KR900017780A - Manufacturing method of resin overlay board - Google Patents

Manufacturing method of resin overlay board Download PDF

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Publication number
KR900017780A
KR900017780A KR1019900007139A KR900007139A KR900017780A KR 900017780 A KR900017780 A KR 900017780A KR 1019900007139 A KR1019900007139 A KR 1019900007139A KR 900007139 A KR900007139 A KR 900007139A KR 900017780 A KR900017780 A KR 900017780A
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South Korea
Prior art keywords
plate
resin
board
composite sheet
wood
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KR1019900007139A
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Korean (ko)
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KR940004028B1 (en
Inventor
미쯔오 마쯔모또
고오헤이 데구찌
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고오헤이 데구찌
고오분시기겐 가부시끼가이샤
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Priority claimed from JP1122337A external-priority patent/JPH02301405A/en
Priority claimed from JP1181251A external-priority patent/JP2726943B2/en
Priority claimed from JP2040608A external-priority patent/JP2893348B2/en
Application filed by 고오헤이 데구찌, 고오분시기겐 가부시끼가이샤 filed Critical 고오헤이 데구찌
Publication of KR900017780A publication Critical patent/KR900017780A/en
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Publication of KR940004028B1 publication Critical patent/KR940004028B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/10—Next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/022—Non-woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G9/00—Forming or shuttering elements for general use
    • E04G9/02—Forming boards or similar elements
    • E04G9/05—Forming boards or similar elements the form surface being of plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/10—Fibres of continuous length
    • B32B2305/20—Fibres of continuous length in the form of a non-woven mat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2317/00—Animal or vegetable based
    • B32B2317/16—Wood, e.g. woodboard, fibreboard, woodchips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/04—Polyethylene
    • B32B2323/043—HDPE, i.e. high density polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/04—Polyethylene
    • B32B2323/046—LDPE, i.e. low density polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/10—Polypropylene

Abstract

내용 없음No content

Description

수지오버레이판의 제조 방법Manufacturing method of resin overlay board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 복합시트의 제조방법을 나타낸 개략 구성도, 제2도는 제1도에 나타낸 방법으로 만들어진 복합시트를 이용해서 제조한 수지오버레이판을 나타낸 단면도, 제3도는 제1도에 나타낸 방법으로 만들어진 복합시트를 이용해서 제조한 다른 수지오버레이판을 나타낸 단면도.1 is a schematic configuration diagram showing a method of manufacturing a composite sheet, FIG. 2 is a cross-sectional view showing a resin overlay plate manufactured using a composite sheet made by the method shown in FIG. 1, and FIG. 3 is made by the method shown in FIG. Sectional drawing which shows the other resin overlay board manufactured using the composite sheet.

Claims (16)

