JPS6025405A - Input system for image of solder surface - Google Patents
Input system for image of solder surfaceInfo
- Publication number
- JPS6025405A JPS6025405A JP13275683A JP13275683A JPS6025405A JP S6025405 A JPS6025405 A JP S6025405A JP 13275683 A JP13275683 A JP 13275683A JP 13275683 A JP13275683 A JP 13275683A JP S6025405 A JPS6025405 A JP S6025405A
- Authority
- JP
- Japan
- Prior art keywords
- solder surface
- camera
- hemispherical
- solder
- light sources
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/28—Measuring arrangements characterised by the use of optical techniques for measuring areas
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（技術分野）
この発明はプリント基板の半田面自動検査における半田
面映像の人力方式の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to an improvement in a manual method of visualizing a solder surface in automatic inspection of a solder surface of a printed circuit board.
（従来技術とその問題点）
半田面の不良とは２通常、未半田と半田ブリッジと半田
過不足を指すが、従来、この半田面の良否判定はコンタ
クトビンな半田面に接触させて抵抗値を測定する。いわ
ゆるインサーキットテスクに依るか、その外観を目視で
検査することがほとんどであった。また従来の半田面外
観検査の自動化例としては数例あるが、その中で光切断
線による映像人力方式の構成を第１図に示し、これを以
下に説明する。プリント基板１上の検査対象である半田
面２の上方には、スリット光３を発生ずる光源４が配置
され、スリット光３は半田面２及びプリント基板１上に
光切断線５として投影される。(Prior art and its problems) Defective solder surfaces usually refer to unsoldered, solder bridges, and excess or insufficient solder, but conventionally, the quality of the solder surface has been determined by contacting the solder surface with a contact bottle and measuring the resistance value. Measure. Most of the time, the external appearance was visually inspected by so-called in-circuit testing. Furthermore, there are several examples of automation of the conventional solder surface appearance inspection, and among them, the configuration of a visual manual system using an optical cutting line is shown in FIG. 1, and will be described below. A light source 4 that generates slit light 3 is placed above the solder surface 2 to be inspected on the printed circuit board 1, and the slit light 3 is projected onto the solder surface 2 and the printed circuit board 1 as a light cutting line 5. .
またＩ’ Ｖカメラ６は半田面２のが１め上方に配置さ
れている。この状態でプリント基板１を光切断線５の直
角方向に微小ピンチで水平移動させ、半日」面２を横ぎ
る光切断線５の形状及び長さの食代を’ｉ’ ｖカメラ
６で検出し、半田面２の立体形状の情報なｔ＋ることで
、半田面２の良否の判定を行っていた。１−かしながら
、この検出方式は、半田面２０３次元形状が精密に検出
できるものの、半田面２に対して相対的にスリット光３
を機械的あるいは光学的に走査する必要があり、半田面
自動検査装置としては時間がかかるという問題がある。Further, the I'V camera 6 is placed above the solder surface 2. In this state, the printed circuit board 1 is horizontally moved in a direction perpendicular to the optical cutting line 5 with a slight pinch, and the shape and length of the optical cutting line 5 that crosses the half-day plane 2 is detected by the 'i' v camera 6. However, the quality of the solder surface 2 was determined based on information about the three-dimensional shape of the solder surface 2 (t+). 1- However, although this detection method can accurately detect the three-dimensional shape of the solder surface 20, the slit light 3
It is necessary to scan mechanically or optically, and there is a problem in that it is time-consuming for automatic solder surface inspection equipment.
また、光切断線５の変化から半田面２の立体画像を計算
して良否判定を行うことは、ノ・−ドウエアの構成も複
雑で計算機での処理時間がかかる等、多くの生産現場に
適用して実用化するには問題が残っている。In addition, calculating the three-dimensional image of the solder surface 2 based on the change in the optical cutting line 5 to determine the quality is not applicable to many production sites because the hardware configuration is complicated and the computer processing time is long. There are still problems to be solved and put into practical use.
（目的）
この発明はプリント基板の半田面を照射するのに、ＴＶ
右カメラ光軸を中心軸として半球状あるいは円筒状ある
いは円錐状に複数光源を配置したことを特徴とし、その
目的は半田面の映像取込みのための光源の走査を不要と
するものである。またこの発明の他の目的は半田面を高
輝度反射させることにより、ランド銅箔と半田面の識別
を容易にするものである。(Purpose) This invention uses a TV to irradiate the solder surface of a printed circuit board.
It is characterized by a plurality of light sources arranged in a hemispherical, cylindrical, or conical shape with the right camera optical axis as the center axis, and its purpose is to eliminate the need for scanning the light source to capture images of the solder surface. Another object of the present invention is to make it easier to identify the land copper foil and the solder surface by reflecting the solder surface with high brightness.
