JPS5942929A - Preparation of laminated board - Google Patents

Preparation of laminated board

Info

Publication number
JPS5942929A
JPS5942929A JP57154102A JP15410282A JPS5942929A JP S5942929 A JPS5942929 A JP S5942929A JP 57154102 A JP57154102 A JP 57154102A JP 15410282 A JP15410282 A JP 15410282A JP S5942929 A JPS5942929 A JP S5942929A
Authority
JP
Japan
Prior art keywords
resin
laminated
laminated body
laminated board
prepreg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57154102A
Other languages
Japanese (ja)
Inventor
Kunio Sakamoto
邦夫 坂本
Sunao Ikoma
生駒 直
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP57154102A priority Critical patent/JPS5942929A/en
Publication of JPS5942929A publication Critical patent/JPS5942929A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE:To obtain the laminated board which is improved in the accuracy of thickness and is able to prevent the deviation of materials by such an arrangement wherein a prepreg is prepared by impregnating a base material with resin for laminated board and drying it, and the edges and side surfaces of the laminated body of the prepreg are coated with a quick drying material and caused to dry in advance, and the laminated body thus obtained is then formed by heating and pressing. CONSTITUTION:A prepreg is prepared by impregnating a base material for laminated board (e.g., natural fiber, etc.) with resin for laminated board (e.g., epoxy resin, etc.) and dried, and a laminated body is then prepared by laminating a required number of sheet of the prepreg and the edges and side surfaces of the laminated body are coated (thickness of 0.05-1mm. is most suitable) with a quick drying material (e.g., phenol resin, etc.) and dried in advance (time is preferably within 60min), and the titled laminated board is eventually obtained by heating, pressing and forming the laminated body by using a metal plate for metal mold. USE:For printed circuit board, etc.

Description

【発明の詳細な説明】 本発明はプリント配線板[目等のように高寸法安定性を
必要とする積層板の製造方法に関するもので、その目的
とするところは厚み精度の向上とあわせて製造の効率化
である。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing printed wiring boards (laminates such as laminates that require high dimensional stability), and its purpose is to improve thickness accuracy while manufacturing. This is to improve efficiency.

従来の積層板は第1図に示すように積層板用樹脂を積層
板用基材に含浸、乾燥したブリプレグlを所要枚数積層
した積層体aを金型用金属板2のn1lK挾み加熱加圧
成形していたがグリプレグ1から熔融流出する積層板用
樹脂8のため厚み精度が低下するのは避けられないこと
で゛あった。更に成形時にグリプレグがズレ易い欠点も
あった。
As shown in Fig. 1, a conventional laminate is made by impregnating a laminate base material with a laminate resin and laminating a required number of dried Buri Preg l sheets, then sandwiching the laminate a between metal mold plates 2 and heating it. Although pressure molding was performed, it was inevitable that the thickness accuracy would deteriorate due to the laminate resin 8 melting and flowing out from the Gripreg 1. Furthermore, there was also the drawback that the grip preg was easily misaligned during molding.

本発明の方法はグリプレグを所要枚数@層した積層体の
周縁、側面部に予じめ速乾燥性材料を塗布、乾燥してお
いてから加熱加圧成形するため成形時の積層板用樹脂の
熔融流出を防IFすることができるので厚み精度の向上
と併せてプリプレグのズレを防止できるものである。
In the method of the present invention, a quick-drying material is applied in advance to the periphery and side surfaces of the laminate in which the required number of Glypregs are layered, and the resin for the laminate is Since melt outflow can be prevented by IF, thickness accuracy can be improved and misalignment of the prepreg can be prevented.

次に本発明の方法を詳しく説明する。本発明に使用する
積層板用樹脂はエポキシ樹脂、フェノール樹脂、不飽和
ポリエステル樹脂、メラミン樹脂。
Next, the method of the present invention will be explained in detail. The resins for laminates used in the present invention are epoxy resins, phenol resins, unsaturated polyester resins, and melamine resins.

ポリイミド樹脂、ポリブタジェン樹脂等の単独又は混合
物或は変性物等の熱硬化性樹脂全般である。
Thermosetting resins in general include polyimide resins, polybutadiene resins, etc. alone, mixtures, and modified products.

