JPS58155168A - Apparatus for fixing polishing ceramic surface plate - Google Patents
Apparatus for fixing polishing ceramic surface plateInfo
- Publication number
- JPS58155168A JPS58155168A JP57034259A JP3425982A JPS58155168A JP S58155168 A JPS58155168 A JP S58155168A JP 57034259 A JP57034259 A JP 57034259A JP 3425982 A JP3425982 A JP 3425982A JP S58155168 A JPS58155168 A JP S58155168A
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- ceramic surface
- ceramic
- ring
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
Abstract
Description
【発明の詳細な説明】
本発明は半導体ウェハーのポリリング工程に用いられる
セラミック定盤を定盤受けに固定するた°めの固定装置
に関し、一層詳細にはボリシング用セラミック定盤に押
えリングを嵌着し、この押えリングを定盤受けに固定す
ることによって前記ポリシング用セラミック定盤（以下
単にセラミック定盤と略称する）を固定する装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a fixing device for fixing a ceramic surface plate to a surface plate holder used in the polishing process of semiconductor wafers, and more specifically to a fixing device for fixing a holding ring to a ceramic surface plate for boring. The present invention relates to a device for fixing the ceramic surface plate for polishing (hereinafter simply referred to as ceramic surface plate) by fitting and fixing this presser ring to the surface plate holder.
半導体ウェハーのボリシングにおいては、研磨ウェハー
に高精度の平坦度が要求されるため、この高精度の平坦
度を維持できる研磨定盤が必要となる。すなわちこの種
の定盤では、第１に化学的研磨液に腐蝕しないこと、第
２に硬いこと、第ろζ二煎変形に強いこと、の６条件を
充足することが必要である。このため最近では、これら
の３条件をよりよく充足するものとして、従来のステン
レ。In the polishing of semiconductor wafers, highly accurate flatness of the polished wafer is required, and therefore a polishing surface plate that can maintain this highly accurate flatness is required. That is, this type of surface plate must satisfy six conditions: first, it should not be corroded by chemical polishing liquid, second, it should be hard, and second, it should be resistant to deformation. Therefore, recently, conventional stainless steel has been developed as a material that better satisfies these three conditions.
ス鋼にかわって、セラミック製の定盤が使われている。Ceramic surface plates are used instead of steel.
従来、セラミック定盤を定盤受けに固定する装置として
通常採用されているのは、第１図に示したように、セラ
ミック定盤１の底面に数ケ所凹部２（１つのみ図示）を
形成し、この凹部２にタップ加工を施した金属ブロック
３をそれぞれ埋め込んで接着し、前記金属ブロック３を
定盤受け４にポルト５で固定する装置である。ところが
この装置によると、金属ブロック３との接合面において
、セラミック定盤１が欠けたり、ひびが入ったりしやす
いほか、セラミック定盤１と金属ブロツク３との接着状
態を維持することが困難であり、しばしば金属ブロック
１がはがれてしまうという欠点がある。また、セラミッ
ク定盤１を焼くとその大きさが変化するため、凹部２の
寸法精度を出すことが困難であって、金属ブロック３を
前記凹部２内に緊密に埋め込んで接着することが困難で
あるという欠点がある。さらには、セラミック定盤１の
底面を数個所で定盤受け°４に固定するにすぎないから
、特にセラミック定盤１が大きい場合には、確実な固定
が望めないという欠点がある。Conventionally, as shown in Fig. 1, the device usually used for fixing a ceramic surface plate to a surface plate holder is a device in which several recesses 2 (only one is shown) are formed on the bottom surface of a ceramic surface plate 1. In this device, tapped metal blocks 3 are respectively embedded in the recesses 2 and bonded together, and the metal blocks 3 are fixed to the surface plate holder 4 with ports 5. However, with this device, the ceramic surface plate 1 is easily chipped or cracked at the joint surface with the metal block 3, and it is difficult to maintain the adhesive state between the ceramic surface plate 1 and the metal block 3. However, there is a drawback that the metal block 1 often peels off. Furthermore, since the size of the ceramic surface plate 1 changes when it is fired, it is difficult to achieve dimensional accuracy of the recess 2, and it is difficult to embed the metal block 3 tightly in the recess 2 and bond it. There is a drawback. Furthermore, since the bottom surface of the ceramic surface plate 1 is fixed to the surface plate support 4 at only a few places, there is a drawback that reliable fixing cannot be expected, especially when the ceramic surface plate 1 is large.
