JPS5945936U - Hybrid IC mounting structure - Google Patents

Hybrid IC mounting structure

Info

Publication number
JPS5945936U
JPS5945936U JP14321382U JP14321382U JPS5945936U JP S5945936 U JPS5945936 U JP S5945936U JP 14321382 U JP14321382 U JP 14321382U JP 14321382 U JP14321382 U JP 14321382U JP S5945936 U JPS5945936 U JP S5945936U
Authority
JP
Japan
Prior art keywords
hybrid
mounting structure
electrodes
board
long hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14321382U
Other languages
Japanese (ja)
Inventor
桜井　康仁
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP14321382U priority Critical patent/JPS5945936U/en
Publication of JPS5945936U publication Critical patent/JPS5945936U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はハイブリッドＩＣの一般的な構造を示　　゛す
断面図、第２図はこのＩＣの従来あ場合の外観を示す平
面図、第３図はこのＩＣのプリント板への取付状態をプ
リント板の裏面側から示す図、第４図は本考案に使用す
るハイブリッドＩＣの外観を示す平面図、第５図はこの
ＩＣのプリント板への取付状態を示す垂直断面図である
。 １・・・ＩＣ基板、９・・・電極、１０・・・プリント
板、１１・・・長孔、１２．１２’・・・導体ランド部
、１３・・・空隙部。Figure 1 is a cross-sectional view showing the general structure of a hybrid IC, Figure 2 is a plan view showing the conventional appearance of this IC, and Figure 3 is a print showing how this IC is mounted on a printed board. FIG. 4 is a plan view showing the external appearance of the hybrid IC used in the present invention, and FIG. 5 is a vertical sectional view showing the state in which this IC is attached to the printed board. DESCRIPTION OF SYMBOLS 1... IC board, 9... Electrode, 10... Printed board, 11... Long hole, 12.12'... Conductor land part, 13... Cavity part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上にチップ状部品等が取付けられると共に該基板の
端部に外部への接続用の電極が揃列して形成されたハイ
ブリッドＩＣのプリント板への取付構造であって、前記
ＩＣの各電極間の基板端面を切り欠くことにより該電極
間に空隙部を設け、このＩＣの上記基板端面をプリント
板に設けた長孔に差（７込み、この長孔の縁部の各導体
ランド部に前記各電極をハンダ付けしてなるハイブリッ
ドＩＣの取付構造。This is a structure for mounting a hybrid IC on a printed board, in which chip-like parts and the like are mounted on a substrate, and electrodes for connection to the outside are aligned and arranged at the end of the substrate, the structure comprising: A gap is provided between the electrodes by cutting out the end surface of the board between them, and the end surface of the board of this IC is inserted into a long hole (7 included) provided on the printed board, and each conductor land on the edge of this long hole is A hybrid IC mounting structure in which each of the electrodes is soldered.
JP14321382U 1982-09-20 1982-09-20 Hybrid IC mounting structure Pending JPS5945936U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14321382U JPS5945936U (en) 1982-09-20 1982-09-20 Hybrid IC mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14321382U JPS5945936U (en) 1982-09-20 1982-09-20 Hybrid IC mounting structure

Publications (1)

Publication Number Publication Date
JPS5945936U true JPS5945936U (en) 1984-03-27

Family

ID=30319741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14321382U Pending JPS5945936U (en) 1982-09-20 1982-09-20 Hybrid IC mounting structure

Country Status (1)

Country Link
JP (1) JPS5945936U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS511765B1 (en) * 1969-05-27 1976-01-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS511765B1 (en) * 1969-05-27 1976-01-20

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