JPS5929001B2 - Suishiyouhatsushinkino Seizouhouhou - Google Patents

Description

[Detailed description of the invention] The present invention relates to a method of manufacturing a crystal oscillator.

Conventionally, a holding spring for a crystal oscillator in a crystal oscillator was attached to a terminal pin implanted on a base by spot welding or solder welding, making it troublesome to attach.

In particular, for crystal oscillators in which semiconductor chips such as ICs and LSIs are sealed in the same sealing container, and a crystal oscillation circuit is also configured in this same sealing container, the following points are important in manufacturing. It becomes a serious obstacle. That is, if the holding spring is attached after wire bonding to the terminal pins of the semiconductor chip and the base, the wire will get in the way of spot welding or solder welding of the holding spring, and sometimes the wire will be cut. On the contrary to f, if the holding spring is attached first, wire bonding becomes difficult. In addition, spot welding and solder welding generate splash and outgas during welding, and this splash and outgas contaminate semiconductor chips and deteriorate their performance. There is also a holding spring in which a small-diameter coil spring and a large-diameter coil spring are integrally formed, a terminal pin is press-fitted into the small-diameter coil spring, and a crystal resonator is held in the large-diameter coil spring, but according to this example, High processing precision is required to form a small-diameter coil spring that press-fits a thin terminal pin, and the coil spring contacts the entire circumference of the pin, so if you try to increase the contact pressure, it will be difficult to press-fit the pin and damage the pin. There is a risk.

Also, after holding the terminal pin and crystal resonator,
There were drawbacks such as the coil spring being easily displaced vertically and horizontally, resulting in a lack of stability. In manufacturing a crystal oscillator in which a crystal oscillator and a semiconductor chip for driving its oscillation are sealed in the same enclosure, the present invention provides a support part of a holding spring with a substantially triangular cross section, and a terminal pin is press-fitted into the pin. By configuring it in a shape that presses into contact at three points on the outer periphery of the triangle, a high contact pressure can be stably obtained, the terminal pin can be easily press-fitted, and the conductive adhesive poured into the triangular corners provides a strong connection. The present invention provides a manufacturing method that is easy to manufacture, has good work efficiency, and can reduce costs.

An embodiment of the present invention will be described.

A is the base of the crystal oscillator, which is composed of a shell 1, an insulating airtight glass 2, a hole 1a of the shell 1, and a terminal pin 3 passing through the airtight glass 2.

Two pins 3 facing each other among the terminal pins 3...
The pins a and 3a are made to protrude higher than the other pins. Base A
A semiconductor chip 4 for driving the oscillation of the crystal resonator is mounted on the upper surface of the central part of the
Paste. The semiconductor chips 4 are connected to corresponding terminal pins 3 through wires 5 having good conductivity such as aluminum wires. terminal pin 3a,
As shown in FIG. 3, the crystal resonator holding spring 6 attached to the pin 3a is composed of a holding part 7 having a slit 7a for holding the crystal resonator, and a support part 8 press-fitted into the pin 3a. The support portion 8 has a substantially triangular cross section, and is configured so that when the terminal pin 3a is press-fitted, it is pressed into contact with three points on the outer periphery of the pin. The pins 3a, 3a are press-fitted into the supporting parts 8, 8 of the pair of holding springs 6, 6.

Both ends of the disk crystal resonator 9 are sandwiched between the opposing slits 7A, 7a, so that the resonator is held in a state facing the semiconductor chip 4. Next, terminal pin 3a
, 3a and the supporting parts 8, 8, and into the portions of the crystal resonator 9 and the holding parts 7, 7, conductive adhesive 10 is poured to firmly fix them. Finally, base A on cap 11.
and seal the outer collar.

As described above, according to the present invention, it is easy to manufacture a crystal oscillator in which a crystal resonator and a semiconductor chip for driving its oscillation are sealed in the same container, and work efficiency is improved, and costs can be reduced.

The holding spring of the crystal resonator and its terminal pin can be connected by simply fitting the pin into the approximately triangular support formed at the lower end of the holding spring, so there is no need for spot welding or solder welding. There will be no adverse effects on the semiconductor chip due to splash or outgas during welding, or accidents such as wire breakage, and the triangular support portion will be in pressure contact at three points on the outer periphery of the pin, so high contact pressure will be stable. This results in a good electrical connection. In addition, for the support part of the holding spring and the mounting part of the terminal pin, conductive adhesive is poured into the triangular corner space of the support part where the terminal pin is press-fitted, so that the mounting strength can be strengthened. The pouring of the adhesive can be performed in the same process as the process of connecting the crystal resonator and the holding portion of the holding spring using a conductive adhesive, which is necessary in the conventional process.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal cross-sectional view of a crystal oscillator manufactured by the manufacturing method of the present invention, FIG. 2 is a cross-sectional view taken along the line of FIG. 1, and FIG.
The figure is an enlarged front view of the holding spring. A...Base, 1...Ciel, 2...
...Airtight glass, 3,3a...Terminal pin,
4... Semiconductor chip, 5... Wire,
6... Holding spring, 7... Holding part, 8...
...Support part, 9...Crystal resonator, 10.
... Conductive adhesive, 11... Cap.

Claims (1)

[Claims] 1. Affixing a semiconductor chip on a base, connecting the semiconductor chip and corresponding terminal pins of the base via bonding wires, and forming a holding part at one end to hold both ends of the disc-shaped crystal resonator, The other end is provided with a pair of holding springs each having a substantially triangular cross section and having a support portion into which a terminal pin is press-fitted and press-contacted at three points on the outer periphery of the pin, and the terminal pins facing each other are press-fitted into the child holding portion; The crystal resonator is held by the holding part so as to face the semiconductor chip, a conductive adhesive is poured into the triangular corner space of the supporting part into which the terminal pins are press-fitted, and the cap is fitted onto the base. A method for manufacturing a crystal oscillator, characterized in that the crystal oscillator is sealed.