（実施例）
前記目的を達成するための本発明の着目点は次の通りで
ある。半田面はこれが形成されて時間が経過しない間は
かなりの反射特性を持つ。このような特性自体が半田面
と他の対象物とを識別するための状報源であることに着
目したものである。(Example) The points of interest of the present invention for achieving the above object are as follows. The solder surface has significant reflective properties until after it has been formed. The present invention focuses on the fact that such characteristics themselves are a source of condition information for distinguishing the solder surface from other objects.
この高輝度部分を半田面の情報とするためには。In order to use this high brightness area as information on the solder surface.
この高輝度部分を半田面のほぼ全面に拡大する必要があ
る。このような理想状態を寿るためには照明方法に特殊
な条件を必要とするが実際」−はイ傘めて困難である。It is necessary to expand this high-brightness portion to almost the entire solder surface. In order to maintain this ideal state, special conditions are required for the lighting method, but in reality it is difficult to achieve this.
しかし、複数のＩＨ＜４明源にすればこのような状態を
近似的に実現できる。However, by using a plurality of IH<4 bright sources, such a state can be approximately realized.
以下この発明の実施例を第２図により説明する。An embodiment of the present invention will be described below with reference to FIG.
プリント基板１０半田面２の垂ＩＭ上方には、レンズ７
とフィルター８を有したｌ’ Ｖ Ｊｚメラ６が配置さ
れてし・る。半球状光源９は′１′■カメラ６に固持さ
れていて、外枠の半球状部材■０と、この内面に源の外
枠を円筒状部材１０’とし７円筒状光源１２として構成
した第２の実施例である。第４図は光り【１（の外枠を
円錐状部材１σとし１円台１［状光源１３として構成し
た第３の実施例である。第５図は第２図の点光源１１に
かえて線光源１１′を拶数配置して半球状光源９′を構
成した第４の実施例である。第６図は第２図の点光源１
１の内側に２％定の光の波長を通過させる半透明体１４
を半球状に配置し９面光源による半球状光源９′を構成
した第５の実施例である。Above the vertical IM on the solder surface 2 of the printed circuit board 10 is a lens 7.
A l'V Jz camera 6 having a filter 8 and a filter 8 is arranged. The hemispherical light source 9 is fixed to the camera 6, and has a hemispherical member 0 as an outer frame, and a cylindrical light source 12 with a cylindrical member 10' serving as the outer frame of the source on its inner surface. This is Example 2. FIG. 4 shows a third embodiment in which the outer frame of the light [1] is made into a conical member 1σ and is configured as a circular base 1 [shaped light source 13. FIG. This is a fourth embodiment in which a hemispherical light source 9' is constructed by arranging linear light sources 11' in diagonal numbers.
A translucent body 14 that allows 2% of the wavelength of light to pass through inside the body 1
This is a fifth embodiment in which a hemispherical light source 9' is formed by arranging the light beams in a hemispherical manner and is a nine-sided light source.
第７図は第２図の点光源１１の内側に、内面あるいは外
面が凹凸形状−を有する透明体１５を半球状に配置し７
面光源による半球状光源９“を構成した第６の実施例で
ある。また、第３図及び第４図の円筒状光源１２及び円
錐状光源１３についても、第５〜７図の実施例を容易に
適用できることは自明である。FIG. 7 shows a transparent body 15 having an uneven inner or outer surface arranged in a hemispherical shape inside the point light source 11 of FIG. 2.
This is a sixth embodiment in which a hemispherical light source 9'' is formed by a surface light source.Also, the cylindrical light source 12 and the conical light source 13 in FIGS. 3 and 4 are similar to the embodiments in FIGS. It is obvious that it can be easily applied.
第８図は本発明の光源による人力画像例であって。FIG. 8 is an example of a human-powered image using the light source of the present invention.
ＴＶカメラ６でとらえた同−視野内に未半田のランド１
６と半田面２が存在している場合、半田面２のみが高輝
度反射するのでランド１６と半田面２とは容易に識別で
きる。また、半田面２とランド１６との明度差が大きく
とれるため、２値化による識別も容易で９人力画像によ
る計算機（図示しない）の処理を短時間で行える。なお
、フィルター８゜半透明体１４．透明体１５は半田面２
と他の部分の明度差をつけるだめの補助手段であり、フ
ィルタ８は緑色系のものが好都合である。The same image captured by TV camera 6 - unsoldered land 1 within the field of view
When the land 16 and the solder surface 2 are present, the land 16 and the solder surface 2 can be easily distinguished because only the solder surface 2 reflects with high brightness. Further, since the difference in brightness between the solder surface 2 and the land 16 is large, identification by binarization is easy, and processing using a computer (not shown) using nine manual images can be performed in a short time. Note that the filter 8° semi-transparent body 14. The transparent body 15 is the solder surface 2
This is an auxiliary means for creating a difference in brightness between the image and other parts, and the filter 8 is preferably of a greenish color.
