JPS5944185B2 - Fixing device for ceramic surface plate for polishing - Google Patents

Fixing device for ceramic surface plate for polishing

Info

Publication number
JPS5944185B2
JPS5944185B2 JP57034259A JP3425982A JPS5944185B2 JP S5944185 B2 JPS5944185 B2 JP S5944185B2 JP 57034259 A JP57034259 A JP 57034259A JP 3425982 A JP3425982 A JP 3425982A JP S5944185 B2 JPS5944185 B2 JP S5944185B2
Authority
JP
Japan
Prior art keywords
surface plate
ceramic surface
ceramic
ring
fixing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57034259A
Other languages
Japanese (ja)
Other versions
JPS58155168A (en
Inventor
知 橘田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Kikai Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Kikai Kogyo KK filed Critical Fujikoshi Kikai Kogyo KK
Priority to JP57034259A priority Critical patent/JPS5944185B2/en
Publication of JPS58155168A publication Critical patent/JPS58155168A/en
Publication of JPS5944185B2 publication Critical patent/JPS5944185B2/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces
    • B24B37/32Retaining rings

Description

【発明の詳細な説明】 本発明は半導体ウェハーのポリシンク工程に用いられる
セラミック定盤を定盤受けに固定するための固定装置に
関し、一層詳細にはポリシンク用セラミック定盤に押え
リングを嵌着し、この押えリングを定盤受けに固定する
ことによつて前記ポリシンク用セラミック定盤(以下単
にセラミック定盤と略称する)を固定する装置に関する
[Detailed Description of the Invention] The present invention relates to a fixing device for fixing a ceramic surface plate used in a polysinking process of semiconductor wafers to a surface plate holder, and more specifically, a fixing device for fitting a retaining ring to a ceramic surface plate for polysinking. The present invention relates to a device for fixing the ceramic surface plate for polysink (hereinafter simply referred to as ceramic surface plate) by fixing this presser ring to the surface plate holder.

半導体ウェハーのポリシンクにおいては、研磨ウェハー
に高精度の平坦度が要求されるため、この高精度の平坦
度を維持できる研磨定盤が必要となる。すなわちこの種
の定盤では、第1に化学的研磨液に腐蝕しないこと、第
2に硬いこと、第3に熱変形に強いこと、の3条件を充
足することが必要である。このため最近では、これらの
3条件をよりよく充足するものとして、従来のステンレ
ス鋼にかわつて、セラミック製の定盤が使われている。
従来、セラミック定盤を定盤受けに固定する装置として
通常採用されているのは、第1図に示したように、セラ
ミック定盤1の底面に数ケ所凹部2(1つのみ図示)を
形成し、この凹部2にタップ加工を施した金属ブロック
3をそれぞれ埋め込んで接着し、前記金属ブロック3を
定盤受け4にボルト5で固定する装置である。ところが
この装置によると、金属ブロック3との接合面において
、セラミック定盤1が欠けたり、ひびが入つたりしやす
いほか、セラミック定盤1と金属ブロック3との接着状
態を維持することが困難であり、゛しばしば金属ブロッ
ク1がはがれてしまうという欠点がある。また、セラミ
ック定盤1を焼くとその大きさが変化するため、凹部2
の寸法精度を出すことが困難であつて、金属ブロック3
を前記凹部2内に緊密に埋め込んで接着することが困難
であるという欠点がある。さらには、セラミック定盤1
の底面を数個所で定盤受け4に固定するにすぎないから
、特にセラミック定盤1が大きい場合には、確実な固定
が望めないという欠点がある。本発明は、このような欠
点を解消したセラミック定盤の固定装置を提供すること
を目的とし、その特徴は、周面に係合部が形成されたセ
ラミック定盤と、このセラミック定盤に嵌着される弾性
リングと、前記セラミック定盤の周面にならつて内周面
が形成され、前記弾性リングを介して前記セラミック定
盤に嵌着される一方、定盤受けに適宜固定部材によつて
固定される押えリングとから成るところにある。以下、
本発明の好適な実施例を添付図面の第2図及び第3図に
基づいて詳細に説明する。
In polysinking semiconductor wafers, the polished wafer is required to have highly accurate flatness, so a polishing surface plate that can maintain this highly accurate flatness is required. That is, this type of surface plate must satisfy three conditions: first, it should not be corroded by chemical polishing liquid, second, it should be hard, and third, it should be resistant to thermal deformation. For this reason, ceramic surface plates have recently been used instead of the conventional stainless steel to better satisfy these three conditions.
Conventionally, the device usually used to fix a ceramic surface plate to a surface plate holder is to form several recesses 2 (only one is shown) on the bottom surface of a ceramic surface plate 1, as shown in Fig. 1. In this device, tapped metal blocks 3 are respectively embedded in the recesses 2 and bonded together, and the metal blocks 3 are fixed to the surface plate support 4 with bolts 5. However, with this device, the ceramic surface plate 1 is easily chipped or cracked at the joint surface with the metal block 3, and it is difficult to maintain the adhesive state between the ceramic surface plate 1 and the metal block 3. However, there is a drawback that the metal block 1 often peels off. Also, since the size of the ceramic surface plate 1 changes when it is fired, the concave portion 2
It is difficult to achieve dimensional accuracy of metal block 3.
There is a drawback in that it is difficult to tightly embed and bond the material into the recess 2. Furthermore, ceramic surface plate 1
Since the bottom surface of the ceramic surface plate 1 is fixed to the surface plate holder 4 at only a few places, there is a drawback that reliable fixation cannot be expected, especially when the ceramic surface plate 1 is large. An object of the present invention is to provide a fixing device for a ceramic surface plate that eliminates such drawbacks, and its features include a ceramic surface plate having an engaging portion formed on its circumferential surface, and a device that fits into the ceramic surface plate. An elastic ring is attached to the ceramic surface plate, and an inner circumferential surface is formed to follow the circumferential surface of the ceramic surface plate. It consists of a presser ring and a presser ring that is fixed in place. below,
A preferred embodiment of the present invention will be described in detail with reference to FIGS. 2 and 3 of the accompanying drawings.

