JPH0126544B2 - - Google Patents

Info

Publication number
JPH0126544B2
JPH0126544B2 JP57147212A JP14721282A JPH0126544B2 JP H0126544 B2 JPH0126544 B2 JP H0126544B2 JP 57147212 A JP57147212 A JP 57147212A JP 14721282 A JP14721282 A JP 14721282A JP H0126544 B2 JPH0126544 B2 JP H0126544B2
Authority
JP
Japan
Prior art keywords
chip
chip carrier
sheet
wiring board
multilayer wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57147212A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5936949A (ja
Inventor
Toshihiko Watari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP14721282A priority Critical patent/JPS5936949A/ja
Publication of JPS5936949A publication Critical patent/JPS5936949A/ja
Publication of JPH0126544B2 publication Critical patent/JPH0126544B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP14721282A 1982-08-25 1982-08-25 マルチチツプパツケ−ジ Granted JPS5936949A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14721282A JPS5936949A (ja) 1982-08-25 1982-08-25 マルチチツプパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14721282A JPS5936949A (ja) 1982-08-25 1982-08-25 マルチチツプパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5936949A JPS5936949A (ja) 1984-02-29
JPH0126544B2 true JPH0126544B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-05-24

Family

ID=15425100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14721282A Granted JPS5936949A (ja) 1982-08-25 1982-08-25 マルチチツプパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS5936949A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5070014B2 (ja) * 2007-11-21 2012-11-07 株式会社豊田自動織機 放熱装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5248364U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1975-10-02 1977-04-06
JPS57126154A (en) * 1981-01-30 1982-08-05 Nec Corp Lsi package

Also Published As

Publication number Publication date
JPS5936949A (ja) 1984-02-29

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