폴리올레핀계 수지필름과 부직포와의 사이에 용융상태의 접착성 폴리올레핀계 공중합수지를 제공하여, 상기 폴리올레핀계 수지 필름과 상기 부직포를 붙여서 가압한 후 냉각시킴으로써 상기 폴리올레핀계 수지필름의 한쪽면에 상기 접착성 폴리올레핀계 공중합수지를 통해서 상기 부직포가 접착된 복합시트를 만들며 상기 복합시트를 목질판에, 상기 부직포폭이 상기 목질판쪽으로 오도록해서 접착제를 넣어 맞겹치고 가압해서 상기 복합시트를 상기 목질판에 접착하는 것을 특징으로 하는 수지오버레이판의 제조방법.Providing an adhesive polyolefin-based copolymer resin in a molten state between the polyolefin-based resin film and the nonwoven fabric, pressing and cooling the polyolefin-based resin film and the nonwoven fabric, and cooling the adhesive to one side of the polyolefin-based resin film. Making a composite sheet bonded to the nonwoven fabric through a polyolefin-based copolymer resin, the composite sheet is bonded to the wooden plate, the nonwoven fabric width is directed toward the wooden plate, the adhesive sheet is bonded and pressed to bond the composite sheet to the wooden plate Method for producing a resin overlay plate, characterized in that. 제1항에 있어서, 수지오버레이판의 제조방법에 있어서, 상기 목질판은 복수의 단판이 적층되어 만들어진 합판이며, 상기 합판의 제조공정중의 퇴적공정에 있어서, 적층된 단판군의 최외측 표면에 열경화형 접착제를 넣어 상기 복합시트를 맞겹쳐서 가열하고 압력을 주어서 상기 단판끼리의 접착과 동시에 상기 복합시트를 상기 합판에 접착하는 것을 특징으로 하는 수지오버레이판의 제조방법.The method of manufacturing a resin overlay plate according to claim 1, wherein the wood board is a plywood made by laminating a plurality of end plates, and in the deposition process during the manufacturing process of the plywood, A method of manufacturing a resin overlay board comprising a thermosetting adhesive, overlapping the composite sheet, heating the sheet, and applying pressure to bond the composite sheets to the plywood at the same time. 제1항에 있어서, 수지오버레이판의 제조방법에 있어서, 상기 목질판은 복수의 목재 조각이 뭉쳐져 만들어진 입자판 또는 웨이퍼판이며 상기 입자판 또는 웨이퍼판의 제조공정중의 경화성형공정에 있어서, 상기 목재조각층의 표면에 열경화형 접착제를 넣어서 상기 복합시트를 맞겹쳐서 가열하고 압력을 가해서 상기 입자판 또는 웨이퍼판의 경화성형과 동시에 상기 복합시트를 상기 입자판 또는 웨이퍼판에 접착하는 것을 특징으로 하는 수지오버레이판의 제조방법.The method of manufacturing a resin overlay plate according to claim 1, wherein the wood board is a particle board or a wafer board formed by a plurality of pieces of wood agglomerated, and in the curing molding step in the manufacturing process of the particle board or the wafer board, A thermosetting adhesive is put on the surface of the wood carving layer, and the composite sheet is bonded to each other, heated and pressurized to simultaneously cure the particle sheet or wafer plate, and to bond the composite sheet to the particle plate or wafer plate. Method for producing a resin overlay plate. 폴리올레핀계 수지필름의 한쪽면에 산화처리를 한후, 상기 폴리올레핀계 수지필름의 산화처리가 이루어진 한쪽면에 제1의 접착제를 이용해서 부직포를 붙침으로써 복합시트를 만들면, 상기 복합시트를 목질판에, 상기 부직포쪽이 상기 목질판쪽으로 오도록해서 제2의 접착제를 넣어서 맞겹쳐 가압해서 상기 복합 시트를 상기 목질판에 접착하는 것을 특징으로 하는 수지오버레이판의 제조방법.After the oxidation treatment is performed on one side of the polyolefin resin film, and the composite sheet is made by attaching a nonwoven fabric to the one surface on which the oxidation treatment of the polyolefin resin film is performed using a first adhesive agent, the composite sheet is placed on a wooden board. A method for producing a resin overlay plate, characterized in that the composite sheet is bonded to the wood plate by pressing the non-woven fabric side toward the wood plate and putting a second adhesive therebetween. 제4항에 있어서, 수지오버레이판의 제조방법에 있어서, 상기 폴리올레핀계수지필름이 2축 연신 폴리프로필렌제 필름인 것을 특징으로 하는 수지오버레이판의 제조방법.The method for producing a resin overlay plate according to claim 4, wherein the polyolefin resin film is a biaxially stretched polypropylene film. 제4항에 있어서, 수지오버레이판의 제조방법에 있어서, 상기 목질판은 복수의 단판이 적층되어 만들어진 합판이며, 상기 합판의 제조공정중의 퇴적공정에 있어서, 적층된 단판군의 최외측 표면에 열경화형 접착제를 넣어서 상기 복합시트를 맞겹쳐서 가열하고 압력을 가해서 상기 단판끼리의 접착과 동시에 상기 복합시트를 상기 합판에 접착하는 것을 특징으로 하는 수지오버레이판의 제조방법.The method of manufacturing a resin overlay plate according to claim 4, wherein the wood board is a plywood formed by laminating a plurality of end plates, and in the deposition step in the manufacturing process of the plywood, the outermost surface of the laminated end plate group A method of manufacturing a resin overlay board comprising a thermosetting adhesive added to overlap a composite sheet, and heating and applying pressure to bond the single sheets to the plywood at the same time. 