JPS5944891A - Method of recognizing presence or absence of wire - Google Patents
Method of recognizing presence or absence of wireInfo
- Publication number
- JPS5944891A JPS5944891A JP57154493A JP15449382A JPS5944891A JP S5944891 A JPS5944891 A JP S5944891A JP 57154493 A JP57154493 A JP 57154493A JP 15449382 A JP15449382 A JP 15449382A JP S5944891 A JPS5944891 A JP S5944891A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- pad
- absence
- recognizing
- average value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
(1)発明の技術分野
本発明は視見センサによる画像認識方法に関し、特にパ
ッド上にあるワイヤの有無の認識方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to an image recognition method using a visual sensor, and particularly to a method for recognizing the presence or absence of a wire on a pad.
(2)技術の背景
従来より電子言1算装置の回路を構成しているプリント
配線板においては、配線密度が高く、多層配線板を用い
てもパターンでは処理できない配線部分が生ずる。この
配線部分はディスクリートワイヤで配線処理を行なって
いるが、この配線を自動化するためのワイヤボンディン
グ装嵌の開発が進められている。(2) Background of the Technology Conventionally, printed wiring boards constituting the circuits of electronic arithmetic devices have a high wiring density, and even if a multilayer wiring board is used, there are wiring portions that cannot be processed by patterns. This wiring section is wired using discrete wires, but progress is being made in the development of wire bonding to automate this wiring.
(3)従来技術と問題点
第1図はプリント配線板のディスクリートワイヤ配線用
のワイヤデンディング装置の4’+’?造を説明するた
めの図である。同図において、1はXYYテーブル2(
dそれをnK FIBするモータ、3は半田リフロー用
のチップ、4tよそれを加熱するための電TD、5td
、チップの昇降用モータ、6はワイヤ、7はワイヤフィ
ードローラ、8はワイヤガイドチューブ、9け視覚セン
サとしてのテレビカメラ、10はプリント配線板をそれ
ぞれ示す。(3) Prior art and problems Figure 1 shows a wire ending device 4'+' for discrete wire wiring on a printed wiring board. FIG. In the same figure, 1 is the XYY table 2 (
dA motor to nK FIB it, 3 is a chip for solder reflow, 4t is an electric TD to heat it, 5td
, a chip lifting motor, 6 a wire, 7 a wire feed roller, 8 a wire guide tube, 9 a television camera as a visual sensor, and 10 a printed wiring board.
この装置による配線は先ずXYテーブル1土にプリント
配線板10をセットし、XYテーブル1を移動して半田
伺すべき第1のパッドをテレビカメラ9で認識し、そこ
にガイドチューブ8から供給されるワイヤ6をチップ3
によりリフ訂」−ボン!4ングする。次にXYテーブル
1を移動り、、’4′田付う“べき第2のパッドも:テ
レビカメラ9で認識し、そこにワイヤ6を半田伺して第
1第2のパッド間の配線を終了するのである。このボン
ディングを行う場合には、パッド上にワイヤが有ること
をるjC認する必快がある。ところがノ゛?ツドとワイ
ヤとの輝度プ゛−りの値tま、近接しておシ2値化処理
によってワイヤとパッドを明確に分1η11することが
困次1tである。For wiring using this device, first set the printed wiring board 10 on the XY table 1, move the XY table 1, use the television camera 9 to recognize the first pad to be soldered, and then supply the wires from the guide tube 8 to the first pad to be soldered. wire 6 to tip 3
Revised by "-Bon! 4. Next, the XY table 1 is moved, and the second pad that should be attached '4' is recognized by the TV camera 9, and the wire 6 is soldered there to complete the wiring between the first and second pads. When performing this bonding, it is necessary to confirm that there is a wire on the pad. However, the brightness difference between the node and the wire, t, is close to each other. It is difficult to separate the wires and pads clearly by the binarization process.