10はセラミック定盤であり、その周面全周にわたつて
上面から厚み方向のほぼ中央に及ぶように面取り加工が
施され、テーパー状の係合部11が形成されている。
Reference numeral 10 denotes a ceramic surface plate, which is chamfered over its entire circumference from the top surface to approximately the center in the thickness direction, and a tapered engagement portion 11 is formed.

前記セラミック盤10の周面には、弾性リングたるゴム
リング12が嵌着され、さらにこのゴムリング12を介
して、内周面が前記セラミツク定盤10の周面にならつ
て厚み方向のほぼ中央から上面に向けてテーパー状に縮
径するよう形成された押えリング13が嵌着されている
。前記押えリング13の上面は、前記セラミツタ定盤1
0の上面よりも若干下方に位置している。そして、前記
押えリング13は数ケ所において、定盤受け14に固定
部材たるボルト15によつて固定されている。本実施例
においては係合部11をテーパー状に形成したから、セ
ラミツク定盤10を定盤受け14に固定する際に芯出し
が容易であるという利点がある。
A rubber ring 12, which is an elastic ring, is fitted onto the circumferential surface of the ceramic plate 10, and the inner circumferential surface is aligned with the circumferential surface of the ceramic surface plate 10 through the rubber ring 12, so that the inner circumferential surface is aligned approximately at the center in the thickness direction. A presser ring 13 is fitted with a presser ring 13 that is formed so as to taper in diameter toward the upper surface. The upper surface of the presser ring 13 is connected to the ceramic ivy surface plate 1.
It is located slightly below the top surface of 0. The presser ring 13 is fixed to the surface plate support 14 at several locations with bolts 15 serving as fixing members. In this embodiment, since the engaging portion 11 is formed into a tapered shape, there is an advantage that centering is easy when fixing the ceramic surface plate 10 to the surface plate support 14.

なお、係合部11は常にテーパー状に形成する必要はな
く、たとえば段差状など、セラミツク定盤10が押えリ
ング13から脱却することを阻止しえる形状であればい
かなるものでもよい。このようにして本発明によれば次
の如き諸効果を挙げることができる。
It should be noted that the engaging portion 11 does not always need to be formed in a tapered shape, and may have any shape, such as a stepped shape, as long as it can prevent the ceramic surface plate 10 from coming off the presser ring 13. In this way, according to the present invention, the following effects can be achieved.