（効果）
以上述べたごとく２本発明による映像人力方式によれば
、照明装置を光学的あるいは１機械的に走査することな
く、半田面の形状を高輝度反射像として取込めることか
ら、映画処理時間を大幅に短縮できる。また、検査装置
としてのノ・−ドウエアの構成も、２値化処理による簡
素化か可能で。(Effects) As described above, according to the video manual method according to the present invention, the shape of the solder surface can be captured as a high-intensity reflected image without optically or mechanically scanning the illumination device. It can save you a lot of time. Furthermore, the configuration of the software used as the inspection device can be simplified by using binarization processing.
安価な半田面検査装置を提供できる。An inexpensive solder surface inspection device can be provided.
第１図は従来の光切断線による映像人力方式の説明図、
第２〜８図は本発明の実施例を示し、第２図は半球状光
源、第３図は円筒状光源、第４図は円錐状光臨、第５〜
７図は他の実施例による半球状光源、第８図は半日」而
の人力映像例である。
１ニブリント基板、２：半田面、６：ｉ’Ｖカメラ、７
：レンズ、９．９’９”：半球状光ゆ；＜、１１：黒光
４Ｊ、１２：円筒状光源、１３：円ヲ１［状光源。Figure 1 is an explanatory diagram of the conventional human-powered video system using optical cutting lines.
2 to 8 show embodiments of the present invention, in which FIG. 2 shows a hemispherical light source, FIG. 3 shows a cylindrical light source, FIG. 4 shows a conical light source, and FIG.
FIG. 7 shows a hemispherical light source according to another embodiment, and FIG. 8 shows an example of a half-day human-powered image. 1 Niblint board, 2: Solder surface, 6: i'V camera, 7
: Lens, 9.9'9": Hemispherical light source; <, 11: Black light 4J, 12: Cylindrical light source, 13: Circular light source.
Claims (1)
判定するプリント基板の半田面自動検査装置ニオイて、
前記１゛Ｖカメラの光軸を中心軸として半球状又は円筒
状又は円錐状に配置した複数の光源によって、前記プリ
ント基板を照射して前記半田面の映像を取込むようにし
たことを特徴とする半田面映像の入力方式。I smelled the automatic solder surface inspection equipment for printed circuit boards that uses an i'V camera to judge the quality of the solder surfaces on printed circuit boards.
The printed circuit board is irradiated with a plurality of light sources arranged in a hemispherical, cylindrical, or conical shape with the optical axis of the 1゛V camera as the central axis, and an image of the soldering surface is captured. Input method for solder side video.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13275683A JPS6025405A (en) | 1983-07-22 | 1983-07-22 | Input system for image of solder surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13275683A JPS6025405A (en) | 1983-07-22 | 1983-07-22 | Input system for image of solder surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6025405A true JPS6025405A (en) | 1985-02-08 |
Family
ID=15088816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13275683A Pending JPS6025405A (en) | 1983-07-22 | 1983-07-22 | Input system for image of solder surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6025405A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61293657A (en) * | 1985-06-21 | 1986-12-24 | Matsushita Electric Works Ltd | Method for inspecting soldering appearance |
| US6441820B2 (en) * | 1998-01-23 | 2002-08-27 | Pixar Animation Studios | Pseudo area lights |
| WO2021199513A1 (en) * | 2020-03-30 | 2021-10-07 | オムロン株式会社 | Inspection device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5671173A (en) * | 1979-11-14 | 1981-06-13 | Hitachi Ltd | Pattern detection method of printed circuit substrate |
-
1983
- 1983-07-22 JP JP13275683A patent/JPS6025405A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5671173A (en) * | 1979-11-14 | 1981-06-13 | Hitachi Ltd | Pattern detection method of printed circuit substrate |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61293657A (en) * | 1985-06-21 | 1986-12-24 | Matsushita Electric Works Ltd | Method for inspecting soldering appearance |
| JPH055281B2 (en) * | 1985-06-21 | 1993-01-22 | Matsushita Electric Works Ltd | |
| US6441820B2 (en) * | 1998-01-23 | 2002-08-27 | Pixar Animation Studios | Pseudo area lights |
| USRE40224E1 (en) | 1998-01-23 | 2008-04-08 | Pixar | Pseudo area lights |
| WO2021199513A1 (en) * | 2020-03-30 | 2021-10-07 | オムロン株式会社 | Inspection device |
| JP2021162331A (en) * | 2020-03-30 | 2021-10-11 | オムロン株式会社 | Inspection device |
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