JPS5939363A - 液滴下用ノズル - Google Patents

液滴下用ノズル

Info

Publication number
JPS5939363A
JPS5939363A JP57151351A JP15135182A JPS5939363A JP S5939363 A JPS5939363 A JP S5939363A JP 57151351 A JP57151351 A JP 57151351A JP 15135182 A JP15135182 A JP 15135182A JP S5939363 A JPS5939363 A JP S5939363A
Authority
JP
Japan
Prior art keywords
nozzle
diameter pipe
small
diameter
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57151351A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0321224B2 (show.php
Inventor
Muneo Nakayama
中山　宗雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOKYO DENSHI KAGAKU KABUSHIKI
Tokyo Denshi Kagaku KK
Original Assignee
TOKYO DENSHI KAGAKU KABUSHIKI
Tokyo Denshi Kagaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOKYO DENSHI KAGAKU KABUSHIKI, Tokyo Denshi Kagaku KK filed Critical TOKYO DENSHI KAGAKU KABUSHIKI
Priority to JP57151351A priority Critical patent/JPS5939363A/ja
Priority to US06/526,607 priority patent/US4542710A/en
Publication of JPS5939363A publication Critical patent/JPS5939363A/ja
Publication of JPH0321224B2 publication Critical patent/JPH0321224B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/0448—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nozzles (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP57151351A 1982-08-30 1982-08-30 液滴下用ノズル Granted JPS5939363A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57151351A JPS5939363A (ja) 1982-08-30 1982-08-30 液滴下用ノズル
US06/526,607 US4542710A (en) 1982-08-30 1983-08-26 Solution-dropping nozzle device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57151351A JPS5939363A (ja) 1982-08-30 1982-08-30 液滴下用ノズル

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP3360602A Division JPH0596222A (ja) 1991-12-27 1991-12-27 液滴下用ノズル

Publications (2)

Publication Number Publication Date
JPS5939363A true JPS5939363A (ja) 1984-03-03
JPH0321224B2 JPH0321224B2 (show.php) 1991-03-22

Family

ID=15516653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57151351A Granted JPS5939363A (ja) 1982-08-30 1982-08-30 液滴下用ノズル

Country Status (2)

Country Link
US (1) US4542710A (show.php)
JP (1) JPS5939363A (show.php)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61161171A (ja) * 1984-12-29 1986-07-21 Nordson Kk 溶剤型接着剤のノズル先端部への残溜付着を防止しつつ塗布する方法とその装置
US5984981A (en) * 1995-02-28 1999-11-16 Showa Miyagi Salt making method and apparatus

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4736704A (en) * 1983-12-23 1988-04-12 Universal Instruments Corporation Apparatus for applying solder masking to a circuit board
DE3509730A1 (de) * 1985-03-18 1986-09-18 Windmöller & Hölscher, 4540 Lengerich Verfahren und vorrichtung zur erhaltung der einsatzbereitschaft eines leimduesenauftragsaggregates waehrend betriebsunterbrechungen
JPH0537094U (ja) * 1991-10-23 1993-05-21 四国化工機株式会社 具入り粘性食品の充填装置
US11004679B2 (en) * 2017-09-27 2021-05-11 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for supplying chemical liquid in semiconductor fabrication

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55137969U (show.php) * 1979-03-16 1980-10-01
JPS58143865A (ja) * 1982-02-19 1983-08-26 Matsushita Electric Ind Co Ltd 塗布装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3211377A (en) * 1963-06-28 1965-10-12 Grace W R & Co Method of prevention of nozzle fouling
GB2030894B (en) * 1978-10-06 1982-11-10 British American Tobacco Co Spraying devices
JPS57135066A (en) * 1981-02-14 1982-08-20 Tatsumo Kk Rotary applying machine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55137969U (show.php) * 1979-03-16 1980-10-01
JPS58143865A (ja) * 1982-02-19 1983-08-26 Matsushita Electric Ind Co Ltd 塗布装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61161171A (ja) * 1984-12-29 1986-07-21 Nordson Kk 溶剤型接着剤のノズル先端部への残溜付着を防止しつつ塗布する方法とその装置
US5984981A (en) * 1995-02-28 1999-11-16 Showa Miyagi Salt making method and apparatus

Also Published As

Publication number Publication date
JPH0321224B2 (show.php) 1991-03-22
US4542710A (en) 1985-09-24

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