第1に、従来の如くセラミツク定盤に金属プロツクを埋
め込み接着するための凹部を形成する必要がないから、
その製造が極めて容易になる。第2に、セラミツク定盤
を定盤受けに固定した押えリングによつて全周面で押え
るから、セラミツク定盤の周縁部分を保護するとともに
、確実に定盤受けに固定することが可能となり、また、
従来のように一部分の締め付けによるセラミツク定盤の
変形が起らない。第3に、弾性リングを介してセラミツ
ク定盤に押えリングを嵌着するから、セラミツク定盤周
面と押えリング内周面とに若干の誤差があつても弾性リ
ングによつて吸収されるため、特にセラミツク定盤の製
造に高い寸法精度を必要とすることなく、確実な固定を
行うことができる。以上、本発明の好適な実施例を挙げ
て種冫説明してきたが、本発明が上述した実施例に限定
されないことはいうまでもなく、発明の精神を逸脱しな
い範囲内で多くの改変を施こしうることはもちろんであ
る。
First, there is no need to form a recess for embedding and bonding the metal block in the ceramic surface plate as in the past.
Its manufacture becomes extremely easy. Second, since the ceramic surface plate is held down on its entire circumference by the retaining ring fixed to the surface plate holder, it is possible to protect the periphery of the ceramic surface plate and securely fix it to the surface plate holder. Also,
There is no deformation of the ceramic surface plate due to partial tightening as in the conventional case. Thirdly, since the presser ring is fitted to the ceramic surface plate through the elastic ring, even if there is a slight error between the circumferential surface of the ceramic surface plate and the inner circumferential surface of the presser ring, it is absorbed by the elastic ring. In particular, it is possible to securely fix the ceramic surface plate without requiring high dimensional accuracy in manufacturing it. Although the present invention has been explained in detail by citing preferred embodiments above, it goes without saying that the present invention is not limited to the above-mentioned embodiments, and many modifications can be made without departing from the spirit of the invention. Of course it can be difficult.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来例における固定状態を示す要部の縦断面図
、第2図は本発明の一実施例における固定状態を示す要
部の縦断面図、第3図は同じく同状態の全体平面図であ
る。 1・・・・・・セラミツク定盤、2・・・・・・凹部、
3・・・・・・金属プロツク、4・・・・・・定盤受け
、5・・・・・・ボルト、10・・・・・・セラミツク
定盤、11・・・・・・係合部、12・・・・・・ゴム
リング、13・・・・・・押えリング、14・・・・・
・定盤受け、15・・・・・・ボルト。
FIG. 1 is a longitudinal cross-sectional view of the main part showing the fixed state in a conventional example, FIG. 2 is a longitudinal cross-sectional view of the main part showing the fixed state in an embodiment of the present invention, and FIG. 3 is a general plan view of the same state. It is a diagram. 1... Ceramic surface plate, 2... Concavity,
3... Metal block, 4... Surface plate support, 5... Bolt, 10... Ceramic surface plate, 11... Engagement Part, 12... Rubber ring, 13... Presser ring, 14...
・Surface plate support, 15... bolts.

Claims (1)

【特許請求の範囲】[Claims] 1 周面に係合部が形成されたポリシンク用セラミック
定盤と、このポリシンク用セラミック定盤に嵌着される
弾性リングと、前記ポリシンク用セラミック定盤の周面
にならつて内周面が形成され、前記弾性リングを介して
前記ポリシンク用セラミック定盤に嵌着される一方、定
盤受けに適宜な固定部材によつて固定される押えリング
とから成ることを特徴とするポリシンク用セラミック定
盤の固定装置。
1. A ceramic surface plate for polysink having an engaging portion formed on its peripheral surface, an elastic ring fitted to this ceramic surface plate for polysink, and an inner peripheral surface formed to follow the peripheral surface of the ceramic surface plate for polysink. and a presser ring that is fitted to the ceramic surface plate for polysink via the elastic ring and fixed to the surface plate holder by an appropriate fixing member. fixation device.
JP57034259A 1982-03-04 1982-03-04 Fixing device for ceramic surface plate for polishing Expired JPS5944185B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57034259A JPS5944185B2 (en) 1982-03-04 1982-03-04 Fixing device for ceramic surface plate for polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57034259A JPS5944185B2 (en) 1982-03-04 1982-03-04 Fixing device for ceramic surface plate for polishing

Publications (2)

Publication Number Publication Date
JPS58155168A JPS58155168A (en) 1983-09-14
JPS5944185B2 true JPS5944185B2 (en) 1984-10-27

Family

ID=12409171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57034259A Expired JPS5944185B2 (en) 1982-03-04 1982-03-04 Fixing device for ceramic surface plate for polishing

Country Status (1)

Country Link
JP (1) JPS5944185B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60109859U (en) * 1983-12-28 1985-07-25 株式会社 デイスコ Semiconductor wafer surface grinding equipment
JPH0644594Y2 (en) * 1986-10-30 1994-11-16 京セラ株式会社 Ceramic board
EP0348757B1 (en) * 1988-06-28 1995-01-04 Mitsubishi Materials Silicon Corporation Method for polishing a silicon wafer
JPH079330A (en) * 1993-06-23 1995-01-13 Takahiro Imahashi Ultraprecise surface polishing method and device
CN104002229B (en) * 2014-06-06 2017-05-10 哈尔滨电气动力装备有限公司 Hydraulic geometrical shape grinding device for static slip ring of hydrodynamic mechanical seal
CN107538342A (en) * 2016-06-24 2018-01-05 上海新昇半导体科技有限公司 A kind of wafer supports board component, burnishing device and wafer precise polishing method

Also Published As

Publication number Publication date
JPS58155168A (en) 1983-09-14

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