JPS5931397Y2 - トランスフア成形機 - Google Patents

トランスフア成形機

Info

Publication number
JPS5931397Y2
JPS5931397Y2 JP1976125398U JP12539876U JPS5931397Y2 JP S5931397 Y2 JPS5931397 Y2 JP S5931397Y2 JP 1976125398 U JP1976125398 U JP 1976125398U JP 12539876 U JP12539876 U JP 12539876U JP S5931397 Y2 JPS5931397 Y2 JP S5931397Y2
Authority
JP
Japan
Prior art keywords
plunger
temperature
transfer molding
molding machine
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976125398U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5343066U (enrdf_load_stackoverflow
Inventor
進 都竹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1976125398U priority Critical patent/JPS5931397Y2/ja
Publication of JPS5343066U publication Critical patent/JPS5343066U/ja
Application granted granted Critical
Publication of JPS5931397Y2 publication Critical patent/JPS5931397Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP1976125398U 1976-09-20 1976-09-20 トランスフア成形機 Expired JPS5931397Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976125398U JPS5931397Y2 (ja) 1976-09-20 1976-09-20 トランスフア成形機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976125398U JPS5931397Y2 (ja) 1976-09-20 1976-09-20 トランスフア成形機

Publications (2)

Publication Number Publication Date
JPS5343066U JPS5343066U (enrdf_load_stackoverflow) 1978-04-13
JPS5931397Y2 true JPS5931397Y2 (ja) 1984-09-05

Family

ID=28734810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976125398U Expired JPS5931397Y2 (ja) 1976-09-20 1976-09-20 トランスフア成形機

Country Status (1)

Country Link
JP (1) JPS5931397Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5949007A (ja) * 1982-09-14 1984-03-21 Marantz Japan Inc 電池駆動型電子機器の低周波増幅器

Also Published As

Publication number Publication date
JPS5343066U (enrdf_load_stackoverflow) 1978-04-13

Similar Documents

Publication Publication Date Title
JPS5931397Y2 (ja) トランスフア成形機
DE3578953D1 (de) Verfahren und vorrichtung zur thermischen regelung fuer heisskanal-spritzwerkzeuge.
JPS6112087Y2 (enrdf_load_stackoverflow)
JPS5852106Y2 (ja) トランスファ−成形機
JPS5839427A (ja) プラスチック成形装置用ホットランナー
JPS565746A (en) Hot runner mold for injection molding
JPS61114827A (ja) プラスチツク成形用金型の加熱冷却方法
JPS61114824A (ja) レジンモ−ルド装置
JPS6198521A (ja) 成形装置
CN106427004A (zh) 一种制鞋用鞋底成型控制系统及其工艺
JPH06132331A (ja) 半導体封止金型
JPS6418620A (en) Mold temperature adjusting apparatus for injection molding machine
JPH05336Y2 (enrdf_load_stackoverflow)
JPS6154633A (ja) 半導体樹脂封止用金型
JP2997010B2 (ja) 半導体装置の製造方法及びそれに用いられるトランスファー金型
JPH0542939B2 (enrdf_load_stackoverflow)
US2217390A (en) Dry heat thermoplastic-denture press
JP2822835B2 (ja) 注型コイル用金型装置
JPH10180831A (ja) 半導体装置製造方法
JPS6286733A (ja) 樹脂モ−ルド装置
JPS57137130A (en) Method for resin sealing
JP2505174Y2 (ja) 射出成形金型
Fierkens et al. Method and Apparatus for Cold Runner Transfer Molding
JPS6130279Y2 (enrdf_load_stackoverflow)
JPS63126714A (ja) モ−ルドプレス装置