積層板用基材としては紙や木綿等の天然繊維やポリアミ
ド、ポリビニルアルコール、ポリエステル。
Base materials for laminates include natural fibers such as paper and cotton, polyamide, polyvinyl alcohol, and polyester.

ポリアクリル等の有機合成繊維やガラス、アヌベスト等
の無機繊維の織布や不織布やマットである。
These are woven fabrics, non-woven fabrics, and mats made of organic synthetic fibers such as polyacrylic, glass, and inorganic fibers such as Anuvest.

積層体の周縁、側面部に予じめ塗布、乾燥しておく速乾
燥性材料としてはフェノール樹脂、エポキ’ 8g 脂
、不飽和ポリニスデル樹脂、メラミン樹脂、ポリウレタ
ン樹脂、ボリイミ1゛樹脂、アルキッド樹脂、シリコン
樹脂、7ラン樹脂、アリル樹脂、アクリル樹脂、ナイロ
ン樹脂、ポリビニル系樹脂専の単独又は混合物或は変性
物からなる塗料、ワニス等が用いられ好ましくは速乾燥
性材料の乾燥1時間が常温において、60分以内である
ことが望ま1.い。即ち60分をこえると作業効率が低
下するためである。周縁、側面部としては*m体周縁よ
り内側に向けて0.2〜50藺の周縁部分及び側面郡全
体である。又速乾燥性材料の塗布厚さは特に限定するも
のではないが、0.05〜1Mが 好ましい。即ち0.
05 u未満では熔融流出樹脂を阻止することができず
、1Mをこえると乾燥時間が遅滞するからである。
Quick-drying materials that are pre-applied to the periphery and side surfaces of the laminate and dried include phenolic resin, epoxy resin, unsaturated polynisder resin, melamine resin, polyurethane resin, polyimide resin, alkyd resin, Paints, varnishes, etc. made of silicone resins, 7-run resins, allyl resins, acrylic resins, nylon resins, polyvinyl resins alone, in mixtures, or modified products are used, and preferably quick-drying materials are dried for 1 hour at room temperature. , preferably within 60 minutes 1. stomach. That is, if the time exceeds 60 minutes, the work efficiency will decrease. The periphery and side surface portion are the periphery portion and the entire side surface area of 0.2 to 50 cm inward from the periphery of the body. Further, the coating thickness of the quick-drying material is not particularly limited, but is preferably 0.05 to 1M. That is, 0.
This is because if it is less than 0.05 μM, it will not be possible to prevent the resin from melting and flowing out, and if it exceeds 1M, the drying time will be delayed.

次に本発明の方法を実施例にもとすいて説明する。Next, the method of the present invention will be explained based on examples.

実施例 本発明の方法により積層板を得る際の実施例について図
面により説明すれば次のように々る。
EXAMPLE An example of obtaining a laminate by the method of the present invention will be described below with reference to the drawings.

第2図に示すように樹脂含有串間重量%(以下単に%(
!: E t )のレゾール型フェノール樹脂ワニスを
Jkさ0.11のクラ71・紙に含し、乾燥した樹脂含
有率45%の1リプレグ1を8枚@層したI′V′を層
体3の周縁より内側に向けて10開の周縁部分及び側面
部に加’CKおける乾燥時間が(9)分であるアクリル
棺l脂系塗料を塗布ノVさが021nになるように塗布
、乾燥しておいてから金型用金属板2の間に挾んで成形
圧力100 k7!、i、160°Cで60分間蹟層成
形して厚さ1.6 Fの積層板を得た。該債り1板の厚
み精度は1G±0.10間であり、成形時のプリブVグ
のズレ発生もなく更に積層体が一体化されているので取
扱い易いものであった。
As shown in FIG.
! : E t ) resol type phenolic resin varnish contained in Kura 71 paper with Jk 0.11, I'V' made by layering 8 sheets of 1 Repreg 1 with a resin content of 45% and dried as Layer 3. Apply an acrylic coffin fat-based paint with a drying time of (9) minutes to the periphery and side parts of the 10-opening inward from the periphery so that the coating V becomes 021n, and dry. After that, place it between the mold metal plates 2 and apply a molding pressure of 100k7! , i, and laminated at 160° C. for 60 minutes to obtain a laminate with a thickness of 1.6 F. The thickness accuracy of one bond plate was within 1G±0.10, and there was no deviation of the prev V during molding, and the laminated body was integrated, so it was easy to handle.

