JPS593822A - 開閉器用接点装置の製造方法 - Google Patents
開閉器用接点装置の製造方法Info
- Publication number
- JPS593822A JPS593822A JP11425982A JP11425982A JPS593822A JP S593822 A JPS593822 A JP S593822A JP 11425982 A JP11425982 A JP 11425982A JP 11425982 A JP11425982 A JP 11425982A JP S593822 A JPS593822 A JP S593822A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- alloy
- manufacturing
- switch
- base metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 19
- 229910045601 alloy Inorganic materials 0.000 claims description 33
- 239000000956 alloy Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000010953 base metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 238000005245 sintering Methods 0.000 description 10
- 238000000465 moulding Methods 0.000 description 8
- 238000005219 brazing Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910017770 Cu—Ag Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000004489 contact powder Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- -1 old alloys Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Manufacture Of Switches (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11425982A JPS593822A (ja) | 1982-06-29 | 1982-06-29 | 開閉器用接点装置の製造方法 |
US06/508,160 US4530815A (en) | 1982-06-29 | 1983-06-27 | Method of producing a contact device for a switch |
DE8383303763T DE3381576D1 (de) | 1982-06-29 | 1983-06-29 | Verfahren zur herstellung von kontakten fuer schalter. |
EP83303763A EP0099671B1 (en) | 1982-06-29 | 1983-06-29 | Method of producing a contact device for a switch |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11425982A JPS593822A (ja) | 1982-06-29 | 1982-06-29 | 開閉器用接点装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS593822A true JPS593822A (ja) | 1984-01-10 |
JPH0373084B2 JPH0373084B2 (enrdf_load_stackoverflow) | 1991-11-20 |
Family
ID=14633305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11425982A Granted JPS593822A (ja) | 1982-06-29 | 1982-06-29 | 開閉器用接点装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS593822A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61161648A (ja) * | 1985-01-07 | 1986-07-22 | Matsushita Electric Ind Co Ltd | プリンタ用線光源装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5317506A (en) * | 1976-07-31 | 1978-02-17 | Otaki Noriko | Monobloc sintering process in powder metallurgy |
JPS5787004A (en) * | 1980-11-18 | 1982-05-31 | Sawafuji Electric Co Ltd | Method of producing electric contact |
-
1982
- 1982-06-29 JP JP11425982A patent/JPS593822A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5317506A (en) * | 1976-07-31 | 1978-02-17 | Otaki Noriko | Monobloc sintering process in powder metallurgy |
JPS5787004A (en) * | 1980-11-18 | 1982-05-31 | Sawafuji Electric Co Ltd | Method of producing electric contact |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61161648A (ja) * | 1985-01-07 | 1986-07-22 | Matsushita Electric Ind Co Ltd | プリンタ用線光源装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0373084B2 (enrdf_load_stackoverflow) | 1991-11-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1978122B (zh) | 高温焊锡和高温焊锡膏材料以及功率半导体装置 | |
US4480261A (en) | Contact structure for a semiconductor substrate on a mounting body | |
US5111277A (en) | Surface mount device with high thermal conductivity | |
JP4969589B2 (ja) | ペルチェ素子精製プロセスとペルチェ素子 | |
US5188985A (en) | Surface mount device with high thermal conductivity | |
US12394769B2 (en) | Batch soldering of different elements in power module | |
US4598025A (en) | Ductile composite interlayer for joining by brazing | |
US7851910B2 (en) | Diffusion soldered semiconductor device | |
US3291578A (en) | Metallized semiconductor support and mounting structure | |
JP2520334B2 (ja) | 活性金属ろう材および活性金属ろう材を用いた金属部材とセラミックス部材との接合方法 | |
JPS593822A (ja) | 開閉器用接点装置の製造方法 | |
JP2002043478A (ja) | セラミック回路基板 | |
JP3832414B2 (ja) | ハーメチックシール用キャップ | |
US3950778A (en) | Semiconductor device and case member | |
JP3420476B2 (ja) | 半導体素子収納用パッケージ | |
JP3559457B2 (ja) | ロウ材 | |
JP2515051Y2 (ja) | 半導体素子収納用パッケージ | |
JP2512369B2 (ja) | 半導体装置用パッケ―ジおよびその製造方法 | |
JPS6188479A (ja) | スパ−クプラグの外側電極 | |
JPS6050344B2 (ja) | 集積回路用複合端子 | |
JPH06344131A (ja) | 半導体放熱基板への部品接合方法 | |
JP2005322727A (ja) | ハーメチックシールカバーおよびその製造方法 | |
JP2005072241A (ja) | ハーメチックシール用キャップ | |
JPS60100312A (ja) | 複合電気接点部品 | |
JPS6331940B2 (enrdf_load_stackoverflow) |