JPS5928462B2 - Method of manufacturing laminates - Google Patents

Method of manufacturing laminates

Info

Publication number
JPS5928462B2
JPS5928462B2 JP51096561A JP9656176A JPS5928462B2 JP S5928462 B2 JPS5928462 B2 JP S5928462B2 JP 51096561 A JP51096561 A JP 51096561A JP 9656176 A JP9656176 A JP 9656176A JP S5928462 B2 JPS5928462 B2 JP S5928462B2
Authority
JP
Japan
Prior art keywords
base material
laminate
pressure
viscosity
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51096561A
Other languages
Japanese (ja)
Other versions
JPS5322572A (en
Inventor
憲一 刈屋
義治 武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP51096561A priority Critical patent/JPS5928462B2/en
Publication of JPS5322572A publication Critical patent/JPS5322572A/en
Publication of JPS5928462B2 publication Critical patent/JPS5928462B2/en
Expired legal-status Critical Current

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  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Description

【発明の詳細な説明】 本発明は基材切れ現象、気泡の少ない積層板の製造方法
に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a laminate with less substrate breakage and bubbles.

従来の積層板の製造方法は、基材に熱硬化性樹脂を含浸
又は塗布し予備乾燥した後、これを積み重ねプレス熱盤
間に挿入してすぐ加熱、加圧して成形する。
In the conventional method for producing a laminate, a base material is impregnated or coated with a thermosetting resin, pre-dried, and then stacked, inserted between press platens, and immediately heated and pressurized to form the material.

積層板用に使用する基材としてはガラス布、ガラスマッ
ト、ガラス不織布、紙、布などが一般的であり、特に湿
潤した状態での強度が弱く、密度の小さいガラスマット
、ガラス不織布を基材として使用する場合は、成形圧力
を高めることによつて積層板中の気泡を少くして電気性
能、耐湿性能などを向上することができるが、反面、成
形中に流動する樹脂が基材を押し流し所謂基材切れ現象
が生じ積層板の外観、特性を損なう原因となりやすい。
又、反対に成形圧力を低くすると基材切れ現象を防止す
ることはできるが積層板中の気泡が多くなり電気性能、
端湿性などが悪化すフ る傾向にある。このように従来
はガラスマット、ガラス不織布を基材として使用する積
層板は、湿潤状態での強度が比較的強く、密度の大きい
ガラス布、紙、布などを使用する積層板に比較して基材
切れを防止するためには成形圧力を低くせざる; を得
ず、従つて気泡を多く含有する積層板となるのが一般的
である。本発明は、特に湿潤状態での強度が弱く、密度
の小さいガラスマット、ガラス不織布などを基材として
使用する積層板において、成形圧力を高めO て気泡が
少なく電気性能、耐湿性能を向上せしめしかも基材切れ
現象を防止した積層板の製造方法を提供するものである
The base materials used for laminates are generally glass cloth, glass mat, glass nonwoven fabric, paper, cloth, etc. Glass mats and glass nonwoven fabrics are particularly weak in strength when wet and have low density. When used as a laminate, increasing the molding pressure can reduce air bubbles in the laminate and improve electrical performance and moisture resistance, but on the other hand, the flowing resin during molding may wash away the base material. A so-called base material breakage phenomenon occurs, which tends to cause damage to the appearance and properties of the laminate.
On the other hand, if the molding pressure is lowered, the phenomenon of substrate breakage can be prevented, but the number of air bubbles in the laminate increases and the electrical performance deteriorates.
There is a tendency for conditions such as edge humidity to worsen. In this way, conventional laminates using glass mat or glass non-woven fabric as a base material have relatively strong strength in a wet state, compared to laminates using dense glass cloth, paper, fabric, etc. In order to prevent material breakage, the molding pressure must be lowered; therefore, the result is generally a laminate containing many air bubbles. The present invention improves electrical performance and moisture resistance by increasing molding pressure and reducing air bubbles in laminates that use glass mats, glass nonwoven fabrics, etc. as base materials, which have low strength and low density especially in wet conditions. The present invention provides a method for manufacturing a laminate that prevents the phenomenon of substrate breakage.

湿潤状態での強度が弱く、密度が小さいガラスマット、
ガラス不織布などを基材とする積層板に5 おいて、成
形圧力を高めて、しかも基材切れ現象を防止し、気泡の
少ない良好な積層板を製造するために、本発明では、成
形中に一旦溶融して粘度が低下し流動する熱硬化性樹脂
が最低粘度に至る前の段階で基材を押し流し得なくなる
までまず接0触圧にて加熱し、その後積層板中の気泡を
少なくし得る圧力まで加圧し成形するようにした。
Glass mat with low strength and low density in wet condition,
In the present invention, in order to increase the molding pressure and prevent the substrate breakage phenomenon, and to produce a good laminate with few air bubbles, the present invention uses Once melted, the viscosity decreases and the flowing thermosetting resin reaches its lowest viscosity. Before the thermosetting resin reaches its lowest viscosity, it is first heated at zero contact pressure until the base material can no longer be washed away, and then air bubbles in the laminate can be reduced. It was then pressurized to the maximum pressure and molded.

