JP2000151332A - Package for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for electronic component which eliminates the adverse influence of a flash on the characteristics of the electric component, even if it has higher reliability by airtightly sealing a metal base and a metal cap by resistance welding. SOLUTION: This package is constituted by packaging on element on a metal base 1, covering the metal base 1 with the metal cap 2, and sealing them airtightly through resistance welding, and a projection 121 is formed at the part of the metal base, 1 on which the metal cap 2 abuts and the metal cap 21 has a thick part 221 formed inside the projection 121.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package structure in which a metal base and a metal cap are hermetically sealed by resistance welding in an electronic component such as a crystal unit, and more particularly to a shape of a flange portion of the metal cap. It is.

[0002]

2. Description of the Related Art A conventional package for electronic parts hermetically sealed by resistance welding will be described with reference to the drawings. FIG. 7 is a sectional view showing a conventional example, and FIG. 8 is an enlarged sectional view of a welded portion of FIG. The metal base 1 has an element mounting portion 11 and a brim portion 12 formed thereon, and a triangular projection 121 is formed on the upper portion of the brim portion. The metal cap 2 includes an element housing portion 21 and a flange portion 2.
2 are formed. Although not shown, the metal base 1 or the metal cap 2 is plated with metal such as nickel.

When the element is mounted on the metal base 1, the metal cap 2 is put on, and a current is applied in a state where the protrusion 121 on the flange of the metal base and the flange 22 of the metal cap are pressed. The protrusion and the metal plating are melted and resistance welded. The projections 121 locally concentrate the welding current at the time of resistance welding to enhance welding efficiency.

[0004]

However, in the above configuration, when the flange portion 22 of the metal cap hits the projection 121 during resistance welding, the projection is crushed or the metal plating is peeled off. This may cause scattering of metal fine particles, so-called splash. At this time, the metal fine particles also entered the inside of the base, and in an electronic component such as a quartz oscillator, the metal fine particles adhered to the electrode surface of the element, which had an adverse effect on characteristics such as short-circuiting of the electrodes and variation in capacitance. .

Accordingly, the present invention provides a more reliable package of an electronic component, in which a metal base and a metal cap are hermetically sealed by resistance welding so that the splash does not adversely affect the characteristics of the electronic component. The purpose is to provide.

[0006]

As a means for solving the problems, an electronic component package according to the present invention comprises an element mounted on a metal base, a metal cap covered on the metal base, and hermetically sealed by resistance welding. In the package of parts,
A protrusion is formed at a portion of the metal base where the metal cap contacts, and the metal cap has a thick portion, a convex portion, a step portion, or a bent portion formed inside the protrusion. It is characterized by becoming.

Also, in a package of an electronic component in which an element is mounted on a metal base, a metal cap is put on the metal base, and resistance-welding is performed to hermetically seal the electronic component, a portion of the metal base where the metal cap comes into contact is provided. A projection is formed, and a concave portion corresponding to the projection is formed on the metal cap.

In the above structure, the height of the thick portion, the convex portion and the step portion, or the depth of the bent portion and the concave portion is not less than 50% and not more than 80% of the height of the projection. There is a feature.

According to the above configuration, the projection is crushed,
The metal particles are prevented from entering the inside of the base due to the splash generated by the metal plating peeling off. In addition, the displacement in the width direction when the metal cap is put on the metal base is prevented, and the positioning accuracy is improved.

The height of the thick part, the convex part, the step part, the bent part, and the fitting part is 50 times the height of the projection.
By setting the percentage to 80% or less, the welding current at the time of resistance welding is maintained locally concentrated on the protrusions without lowering the welding efficiency,
In addition, the configuration is optimal for suppressing intrusion of metal fine particles due to splash. Furthermore, the collapse of the projection is suppressed to a minimum, and the occurrence of splash itself is suppressed. When the height of the thick portion, the convex portion, the step portion, the bent portion, and the fitting portion is 50% or less of the height of the projection, metal particles due to splash are prevented from entering the inside of the base. Before the resistance welding is completed,
The shielding effect of metal fine particles is extremely low. Further, the thick portion,
When the height of the protrusion, the step, the bent portion, and the fitting portion is 80% or more of the height of the protrusion, when resistance welding is performed, the protrusion of the base is crushed, the thick portion,
The convex part, step part, bent part, fitting part abuts on the base,
Since there is a possibility that resistance welding is performed at two places together with the projection, it is conceivable that this may cause poor hermetic sealing.

[0011]

Next, a first embodiment of the present invention will be described with reference to FIGS. 1 and 2 by taking a package used for a crystal unit as an example. FIG. 1 is a sectional view showing a first embodiment of the present invention, and FIG. 2 is an enlarged sectional view of a welded portion of FIG. Note that the same parts as those in the related art are denoted by the same reference numerals.

The metal base 1 is made of iron, Kovar, or the like, and has an element mounting portion 11 and a brim portion 12 formed thereon. A triangular projection 121 is formed above the brim portion. Although not shown, a through hole is formed, and the lead terminals 3 and 3 are hermetically and insulated and sealed via glass. Supports 4 and 4 are arranged facing the inner leads of the lead terminals 3 and 3 and are welded by a spot welding method or a laser welding method. A quartz plate 5 having excitation electrodes (not shown) formed on the front and back is mounted on the support via a conductive bonding material (not shown).

