JP3053662U - Hermetically sealed packaging structure of die - Google Patents

Abstract

[PROBLEMS] To provide a hermetically sealed packaging structure of a quartz oscillator which is excellent in reliability, airtightness and economy, and has a small deformation. A ceramic base (10), which is formed in a planar shape and supports a die, is joined to a surface of the ceramic base (10) by soldering (20). Surrounding metal part formed around (30)
And formed in a flat shape, and the metal surrounding portion (3
0), and before the metal cap (40) is bonded onto the metal surrounding portion (30) by the caulking welding, quartz is formed on the surface of the ceramic base (10). Table
(43), and place silver paste (4) on the quartz table (43).
After bonding one end of the quartz oscillator die (41) in 2), a through hole is formed at a position corresponding to the quartz table (42) of the ceramic base (10), and the conductive paste is formed therein. The conductor lead (44) is formed by filling the material.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a hermetically sealed packaging structure of a die, and more particularly, to a hermetically sealed packaging structure of a quartz oscillator die having excellent reliability, hermeticity, economy, and small deformation.

[0002]

[Prior art]

 The conventional quartz resonator packaging structure requires a low coefficient of thermal expansion and a high degree of hermeticity to ensure the stability of vibration.Therefore, a ceramic base with a low coefficient of thermal expansion is used as a support for the quartz resonator die. Then, the ceramic base was sealed using a press-formed metal cap or a flat metal cap, and thus the effect of hermetic sealing was achieved. That is, as shown in FIG. 3, the packaging structure of a conventional quartz oscillator includes a planar ceramic base (60) and a metal cap (50) formed in a U-shape. However, since a large stress is always generated in the bent portion of the metal cap (50) formed in the U-shape, the metal cap (50) is easily deformed and adversely affects the airtightness. There was a problem.

In order to solve the problem of the stress of the metal cap, as shown in FIG. 4, a ceramic base (80) is processed to be formed in an indented shape. A packaging structure was formed by bonding the metal cap (70) with the metal cap (70). However, since the ceramic base (80) needs to go through complicated processing steps to make it inwardly concave, the problem that the manufacturing cost is too high still remains.

[0004]

[Problems to be solved by the invention]

 SUMMARY OF THE INVENTION An object of the present invention is to provide a hermetically sealed packaging structure of a quartz oscillator that is excellent in reliability, airtightness, and economy, and has a small amount of deformation, in order to solve the conventional problems.

[0005]

[Means for Solving the Problems]

 In order to achieve the above object, the hermetic sealing packaging structure of the die of the present invention is formed in a planar shape, and is bonded to a ceramic base of a base supporting the die and a surface of the ceramic base by soldering. It is characterized by comprising a metal surrounding portion formed so as to surround the ceramic base, and a metal cap formed in a planar shape and connected to the metal surrounding portion by caulking welding.

As shown in FIG. 1, in the hermetically sealed packaging structure of the die, the ceramic base (10) is formed in a planar shape and does not need to be processed into an indented shape, so that the manufacturing cost is low. Become.

In the hermetically sealed packaging structure of the die, since the cap (40) may be formed in a flat shape, it is not necessary to process the cap (40) into a U-shape. The amount is small, and the reliability and airtightness are improved.

[0008] In the hermetically sealed packaging structure of the die, the die is a die for a quartz oscillator, and one end of the die for the quartz oscillator is fixed to the ceramic base by a quartz support. preferable.

In the hermetically sealed packaging structure of the die, it is preferable that a through hole is formed in the ceramic base, and the conductive lead is formed by filling the through hole with a conductive paste material.

As shown in FIG. 2, a through hole is formed at a position corresponding to the quartz table (42) of the quartz vibrator die (41) of the ceramic base (10), and a conductive paste material is formed in the through hole. The conductor lead (44) is formed by filling in the conductor lead (44), and a signal can be taken out from the quartz oscillator die (41) or transmitted to the quartz oscillator die (41) by the conductor lead (44). Become like Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0011]

[Embodiment of the invention]

 FIG. 1 is a sectional view of a hermetically sealed packaging structure of a die according to the present invention. FIG. 2 is a cross-sectional view showing a case where a die for a quartz oscillator having a hermetically sealed packaging structure according to the present invention is mounted.