本発明は、このような欠点を解消したセラミック定盤の
画定装置を提供することを目的とし、その特徴は、局面
に係合部が形成されたセラミック定盤と、このセラミッ
ク定盤に嵌着される弾性リングと、前記セラミック定盤
の局面にならって内周面が形成され、前記弾性リングを
介して前記セラミック定盤に嵌着される一方、定盤受け
に適宜固定部材によって固定される押えリングとから成
るところにある。The present invention aims to provide a ceramic surface plate defining device that eliminates such drawbacks, and its features include a ceramic surface plate having an engaging portion formed on its curved surface, and a device that fits into the ceramic surface plate. an elastic ring having an inner peripheral surface formed in accordance with the curve of the ceramic surface plate, and is fitted to the ceramic surface plate via the elastic ring, and is fixed to the surface plate support by an appropriate fixing member. It consists of a presser ring.
以下、本発明の好適な実施例を添付図面の第２図及び第
６図に基づいて詳細に説明する。Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. 2 and 6 of the accompanying drawings.
１０はセラミック定盤であり、その局面全周にわたって
上面から厚み方向のほぼ中央に及ぶように面取り加工が
施され、テーパー状の係合部１１が形成されている。前
記セラミック盤１０の局面には、弾性リングたるゴムリ
ング１２が嵌着され、さらにこのゴムリング１２を介し
て、内周面が前記セラミック定盤１０の局面にならって
厚み方向のほぼ中央から上面に向けてテーパー状に縮径
するよう形成された押えリン、グ１３が嵌着されている
。前記押えリング１３の上面は、前記セラミック定盤１
０の上面よりも若干下方に位置している。Reference numeral 10 denotes a ceramic surface plate, which is chamfered over its entire circumference from the top surface to approximately the center in the thickness direction, thereby forming a tapered engagement portion 11. A rubber ring 12, which is an elastic ring, is fitted onto the curved surface of the ceramic plate 10, and the inner circumferential surface follows the curved surface of the ceramic surface plate 10 from approximately the center in the thickness direction to the upper surface via the rubber ring 12. A presser ring 13 is fitted, which is formed so as to taper in diameter. The upper surface of the presser ring 13 is connected to the ceramic surface plate 1.
It is located slightly below the top surface of 0.
そして、前記押えリング１３は数ケ所において、定盤受
け１４に固定部材たるボルト１５によって固定されてい
る。The presser ring 13 is fixed to the surface plate support 14 at several locations by bolts 15 serving as fixing members.
本実施例においては係合部１１をテーパー状に形成した
から、セラミック定盤１０を定盤受け１４に固定する際
に芯出しが容易であるという利点がある。なお、係合部
１１は常にテーパー状に形成する必要はなく、たとえば
段差状など、セラミック定盤１０が押えリング１３から
脱却することを阻止しえる形状であればいかなるもので
もよい。In this embodiment, since the engaging portion 11 is formed into a tapered shape, there is an advantage that centering is easy when fixing the ceramic surface plate 10 to the surface plate support 14. Note that the engaging portion 11 does not always have to be formed in a tapered shape, and may have any shape, such as a stepped shape, as long as it can prevent the ceramic surface plate 10 from coming off the presser ring 13.
このようにして本発明によれば次の如き諸効果を挙げる
ことができる。第１に、従来の如くセラミック定盤に金
属ブロックを埋め込み接着するための凹部を形成する必
要がないから、その製造が１極めて容易になる。第２に
、セラミック定盤を定盤受けに固定した押えリングによ
って全周面で押えるから、セラミック定盤の周縁部分を
保護するとともに、確実に定盤受けに固定することが可
能となり、また、従来のように一部分の締め付けによる
セラミック定盤の変形が起らない。第６に、弾性リング
を介してセラミック定盤に押えリングを嵌着するから、
セラミック定盤局面と押えリング内周面とに若干の誤差
があっても弾性リングによって吸収されるため、特にセ
ラミック定盤の製造に高い寸法精度を必要とすることな
く、確実な固定を行うことができる。In this way, according to the present invention, the following effects can be achieved. First, since there is no need to form a recess for embedding and bonding a metal block in a ceramic surface plate as in the past, manufacturing thereof becomes extremely easy. Second, since the ceramic surface plate is held down on its entire circumference by the retainer ring fixed to the surface plate holder, the peripheral edge of the ceramic surface plate can be protected and it can be securely fixed to the surface plate holder. There is no deformation of the ceramic surface plate due to partial tightening unlike in the past. Sixth, since the presser ring is fitted to the ceramic surface plate via the elastic ring,
Even if there is a slight error between the ceramic surface plate surface and the inner circumferential surface of the presser ring, it is absorbed by the elastic ring, so it is possible to securely fix the ceramic surface plate without requiring high dimensional accuracy. I can do it.
以上、本発明の好適な実施例を挙げて種々説明してきた
が、本発明が上述した実施例に限定されないことはいう
までもなく、発明の精神を逸脱しない範囲内で多くの改
変を施こしうろことはもちろんである。Although various embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to the embodiments described above, and many modifications can be made without departing from the spirit of the invention. Of course there are scales.