The metal cap 2 is made of nickel silver, iron, Kovar, or the like, and has an element accommodating portion 21 and a brim portion 22. The brim portion 22 is a portion where the protrusion of the metal base comes into contact. A thick portion 221 is formed further inside, and a thin portion 222 is formed outside. The height L of the thick portion 221 (the height difference between the thin portion and the thick portion on the base contact side of the brim portion) is 50% or more and 80% or more of the height R of the projection. It is preferable to set the following. Although not shown, the metal base 1 and the metal cap 2 are plated with metal such as nickel.

Then, the metal cap 2 is put on the metal base 1, and a current is applied in a state where the projection 121 on the flange portion of the metal base and the thin portion 222 on the flange portion of the metal cap are pressed against each other. By melting the metal plating and performing resistance welding, it is hermetically sealed to complete the crystal resonator. In addition, the brim portion, the protrusion, and the thick portion of the metal base 1 and the metal cap 2 can be easily formed by press working.

Next, another embodiment of the present invention will be described with reference to FIGS. 3, 4, 5, and 6. FIG. 3 to 6 are enlarged sectional views of a welded portion showing another embodiment of the present invention. The same parts as those in the above-described embodiment are denoted by the same reference numerals, and a part of the description is omitted.

FIG. 3 shows a second embodiment.
The flange 22 of the metal cap 2 has a protrusion 223 inside the portion where the protrusion 121 of the metal base comes into contact.
Are formed. The projection 223 is formed by pressing the metal cap 2. It is preferable that the height L of the protrusion 223 is set to be 50% or more and 80% or less with respect to the height R of the protrusion. The shape of the projection is not limited to the illustrated shape.

FIG. 4 shows a third embodiment.
A step portion 224 is formed below the flange portion 22 of the metal cap 2 inside the portion where the protrusion 121 of the metal base abuts. The step portion 224 is formed by bending the brim portion of the metal cap 2 in a step-like manner by a press or the like so as to lower the height position inside the brim portion with respect to the outside. It is preferable that the height L of the step portion 224 is set to 50% or more and 80% or less with respect to the height R of the projection.

FIG. 5 shows a fourth embodiment.
A bent portion 225 is formed at a portion where the collar portion 22 of the metal cap 2 contacts the protrusion 121 of the metal base. The bent portion 225 is formed by bending a flange portion of the metal cap 2 into an inverted V-shape by pressing or the like. Preferably, the depth L of the bent portion 225 is set to be 50% or more and 80% or less with respect to the height R of the projection.
In addition, the shape of the bent portion is not limited to the inverted V shape, but the inverted U shape,
It is also possible to change the inverted U-shape, W-shape, M-shape, N-shape and the like.

FIG. 6 shows a fifth embodiment.
A recess 226 is formed in a portion of the metal cap 2 where the protrusion 121 of the metal base comes into contact. The recess 226 is formed by pressing or grinding the flange of the metal cap 2. The depth L of the recess 226 is:
50% or more with respect to the height dimension R of the protrusion 8
It is preferable to set it at 0% or less. The shape of the recess is not limited to the illustrated shape.

Although the embodiments of the present invention have been described by taking a quartz oscillator as an example, the present invention is not limited to these electronic components. It can be applied to packages of all electronic components that are hermetically sealed by resistance welding, such as piezoelectric filters, piezoelectric oscillators, ceramic oscillators, ceramic filters, SAW resonators, SAW filters, capacitors, resistors, pyroelectric sensors, and semiconductor devices. Needless to say, it can be applied to electronic components.

[0021]

According to the present invention, the protrusion is crushed,
This prevents metal fine particles due to splash generated by peeling of the metal plating from entering the inside of the base. In addition, the displacement in the width direction when the metal cap is put on the metal base is prevented, and the positioning accuracy is improved. Therefore, it is possible to provide a package of an electronic component that can improve the product yield and the reliability without adversely affecting the characteristics of the electronic component even if the splash occurs.

The height of the thick part, the convex part, the step part, the bent part, and the fitting part is 50 times the height of the projection.
By setting the percentage to 80% or less, in addition to the above-described effects, the welding current at the time of resistance welding is kept locally concentrated on the protruding portion without lowering the welding efficiency, and This is an optimal configuration for suppressing the penetration of metal fine particles due to splash. Furthermore, the collapse of the projection can be suppressed to a minimum, and the occurrence of splash itself can be suppressed.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

FIG. 2 is an enlarged sectional view of a welded portion in FIG. 1;

FIG. 3 is a sectional view showing a second embodiment of the present invention.

FIG. 4 is a sectional view showing a third embodiment of the present invention.

FIG. 5 is a sectional view showing a fourth embodiment of the present invention.

FIG. 6 is a sectional view showing a fifth embodiment of the present invention.

FIG. 7 is a sectional view showing a conventional example.

FIG. 8 is an enlarged sectional view of a welded portion in FIG. 7;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Metal base 2 ... Metal cap 3 ... Lead terminal 4 ... Support 5 ... Quartz plate

Claims (3)

[Claims] An electronic component package comprising an element mounted on a metal base, a metal cap covered by the metal base, and hermetically sealed by resistance welding, wherein a portion of the metal base contacting the metal cap is provided. A package for an electronic component, wherein a projection is formed, and a thick portion, a projection, a step, or a bent portion is formed inside the metal cap on the projection. 2. An electronic component package comprising an element mounted on a metal base, a metal cap overlaid on the metal base, and hermetically sealed by resistance welding, wherein a portion of the metal base contacting the metal cap is provided. A package for an electronic component, wherein a projection is formed, and a recess corresponding to the projection is formed in the metal cap. 3. The height dimension of the thick portion, the convex portion, and the step portion,
The electronic component package according to claim 1, wherein a depth dimension of the bent portion and the concave portion is not less than 50% and not more than 80% of a height dimension of the projection.