제4항에 있어서, 수지오버레이판의 제조방법에 있어서, 상기 목질판은 복수의 목재조각이 뭉쳐져 만들어진 입자판 또는 웨이퍼판이며, 상기 입자판 또는 웨이퍼판의 제조공정중의 경화성형공정에 있어서 목재조각층의 표면에 열경화형 접착제를 넣어서 상기 복합시트를 맞겹쳐서 가열하고 압력을 가하여 상기 입자판 또는 웨이퍼판의 경화성형과 동시에 상기 복합시트를 상기 입자판 또는 웨이퍼판에 접착하는 것을 특징으로 하는 수지오버레이판의 제조방법.5. The method of manufacturing a resin overlay plate according to claim 4, wherein the wood board is a particle board or a wafer board formed by a plurality of wood pieces agglomerated, and the wood in the curing molding step of the manufacturing process of the particle board or wafer board. Resin characterized in that the thermosetting adhesive is put on the surface of the engraving layer to overlap the composite sheet and heated and pressurized to bond the composite sheet to the particle plate or wafer plate simultaneously with the curing molding of the particle plate or wafer plate. Method of manufacturing the overlay plate. 부직포의 한쪽면위에 폴리올레핀계 수지를 라미네이터을 이용해서 공급하고, 폴리올레핀계 수지와 부직포를 붙여서 가압한후 냉각 시킴으로써 상기 부직포의 한쪽면에 폴리올레핀계 수지층이 형성된 복합시트를 만들며, 상기 복합시트를 목질판에 상기 부직포쪽이 상기 목질판쪽으로 오도록해서 접착재를 넣어 맞겹치고 가압해서 상기 복합시트를 상기 목질판에 접착하는 것을 특징으로 하는 수지오버레이판의 제조방법.A polyolefin resin is supplied on one side of the nonwoven fabric by using a laminator, and the polyolefin resin and the nonwoven fabric are attached and pressurized, followed by cooling to form a composite sheet having a polyolefin resin layer formed on one side of the nonwoven fabric. A method of manufacturing a resin overlay plate, characterized in that the composite sheet is bonded to the wood plate by putting the non-woven fabric side toward the wood plate so that an adhesive material is placed thereon and pressed. 제8항에 있어서, 수지오버레이판의 제조방법에 있어서, 상기 라미네이터의 수지압출구와 상기 부직포 표면과의 사이의 공기간격은 상기 라미네이터의 수지압출구에서 압출된 상기 폴리롱레핀계 수지의 산화가 촉진될 수 있는 크기로 설정되어 있는 것을 특징으로 하는 수지오버레이판의 제조방법.9. The method of manufacturing a resin overlay plate according to claim 8, wherein in the air gap between the resin extruded port of the laminator and the surface of the nonwoven fabric, the oxidation of the polylong lepin-based resin extruded from the resin extruded port of the laminator A method for producing a resin overlay plate, characterized in that it is set to a size that can be promoted. 제8항에 있어서, 수지오버레이판의 제조방법에 있어서, 상기 부직포가 습식부직포인 것을 특징으로 하는 수지오버레이판의 제조방법.The method for producing a resin overlay plate according to claim 8, wherein the nonwoven fabric is a wet nonwoven fabric. 제8항에 있어서, 수지오버레이판의 제조방법에 있어서, 상기 부직포는 에틸렌초산 비닐수지에멀죤이 함침된 것을 특징으로 하는 수지오버레이판의 제조방법.The method for producing a resin overlay plate according to claim 8, wherein the nonwoven fabric is impregnated with an ethylene vinyl acetate resin zone. 제8항에 있어서, 수지오버레이판의 제조방법에 있어서, 상기 목질판은 복수의 단판이 적층되어 만들어진 합판이며, 상기 합판의 제조공정중의 퇴적공정에 있어서 적층된 단판군의 최외측 표면에 열경화형 접착제를 넣어서 상기 복합시트를 맞겹쳐서 가열하고 압력을 가하여 상기 단판끼리의 접착과 동시에 상기 복합시트를 상기 합판에 접착하는 것을 특징으로 하는 수지오버레이판의 제조방법.9. The method of manufacturing a resin overlay plate according to claim 8, wherein the wood board is a plywood made by laminating a plurality of end plates, and the heat is applied to the outermost surface of the group of end plates laminated in the deposition process during the manufacturing process of the plywood. A method of manufacturing a resin overlay board, comprising: attaching a curable adhesive to the composite sheet, heating the sheet, and applying pressure to bond the end plates to the composite sheet. 