本発明の原理を説明するために第1図に積層板成形中の
熱硬化性樹脂の粘度経時変化を、又第2図に本発明方法
により成形する場合の圧力の変化■5 をそれぞれ対比
させて示す。即ち、第1図に示すように、成形時の樹脂
粘度はまずプレス熱盤の昇温に従つて下がり、その後硬
化反応に伴なつて増加する。第2図に示す様に本発明は
熱硬化性樹脂が最低粘度に至る前の段階で所定の粘度に
下がり基材を押し流さなくなるまで接触圧で保持し(時
間t)その後所定の圧力まで昇圧してそのまま硬化させ
る製造方法である。本発明は、熱硬化性樹脂が最低粘度
に至る前の段階において、基材を押し流さない粘度にな
るまで接触圧で加熱することにより基材切れを防止でき
、その後最低粘度に至る前の段階から加圧するので、熱
硬化性樹脂が低粘度にある間の加圧時間を長くとれ、そ
の間に脱泡を十分行なえることにより、気泡の小さい電
気特性の優れた積層板を得ることができるのである。
In order to explain the principle of the present invention, Fig. 1 shows the change in viscosity of the thermosetting resin over time during laminate molding, and Fig. 2 shows the change in pressure during molding according to the method of the present invention. Shown. That is, as shown in FIG. 1, the resin viscosity during molding first decreases as the temperature of the press heating plate increases, and then increases as the curing reaction occurs. As shown in Fig. 2, in the present invention, before the thermosetting resin reaches its lowest viscosity, the contact pressure is maintained until the viscosity drops to a predetermined value and the base material is no longer washed away (time t), and then the pressure is increased to a predetermined pressure. This is a manufacturing method in which the material is cured as it is. The present invention is capable of preventing base material breakage by heating the thermosetting resin with contact pressure until it reaches a viscosity that does not wash away the base material at a stage before the thermosetting resin reaches its lowest viscosity. Since it is pressurized, the thermosetting resin can be pressurized for a long time while it has a low viscosity, and by degassing sufficiently during that time, it is possible to obtain a laminate with small bubbles and excellent electrical properties. .

成形時に一旦流動する熱硬化性樹脂が基材を押し流し得
ない樹脂粘度ηは使用する樹脂、充填剤などにはあまり
影響を受けないが使用する基材の湿潤状態での強度及び
成形圧力により変わるため実験的に決定すべきである。
The resin viscosity η, at which the thermosetting resin that flows during molding cannot wash away the base material, is not affected by the resin or filler used, but it changes depending on the wet strength of the base material used and the molding pressure. Therefore, it should be determined experimentally.

尚、樹脂が硬化反応を起こして粘度が増加する過程で再
び粘度がηに達した時点から基材を押し流し基材切れ現
象を生じさせると考えられるが、ここでは粘度の増加が
急激であるため実際には基材切れ現象は起こらない本発
明に適用できる熱硬化性樹脂は、エポキシ樹脂、フエノ
ール樹脂、メラミン樹脂、ポリエステル樹脂など全ての
熱硬化性樹脂である。
In addition, in the process where the resin undergoes a curing reaction and its viscosity increases, it is thought that the base material is washed away from the point at which the viscosity reaches η again, causing the base material breakage phenomenon, but in this case, the increase in viscosity is rapid. Thermosetting resins applicable to the present invention, which do not actually cause the substrate breakage phenomenon, include all thermosetting resins such as epoxy resins, phenolic resins, melamine resins, and polyester resins.

又、適用できる基材は、ガラス布、ガラスマツト、ガラ
ス不織布、紙、布、合成繊維の織布、不織布などで積層
板用は供される全ての基材であるが、特に湿潤状態での
強度が弱く、密度の小さいガラスマツト、ガラス不織布
などを基材として使用する積層板では従来技術より極め
て容易に耐湿特性、電気特性の良好な積層板を提供でき
る。次に本発明の実施例を示す。
Applicable substrates include glass cloth, glass mat, glass non-woven fabric, paper, cloth, synthetic fiber woven fabric, non-woven fabric, etc., all of which are used for laminates, but especially those with high strength in wet conditions. In the case of a laminate using glass mat, glass non-woven fabric, etc., as a base material, which has a low density and a low density, it is possible to provide a laminate with good moisture resistance and electrical properties much more easily than the conventional technology. Next, examples of the present invention will be shown.

