JPS60142526U - High frequency wiring structure - Google Patents

High frequency wiring structure

Info

Publication number
JPS60142526U
JPS60142526U JP3050284U JP3050284U JPS60142526U JP S60142526 U JPS60142526 U JP S60142526U JP 3050284 U JP3050284 U JP 3050284U JP 3050284 U JP3050284 U JP 3050284U JP S60142526 U JPS60142526 U JP S60142526U
Authority
JP
Japan
Prior art keywords
high frequency
wiring structure
hole
frequency wiring
recessed portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3050284U
Other languages
Japanese (ja)
Inventor
西村　武志
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP3050284U priority Critical patent/JPS60142526U/en
Publication of JPS60142526U publication Critical patent/JPS60142526U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の高周波装置゛における配線構体の部分断
面図、第２図は第１図の高周波等価回路図、及び第３図
は本考案の高周波配線構体の要部断面図である。FIG. 1 is a partial sectional view of a wiring structure in a conventional high-frequency device, FIG. 2 is a high-frequency equivalent circuit diagram of FIG. 1, and FIG. 3 is a sectional view of a main part of the high-frequency wiring structure of the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方の面に回路部品が搭載され、他力の面番−こ配線パ
ターンが配設されたプリント基板に、貫通孔及びこの貫
通孔を中心にして連通ずるくぼみ部を形成し、このくぼ
み部に両面に電極が形成された円盤状回路部品を設置し
、この電極の一方を前記回路部と結合すると共に他方を
前記貫通孔に充てんされる半田により前記配線パターン
に直接結合、したことを特徴とすを高周波配線構体。　
−A through hole and a communicating recessed portion centered around the through hole are formed on a printed circuit board on which circuit components are mounted on one side and an external surface number wiring pattern is arranged, and this recessed portion is A disk-shaped circuit component having electrodes formed on both sides is installed, one of the electrodes is connected to the circuit part, and the other is directly connected to the wiring pattern by solder filled in the through hole. The high frequency wiring structure.
−
JP3050284U 1984-03-01 1984-03-01 High frequency wiring structure Pending JPS60142526U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3050284U JPS60142526U (en) 1984-03-01 1984-03-01 High frequency wiring structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3050284U JPS60142526U (en) 1984-03-01 1984-03-01 High frequency wiring structure

Publications (1)

Publication Number Publication Date
JPS60142526U true JPS60142526U (en) 1985-09-20

Family

ID=30530255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3050284U Pending JPS60142526U (en) 1984-03-01 1984-03-01 High frequency wiring structure

Country Status (1)

Country Link
JP (1) JPS60142526U (en)

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