即ち、デ【/ビカメラの視野を多数の画素に細分し、各
画素の輝度によるアリーログ価号をrフタル46号Q(
:変換し、そのrジタルデータを用いた場合、パッドの
みのある視野の輝歴の平均値と)?ラド土にワイヤがあ
るときの視野の輝度の平均値との差が僅小となるため、
ワイヤの存在を明確に利足することが回前(−となるの
である。In other words, the field of view of the digital camera is subdivided into a large number of pixels, and the ary log value according to the brightness of each pixel is calculated by rFthal No. 46 Q (
: converted and using the r digital data, what is the average value of the brightness of the visual field with only the pad)? The difference between the average value of the visual field and the brightness when there is a wire on rad soil is very small, so
The existence of the wire is clearly taken into account as the previous (-).
(4)発明の目的
本発明は上記従来の問題点に鑑み、パッド上のワイヤの
有無を容易に検出できるワイヤイj無(位置)の認識方
法を提供することを目的とするものである。(4) Object of the Invention In view of the above-mentioned conventional problems, it is an object of the present invention to provide a method for recognizing the presence or absence (position) of a wire on a pad, which can easily detect the presence or absence of a wire on a pad.
(5)発明の構成
そしてこの目的CJ本発甲」によれば、ン見二1玩十ン
ツの視野を多数の画素にX((1分し、各画素の輝度デ
ータの平均値の大小によシボンダイング/fツド上に接
合するワイヤを認識するワイヤ;fj無の認識方法にお
いて、照明ヲワイヤに114角に渦゛Cてワイヤにハレ
ーションを起させ、パッドとの)”+:4F度差を積極
的に大きくすることを特徴とするワイヤ有無の認識方法
を提供することによりてり丁駄成される。(5) Structure of the invention and purpose of the invention According to the CJ Honkoh, the visual field of 21 people is divided into a large number of pixels ((1), and the average value of the luminance data of each pixel is Wire for recognizing the wire to be bonded on the pad The present invention is accomplished by providing a method for recognizing the presence or absence of a wire, which is characterized by actively increasing the size of the wire.
(6)発明の実施例 以下本発明実施例を図面によって詳述する。(6) Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.
第2図は本発明によるワイヤ有無認識方法を6)7゜明
する/′cめの図である。同図においで11はポンディ
ングパッド、12はワイヤをそれぞれ示す。FIG. 2 is a 6)/'c'th diagram illustrating the wire presence/absence recognition method according to the present invention. In the figure, 11 indicates a bonding pad, and 12 indicates a wire.
本発明方法はボンディング・・?ラド11にボンディン
グずべきワイヤ12の方向に対し、矢印Aの如くワイヤ
12の直角方向よシ照明を当てるようにしたものである
。1;fりで照明方向が固定され°Cいる場合にはyf
ンダイングワイヤの方向全照明方向に対して一定方向に
揃える必要がある。Is the method of the present invention bonding...? The wire 12 is illuminated in the direction perpendicular to the wire 12 as shown by arrow A with respect to the direction of the wire 12 to be bonded to the wire 11. 1; If the illumination direction is fixed at f and °C, yf
The direction of the lighting wire must be aligned in a constant direction with respect to all illumination directions.
このようにワイヤに幻し、その直角方向よシ照明すると
、第3図の如く照明用の光源13より出た光tまワイヤ
12に反射して矢印P方向に進むようなハレーションを
起し、視覚センサ14に入射する。これに対しノクッド
11で反射した光は大部分が矢印Q方向へ進み、視覚セ
ンサ14に入射する光は弱い。従って視覚センサの視野
を多数に細分した各画素の輝度データの平均飴は、ワイ
ヤのある場合は大きく、ない場合は小さい。この平均値
の大小によp容易にワイヤの有無′5C認識することが
できる。When the light appears on the wire in this way and is illuminated in the direction perpendicular to it, a halation occurs in which the light emitted from the illumination light source 13 is reflected on the wire 12 and travels in the direction of arrow P, as shown in FIG. incident on the visual sensor 14. On the other hand, most of the light reflected by the nocud 11 travels in the direction of the arrow Q, and the light that enters the visual sensor 14 is weak. Therefore, the average value of the luminance data of each pixel obtained by subdividing the visual field of the visual sensor into many parts is large when there is a wire, and small when there is no wire. The presence or absence of a wire can be easily recognized by the magnitude of this average value.
