composition for multilayer printed wiring board |
US4777092A (en) * | 1986-05-02 | 1988-10-11 | Asahi Glass Company, Ltd. | Composition for ceramic substrate and substrate |
US5028569A (en) * | 1987-05-14 | 1991-07-02 | Gte Products Corporation | Ceramic article, raw batch formulation, and method |
WO1997037948A1 (en) * | 1996-04-08 | 1997-10-16 | Motorola Inc. | Ceramic composition and method of making same |
US6174462B1 (en) | 1998-01-20 | 2001-01-16 | Denso Corporation | Conductive paste composition including conductive metallic powder |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6447412A (en) * | 1987-05-29 | 1989-02-21 | Hayashi Seisakusho Kk | Deaerating packing device for vessel packed with adhesive substance |
-
1982
- 1982-09-10 JP JP57157471A patent/JPS5946701A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6447412A (en) * | 1987-05-29 | 1989-02-21 | Hayashi Seisakusho Kk | Deaerating packing device for vessel packed with adhesive substance |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60190679A (ja) * | 1984-03-12 | 1985-09-28 | Masao Kanazawa | 重力・浮力差による空気圧縮装置 |
US4624934A (en) * | 1984-05-04 | 1986-11-25 | Asahi Glass Company Ltd. | Ceramic composition for multilayer printed wiring board |
US4777092A (en) * | 1986-05-02 | 1988-10-11 | Asahi Glass Company, Ltd. | Composition for ceramic substrate and substrate |
US5028569A (en) * | 1987-05-14 | 1991-07-02 | Gte Products Corporation | Ceramic article, raw batch formulation, and method |
WO1997037948A1 (en) * | 1996-04-08 | 1997-10-16 | Motorola Inc. | Ceramic composition and method of making same |
US5821181A (en) * | 1996-04-08 | 1998-10-13 | Motorola Inc. | Ceramic composition |
US6174462B1 (en) | 1998-01-20 | 2001-01-16 | Denso Corporation | Conductive paste composition including conductive metallic powder |
Also Published As
Publication number | Publication date |
---|---|
JPH046045B2 (enrdf_load_stackoverflow) | 1992-02-04 |