JPS5936949A - マルチチツプパツケ−ジ - Google Patents
マルチチツプパツケ−ジInfo
- Publication number
- JPS5936949A JPS5936949A JP14721282A JP14721282A JPS5936949A JP S5936949 A JPS5936949 A JP S5936949A JP 14721282 A JP14721282 A JP 14721282A JP 14721282 A JP14721282 A JP 14721282A JP S5936949 A JPS5936949 A JP S5936949A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- chip carrier
- carrier
- multilayer wiring
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000969 carrier Substances 0.000 claims description 9
- 239000003507 refrigerant Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 3
- 239000002826 coolant Substances 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14721282A JPS5936949A (ja) | 1982-08-25 | 1982-08-25 | マルチチツプパツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14721282A JPS5936949A (ja) | 1982-08-25 | 1982-08-25 | マルチチツプパツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5936949A true JPS5936949A (ja) | 1984-02-29 |
| JPH0126544B2 JPH0126544B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-05-24 |
Family
ID=15425100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14721282A Granted JPS5936949A (ja) | 1982-08-25 | 1982-08-25 | マルチチツプパツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5936949A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2065933A3 (en) * | 2007-11-21 | 2010-02-17 | Kabushiki Kaisha Toyoda Jidoshokki | Heat dissipation apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5248364U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1975-10-02 | 1977-04-06 | ||
| JPS57126154A (en) * | 1981-01-30 | 1982-08-05 | Nec Corp | Lsi package |
-
1982
- 1982-08-25 JP JP14721282A patent/JPS5936949A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5248364U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1975-10-02 | 1977-04-06 | ||
| JPS57126154A (en) * | 1981-01-30 | 1982-08-05 | Nec Corp | Lsi package |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2065933A3 (en) * | 2007-11-21 | 2010-02-17 | Kabushiki Kaisha Toyoda Jidoshokki | Heat dissipation apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0126544B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-05-24 |
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