As shown in FIG. 1, the hermetically sealed packaging structure of the die according to the present invention is formed in a planar shape and has a ceramic base (10) for supporting the die and a soldering (20). And a metal surrounding portion (30) formed to surround the ceramic base (10) and bonded to the surface of the ceramic base (10) at a flat surface and formed by caulking welding. 30) and a metal cap (40) bonded thereon.

As shown in FIG. 2, when attaching a quartz oscillator die to the hermetically sealed packaging structure of the die according to the present invention, the metal cap (40) is attached to the metal surrounding part (30) by caulking welding. Before bonding on the quartz base (43), a quartz base (43) is attached to the surface of the ceramic base (10) surrounded by the metal surrounding part (30), and the silver paste (43) is placed on the quartz base (43). After coupling one end of the quartz oscillator die (41) with 42), a through-hole is formed in the ceramic base (10) at a position corresponding to the quartz table (42) of the quartz oscillator die (41). Once formed, the conductive leads (44) are formed by filling the through holes with a conductive paste material. As the conductive paste material, a paste material in which conductive particles such as copper and silver are mixed with a resin can be used. Thereafter, the metal cap (40) is joined to the metal surrounding portion (30) by caulking welding, and the quartz oscillator is completed.

According to the embodiment of the present invention, as shown in FIG. 1, in the hermetically sealed packaging structure of the die, the ceramic base (10) is formed in a planar shape and is processed into an indented shape. Since there is no need, manufacturing costs are reduced.

[0015] In the hermetically sealed packaging structure of the die, the cap (40) may be formed in a flat shape, so that it is not necessary to process it into a U-shape, and no stress is generated in the cap (40). The amount is small, and the reliability and airtightness are improved.

[0016]

[Effect of the invention]

 As described above, according to the present invention, the ceramic base, which is formed in a planar shape and supports the die, is joined to the surface of the ceramic base by soldering, and is formed so as to surround the ceramic base. Quartz, which is excellent in reliability, airtightness, economy, and has a small amount of deformation, by forming a metal surrounding portion and a metal cap formed in a planar shape and joined on the metal surrounding portion by caulking welding. It is possible to provide an airtight sealing packaging structure for the vibrator.

[Brief description of the drawings]

FIG. 1 is a sectional view of a hermetically sealed packaging structure of a die according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a case where a quartz oscillator die is attached to the hermetically sealed packaging structure of the die according to an embodiment of the present invention.

FIG. 3 is a sectional view of a conventional quartz oscillator packaging structure.

FIG. 4 is a sectional view of a conventional quartz oscillator packaging structure.

[Explanation of symbols]

 10, 60, 80 Ceramic base 20 Solder 30 Metal periphery 40, 50, 70 Metal cap 41 Quartz vibrator die 42 Silver paste 43 Quartz table 44 Conductor lead

Claims (4)

[Utility model registration claims] 1. A ceramic base of a base formed in a planar shape and supporting a die; and a metal surrounding part joined to a surface of the ceramic base by soldering and formed so as to surround a periphery of the ceramic base; A hermetically sealed packaging structure for a die, comprising: a metal cap formed in a planar shape and joined to the metal surrounding portion by caulking welding. 2. The hermetically sealed packaging structure of claim 1, wherein the die is a quartz oscillator die. 3. The hermetically sealed packaging structure of claim 2, wherein one end of the quartz oscillator die is fixed to the ceramic base by a quartz support. 4. The hermetic sealing of a die according to claim 1, wherein a through-hole is formed in the ceramic base, and a conductive lead is formed by filling the through-hole with a conductive paste material. Packaging structure.