제8항에 있어서, 수지오버레이판의 제조방법에 있어서, 상기 목질판은 복수의 목재조각이 뭉쳐져서 만들어진 입자판 또는 웨어퍼판이며 상기 입자판 또는 웨이퍼판의 제조공정중의 경화성형공정에 있어서, 목재조각층의 표면에 열결화형 접착제를 넣어서 상기 복합시트를 맞겹쳐서 가열하고 압력을 가해서 상기 입자판 또는 웨이퍼판의 경화성형과 동시에 상기 복합시트를 상기 입자판 또는 웨이퍼판에 접착하는 것을 특징으로 하는 수지오버레이판의 제조방법.The method of manufacturing a resin overlay plate according to claim 8, wherein the wood board is a particle board or a wafer board formed by a plurality of wood pieces agglomerated, and in the curing molding step of the particle board or wafer board manufacturing process, Heat-adhesive adhesive is put on the surface of the wood carving layer, and the composite sheet is overlapped and heated and pressed to cure the particle plate or wafer plate simultaneously with bonding the composite sheet to the particle plate or wafer plate. Method for producing a resin overlay plate. 부직포의 한쪽면위에 접착성 폴리올레핀계 공중합수지 및 폴리올레핀계 수지를 2층 모두 압출 라미네이터를 이용해서 공급하고, 이러한 수지와 부직포를 붙여서 가압한후 냉각시킴으로써 상기 부직포의 한쪽면에 접착성 폴리올레핀계 공중합수지는 그위에 폴리올레핀계 수지층이 각각 형성된 복합시트를 만들며, 상기 복합시트를 목질판에, 상기 부직포폭이 상기 목질판쪽으로 오도록 해서 접착제를 넣어 맞겹치고 가압해서 상기 복합시트를 상기 목질판에 접착하는 것을 특징으로 하는 수지오버레이판의 제조방법.Adhesive polyolefin-based copolymer resin and polyolefin-based resin on both sides of the nonwoven fabric are supplied using an extruded laminator, and the resin and non-woven fabric are attached and pressurized, followed by cooling, thereby adhering the adhesive polyolefin-based copolymer resin to one side of the nonwoven fabric. Is to make a composite sheet each having a polyolefin-based resin layer formed thereon, the composite sheet to the wooden plate, the non-woven fabric width is directed toward the wooden plate, the adhesive is put together and pressed to bond the composite sheet to the wooden plate Method for producing a resin overlay plate, characterized in that. 제14항에 있어서, 수지오버레이판의 제조방법에 있어서, 상기 목질판은 복수의 단판이 적층되어 만들어진 합판이며, 상기 합판의 제조과정중의 퇴적공정에 있어서 적층된 단판군의 최외측 표면에 열경화형 접착제를 넣어서 상기 복합시트를 맞겹쳐 가열하고 압력을 가해서 상기 단판끼리의 접착과 동시에 상기 복합시트를 상기 합판에 접착하는 것을 특징으로 하는 수지오버레이판의 제조방법.15. The method of manufacturing a resin overlay board according to claim 14, wherein the wood board is a plywood made by laminating a plurality of end plates, and the heat is applied to the outermost surface of the group of end plates laminated in the deposition process during the manufacturing process of the plywood. A method of manufacturing a resin overlay board, comprising: attaching a curable adhesive to the composite sheet to heat the sheet, and applying pressure to bond the single sheets together to the composite sheet to the plywood. 제14항에 있어서, 수지오버레이판의 제조방법에 있어서 상기 목질판의 목재조각이 뭉쳐져서 만들어진 입자판 또는 웨어퍼판이며, 상기 입자판 또는 웨이퍼판의 제조공정중의 경화성형공정에 있어서 목재층의 표면에 열경화형 접착제를 상기복합시트를 맞겹쳐서 가열하고 압력을 가해서 상기 입자판 또는 웨이퍼파느이 경화성형과 동시에 상기 복수시트를 상기 입자판 또는 웨이퍼판에 접착하는 것을 특징으로 하는 수지오버레이판의 제조방법.15. The method according to claim 14, wherein in the method for producing a resin overlay plate, a wood plate or a wafer board is formed by agglomerating wood pieces of the wood board, and the wood layer is subjected to a hardening process during the manufacturing process of the wood board or wafer board. A method of manufacturing a resin overlay plate, wherein a thermosetting adhesive is laminated on a surface of the composite sheet and heated and pressurized to bond the plurality of sheets to the particle plate or wafer plate at the same time as the particle plate or wafer sheet is cured. . ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900007139A 1989-05-16 1990-05-16 Method of manufacturing resin overlay plate KR940004028B1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP??01-22337? 1989-05-16
JP122337 1989-05-16
JP1122337A JPH02301405A (en) 1989-05-16 1989-05-16 Plate for concrete frame and its manufacture
JP1181251A JP2726943B2 (en) 1989-07-13 1989-07-13 Concrete form board and method of manufacturing the same
JP181251 1989-07-13
JP??01-181251? 1989-07-13
JP2040608A JP2893348B2 (en) 1990-02-20 1990-02-20 Method for manufacturing resin overlay plate
JP40608 1990-02-20
JP??02-40608? 1990-02-20

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AU622320B2 (en) 1992-04-02
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DE4015454A1 (en) 1990-11-22
CA2016367A1 (en) 1990-11-16
GB9010831D0 (en) 1990-07-04
DE4015454C2 (en) 1996-04-18

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