比較例 大Mi例と同じデリグレグ8枚を積層したfilt 8
体をその−zt金型用金属板に挟み実施例と同じように
処理して得だ厚さ1.6層の債11板の厚み精度は16
±0.14zt*  であり、成形時のブ°リプルグの
ズレ発生防市に注意が必要で製造効率の悪いものであっ
た。
Comparative example: filt 8, which is made by laminating 8 dereg legs that are the same as the large Mi example.
The thickness accuracy of the bond 11 plate with a thickness of 1.6 layers obtained by sandwiching the body between the metal plates for the -zt mold and processing in the same manner as in the example was 16.
±0.14zt*, and care was required to prevent the occurrence of slippage of the plastic plug during molding, resulting in poor manufacturing efficiency.

このように本発明の方法によればJf、み精度の向上と
製造の効率化が達成することができ、本発明の方法の優
れていることを確認した。
As described above, according to the method of the present invention, it was possible to achieve improvement in Jf, milling accuracy, and production efficiency, and it was confirmed that the method of the present invention is superior.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の方法により1貨層体を成形した場合の概
略断面図、第2図は本発明の方法により積層体を成形す
る場合の機略断面図である。 1・・・デリプ°レグ、2・・・金型用金属板、8・・
・熔吊キ流出するra層板用樹脂、4・・・1束乾燥性
材料。 特許出願人 松「電工株式会社 代JJ1人弁理士  竹 元 敏 九 (ほか2名) 第1図 第2図
FIG. 1 is a schematic cross-sectional view of a single layered body formed by a conventional method, and FIG. 2 is a schematic cross-sectional view of a laminated body formed by the method of the present invention. 1... Delip leg, 2... Metal plate for mold, 8...
・Resin for RA laminates that flows out during welding, 4...1 bundle of drying material. Patent applicant: Matsu, Denko Co., Ltd., JJ, 1 patent attorney: Satoshi Takemoto (and 2 others) Figure 1 Figure 2

Claims (1)

【特許請求の範囲】 +11  債Rq板用trMJ脂を憤層板用へ羽に含浸
、乾燥した7°リプレグを所要枚数積層したf前層体を
加熱加圧成形してなる積層板の製造に於て、積層体の周
縁、側面部に予じめ速乾燥性材料を塗布、−乾燥しでお
いてから加熱加圧成形することを特徴とする積層板の製
造方法。 (2)速乾燥性側斜の乾燥時間が常温において、60分
以内であることを特徴とする特許請求の範囲第1項記載
の積層板の製造方法。
[Scope of Claims] +11 For manufacturing a laminate by heating and press-molding an f front layer in which the required number of dried 7° repregs are laminated by impregnating the wings with trMJ resin for bond Rq boards and laminating the required number of dried 7° repregs. A method for producing a laminate, comprising applying a quick-drying material to the periphery and side surfaces of the laminate in advance, drying it, and then molding it under heat and pressure. (2) The method for producing a laminate according to claim 1, wherein the drying time of the quick-drying side slope is within 60 minutes at room temperature.
JP57154102A 1982-09-03 1982-09-03 Preparation of laminated board Pending JPS5942929A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57154102A JPS5942929A (en) 1982-09-03 1982-09-03 Preparation of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57154102A JPS5942929A (en) 1982-09-03 1982-09-03 Preparation of laminated board

Publications (1)

Publication Number Publication Date
JPS5942929A true JPS5942929A (en) 1984-03-09

Family

ID=15576957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57154102A Pending JPS5942929A (en) 1982-09-03 1982-09-03 Preparation of laminated board

Country Status (1)

Country Link
JP (1) JPS5942929A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218253A (en) * 1985-07-16 1987-01-27 株式会社日本ポリテック Laminated film and laminated sheet using said film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218253A (en) * 1985-07-16 1987-01-27 株式会社日本ポリテック Laminated film and laminated sheet using said film
JPH0428220B2 (en) * 1985-07-16 1992-05-13 Nippon Horitetsuku Kk

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