第１図は従来例における固定状態を示す要部の縦断面図
、第２図は本発明の一実施例における固定状態を示す要
部の縦断面図、第６図は同じく同状態の全体平面図であ
る。
１・・・・・・・・・セラミック定盤 ２・・・・・
・・・・凹部３・・・・・・・・・金属ブロック ４
・・・・・・・・・定盤受け５・・・・・・・ボルト
１０・・・・・・・・セラミック定盤１１・・・・・
・・・係合部 １２・・・・・・・・・ゴムリンク１
３・・・・・・・・・押えリング １４・・・・・・
・・・定盤受け１５・・・・・・・ボルト
特許出願人
不二越機械工業株式会社
代表者市川知命FIG. 1 is a longitudinal cross-sectional view of the main part showing the fixed state in a conventional example, FIG. 2 is a longitudinal cross-sectional view of the main part showing the fixed state in an embodiment of the present invention, and FIG. 6 is a general plan view of the same state. It is a diagram. 1... Ceramic surface plate 2...
・・・・・・Recess 3 ・・・・・・Metal block 4
......Surface plate support 5...Bolt
10... Ceramic surface plate 11...
...Engagement part 12...Rubber link 1
3...... Presser ring 14...
... Surface plate support 15 ... Bolt patent applicant Tomomi Ichikawa, representative of Fujikoshi Machine Industry Co., Ltd.
Claims (1)
と、このボリンング用セラミック定盤に嵌着される弾性
リングと、前記ボリンング用セラミック定盤の局面にな
らって内゛局面が形成され、前記弾性リングを介して前
記ポリシング用セラミック定盤に嵌着される一方、定盤
受けに適宜な固定部材によって固定される押えリングと
から成ることを特徴とするポリシング用セラミック定盤
の固定装置。A ceramic surface plate for boring having an engaging portion formed on its curved surface; an elastic ring fitted to the ceramic surface plate for boring; an inner curved surface formed in the shape of the ceramic surface plate for boring; A fixing device for a ceramic surface plate for polishing, comprising a retainer ring that is fitted onto the ceramic surface plate for polishing via an elastic ring and is fixed to the surface plate holder by an appropriate fixing member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57034259A JPS5944185B2 (en) | 1982-03-04 | 1982-03-04 | Fixing device for ceramic surface plate for polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57034259A JPS5944185B2 (en) | 1982-03-04 | 1982-03-04 | Fixing device for ceramic surface plate for polishing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58155168A true JPS58155168A (en) | 1983-09-14 |
| JPS5944185B2 JPS5944185B2 (en) | 1984-10-27 |
Family
ID=12409171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57034259A Expired JPS5944185B2 (en) | 1982-03-04 | 1982-03-04 | Fixing device for ceramic surface plate for polishing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5944185B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60109859U (en) * | 1983-12-28 | 1985-07-25 | 株式会社 デイスコ | Semiconductor wafer surface grinding equipment |
| JPS6374267U (en) * | 1986-10-30 | 1988-05-18 | ||
| US5096854A (en) * | 1988-06-28 | 1992-03-17 | Japan Silicon Co., Ltd. | Method for polishing a silicon wafer using a ceramic polishing surface having a maximum surface roughness less than 0.02 microns |
| JPH079330A (en) * | 1993-06-23 | 1995-01-13 | Takahiro Imahashi | Ultraprecise surface polishing method and device |
| CN104002229A (en) * | 2014-06-06 | 2014-08-27 | 哈尔滨电气动力装备有限公司 | Hydraulic geometrical shape grinding device for static slip ring of hydrodynamic mechanical seal |
| CN107538342A (en) * | 2016-06-24 | 2018-01-05 | 上海新昇半导体科技有限公司 | A kind of wafer supports board component, burnishing device and wafer precise polishing method |
-
1982
- 1982-03-04 JP JP57034259A patent/JPS5944185B2/en not_active Expired
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60109859U (en) * | 1983-12-28 | 1985-07-25 | 株式会社 デイスコ | Semiconductor wafer surface grinding equipment |
| JPH0417324Y2 (en) * | 1983-12-28 | 1992-04-17 | ||
| JPS6374267U (en) * | 1986-10-30 | 1988-05-18 | ||
| US5096854A (en) * | 1988-06-28 | 1992-03-17 | Japan Silicon Co., Ltd. | Method for polishing a silicon wafer using a ceramic polishing surface having a maximum surface roughness less than 0.02 microns |
| JPH079330A (en) * | 1993-06-23 | 1995-01-13 | Takahiro Imahashi | Ultraprecise surface polishing method and device |
| CN104002229A (en) * | 2014-06-06 | 2014-08-27 | 哈尔滨电气动力装备有限公司 | Hydraulic geometrical shape grinding device for static slip ring of hydrodynamic mechanical seal |
| CN107538342A (en) * | 2016-06-24 | 2018-01-05 | 上海新昇半导体科技有限公司 | A kind of wafer supports board component, burnishing device and wafer precise polishing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5944185B2 (en) | 1984-10-27 |
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