(7)発明の効果
以上、詳細に説明したように、本発明のワイヤ有無の認
識方法d1ワイヤの直角方向よシ照明を当てることによ
りワイヤの有無を容易に認識することを可能としたもの
であって、プリント配線板のワイヤ、hpンディング装
置等に適用して効果大々るものである。(7) Effects of the Invention As explained in detail above, the method for recognizing the presence or absence of a wire according to the present invention d1 makes it possible to easily recognize the presence or absence of a wire by applying illumination in the direction perpendicular to the wire. Therefore, it can be applied to printed wiring board wires, HP bonding equipment, etc. with great effect.
第1図はプリント配線板用のワイヤボンガイング装置を
説明するための図、第2図及びg(43(’f、lf:
J、本発明によるワイヤ有無のB5千、:識方法を説明
す2)ブこめの図である。
図面において、11i、Iボンデ゛インダパッド、12
はワイヤ、13は光源、14i、i祝j:Lセン4ノ全
ぞitそれ示す。
特訂出ル1″1人
?A士通株式会り
特許出M1代理人
弁理士 官 木 朗
弁理士西舘和之
弁理士内IJJ幸男
弁理士山1」昭之
第3面Fig. 1 is a diagram for explaining a wire bonding device for printed wiring boards, Fig. 2 and g(43('f, lf:
J, B5,000 with and without wire according to the present invention: 2) A diagram illustrating the identification method. In the drawing, 11i, I bonder pad, 12
13 is a wire, 13 is a light source, 14i, 14i: All 4 of the L sensors are shown. Special Edition 1 "One person? A Shitsu Co., Ltd. Patent Issue M1 Agent Patent Attorney Kan Ki Akira Patent Attorney Kazuyuki Nishidate Patent Attorney IJJ Yukio Patent Attorney Yama 1" Akiyuki Page 3
Claims (1)
輝度データの平均値の大小によシボンディングパッド上
に接合するワイヤを認識するワイヤ有無の認識方法にお
いて、照明をワイヤに直角に当ててワイヤにハレーショ
ンを起させ、パッドとの輝度差な積極的に大きくするこ
と全特徴とするワイヤ有無の認識方法。1. The field of view of the visual sensor is divided into a large number of pixels, and the wire bonded to the bonding pad is recognized based on the average value of the luminance data of each pixel.In the wire presence recognition method, the illumination is set at right angles to the wire. This method of recognizing the presence or absence of a wire is characterized by causing halation on the wire by applying it to the pad, and actively increasing the brightness difference between the wire and the pad.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57154493A JPS5944891A (en) | 1982-09-07 | 1982-09-07 | Method of recognizing presence or absence of wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57154493A JPS5944891A (en) | 1982-09-07 | 1982-09-07 | Method of recognizing presence or absence of wire |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5944891A true JPS5944891A (en) | 1984-03-13 |
Family
ID=15585445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57154493A Pending JPS5944891A (en) | 1982-09-07 | 1982-09-07 | Method of recognizing presence or absence of wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5944891A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5638900A (en) * | 1979-09-07 | 1981-04-14 | Pioneer Electronic Corp | Device for inspecting chip mount |
JPS5649908A (en) * | 1979-09-29 | 1981-05-06 | Pioneer Electronic Corp | Illuminating method for discrimination of pattern of printed substrate |
JPS56124001A (en) * | 1980-03-05 | 1981-09-29 | Hitachi Ltd | Measuring method for position of tip of lead wire of electronic component |
JPS577200A (en) * | 1980-06-17 | 1982-01-14 | Hitachi Ltd | Device for positioning wire pattern |
-
1982
- 1982-09-07 JP JP57154493A patent/JPS5944891A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5638900A (en) * | 1979-09-07 | 1981-04-14 | Pioneer Electronic Corp | Device for inspecting chip mount |
JPS5649908A (en) * | 1979-09-29 | 1981-05-06 | Pioneer Electronic Corp | Illuminating method for discrimination of pattern of printed substrate |
JPS56124001A (en) * | 1980-03-05 | 1981-09-29 | Hitachi Ltd | Measuring method for position of tip of lead wire of electronic component |
JPS577200A (en) * | 1980-06-17 | 1982-01-14 | Hitachi Ltd | Device for positioning wire pattern |
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