JPS5938244A - 電磁波遮蔽性合成樹脂成形材料 - Google Patents
電磁波遮蔽性合成樹脂成形材料Info
- Publication number
- JPS5938244A JPS5938244A JP57148516A JP14851682A JPS5938244A JP S5938244 A JPS5938244 A JP S5938244A JP 57148516 A JP57148516 A JP 57148516A JP 14851682 A JP14851682 A JP 14851682A JP S5938244 A JPS5938244 A JP S5938244A
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- electromagnetic wave
- molding material
- wave shielding
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920003002 synthetic resin Polymers 0.000 title claims description 18
- 239000000057 synthetic resin Substances 0.000 title claims description 18
- 239000012778 molding material Substances 0.000 title claims description 15
- 239000005300 metallic glass Substances 0.000 claims description 11
- 230000000694 effects Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000011888 foil Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57148516A JPS5938244A (ja) | 1982-08-28 | 1982-08-28 | 電磁波遮蔽性合成樹脂成形材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57148516A JPS5938244A (ja) | 1982-08-28 | 1982-08-28 | 電磁波遮蔽性合成樹脂成形材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5938244A true JPS5938244A (ja) | 1984-03-02 |
| JPH0237947B2 JPH0237947B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-08-28 |
Family
ID=15454514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57148516A Granted JPS5938244A (ja) | 1982-08-28 | 1982-08-28 | 電磁波遮蔽性合成樹脂成形材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5938244A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60173052A (ja) * | 1984-02-20 | 1985-09-06 | Mitsui Toatsu Chem Inc | 樹脂組成物 |
| JPS61166098A (ja) * | 1985-01-18 | 1986-07-26 | 品川商工株式会社 | 電磁波遮蔽体 |
| JPS6283846A (ja) * | 1985-10-08 | 1987-04-17 | Miyoshi Oil & Fat Co Ltd | クリ−ムチ−ズ様食品及びその製造方法 |
| JPH0222333A (ja) * | 1987-10-29 | 1990-01-25 | Hiraoka & Co Ltd | アモルファス金属含有フレキシブルシート |
| JPH08204380A (ja) * | 1995-01-31 | 1996-08-09 | Tokin Corp | 電子装置におけるノイズ抑制方法及びそれを適用したノイズ抑制型電子装置 |
| KR100565845B1 (ko) * | 2003-06-12 | 2006-03-30 | 재단법인 포항산업과학연구원 | 전자파 흡수재 |
| CN105199375A (zh) * | 2015-10-12 | 2015-12-30 | 苏州宽温电子科技有限公司 | 一种导电导磁复合材料及其制备方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57187357A (en) * | 1981-05-15 | 1982-11-18 | Aisin Seiki Co Ltd | Soft magnetic resin composed of amorphous alloy |
-
1982
- 1982-08-28 JP JP57148516A patent/JPS5938244A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57187357A (en) * | 1981-05-15 | 1982-11-18 | Aisin Seiki Co Ltd | Soft magnetic resin composed of amorphous alloy |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60173052A (ja) * | 1984-02-20 | 1985-09-06 | Mitsui Toatsu Chem Inc | 樹脂組成物 |
| JPS61166098A (ja) * | 1985-01-18 | 1986-07-26 | 品川商工株式会社 | 電磁波遮蔽体 |
| JPS6283846A (ja) * | 1985-10-08 | 1987-04-17 | Miyoshi Oil & Fat Co Ltd | クリ−ムチ−ズ様食品及びその製造方法 |
| JPH0222333A (ja) * | 1987-10-29 | 1990-01-25 | Hiraoka & Co Ltd | アモルファス金属含有フレキシブルシート |
| JPH08204380A (ja) * | 1995-01-31 | 1996-08-09 | Tokin Corp | 電子装置におけるノイズ抑制方法及びそれを適用したノイズ抑制型電子装置 |
| KR100565845B1 (ko) * | 2003-06-12 | 2006-03-30 | 재단법인 포항산업과학연구원 | 전자파 흡수재 |
| CN105199375A (zh) * | 2015-10-12 | 2015-12-30 | 苏州宽温电子科技有限公司 | 一种导电导磁复合材料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0237947B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-08-28 |