実施例 1 ガラス不織布基材にエポキシ樹脂を樹脂量60%にはる
様付着させ予備乾燥して得たプリプレダを10枚積層し
プレスにて60分間加熱加圧して1.6中厚の積層板を
作つた。
Example 1 10 sheets of prepredder obtained by adhering epoxy resin to a glass non-woven fabric base material in a resin amount of 60% and pre-drying were laminated and heated and pressed in a press for 60 minutes to form a 1.6 medium thickness laminate. I made it.

(以下発明品1という)この際プレス熱盤間に挿入した
プリプレグの樹脂粘度104ポイズに下がるまで接触圧
で保持し、その後80kg/CTIIまで昇圧させて成
形した。プレス熱盤の温度は成形中170℃に設定した
。実施例 2紙基材にフエノール樹脂(軽質タンカルを
30%添加)を樹脂量50%になる様付着させ予備乾燥
して得たプリプレグを9枚積層しプレスにて60分間加
熱加圧して1.6mm厚の積層板を作つた。
(Hereinafter referred to as invention product 1) At this time, the contact pressure was maintained until the resin viscosity of the prepreg inserted between the press hot platens decreased to 104 poise, and then the pressure was increased to 80 kg/CTII and molded. The temperature of the press hot plate was set at 170° C. during molding. Example 2 9 sheets of prepreg obtained by adhering phenolic resin (30% light tankal added) to a paper base material to a resin amount of 50% and pre-drying were laminated and heated and pressed in a press for 60 minutes.1. A 6mm thick laminate was made.

(以下発明品2という)この際プレス熱盤間に挿入した
プリプレグの樹脂粘度が105ポイズになるまで接触圧
で保持し、その後100k9/dまで昇圧させて成形し
た。プレス熱盤温度は成形中170℃に設定した。次に
比較のために従来の方法について述べる。
(Hereinafter referred to as invention product 2) At this time, the contact pressure was maintained until the resin viscosity of the prepreg inserted between the press hot platens reached 105 poise, and then the pressure was increased to 100 k9/d for molding. The press platen temperature was set at 170° C. during molding. Next, a conventional method will be described for comparison.

従来例 1実施例1と同様のプリプレグを10枚積層し
プレスにて60分間加熱加圧して1.6mm圧の積層板
を作つた。
Conventional Example 1 Ten prepregs similar to those in Example 1 were laminated and heated and pressed in a press for 60 minutes to produce a laminate with a thickness of 1.6 mm.

(以下従来品1という)この際プレス熱盤間にプリプレ
グを挿入直後圧力を301<9/〜に昇圧させて成形し
た。プレス熱盤温度は成形中170℃に設定した。従来
例 2 実施例1と同様のプリプレグを10枚積層しプレスにて
60分間加熱加圧して1.6m77!厚の積層板を作つ
た。
(Hereinafter referred to as conventional product 1) At this time, immediately after inserting the prepreg between press hot platens, the pressure was increased to 301<9/~ and molding was performed. The press platen temperature was set at 170° C. during molding. Conventional Example 2 10 sheets of prepreg similar to Example 1 were laminated, heated and pressed in a press for 60 minutes, and the result was 1.6 m77! I made a thick laminate.

(以下従来品2という)この際プレス熱盤間にプリプレ
グを挿入直後圧力を80kg/(−Filに昇圧させて
成形した。プレス熱盤温度は成形中170さCに設定し
た。従来例 3 実施例2と同様のプリプレグを9枚積層しプレスにて6
0分間加熱加圧して1.6mm厚の積層板を作つた。
(Hereinafter referred to as conventional product 2) Immediately after inserting the prepreg between the press hot plates, the pressure was increased to 80 kg/(-Fil) and molded. The press hot plate temperature was set at 170 °C during molding. Conventional Example 3 Implementation Laminate 9 sheets of prepreg similar to Example 2 and press 6 sheets.
A 1.6 mm thick laminate was produced by heating and pressing for 0 minutes.

(以下従来品3という)この際プレス熱盤間にプリプレ
グを挿入直後圧力を60k9/dに昇圧させて成形した
。プレス熱盤温度は成形中170せCに設定した。従来
例 4 実施例2と同様のプリプレグを9枚積層しプレスにて6
0分間加熱加圧して1.6關厚の積層板を作つた。
(Hereinafter referred to as conventional product 3) At this time, immediately after inserting the prepreg between press hot platens, the pressure was increased to 60 k9/d and molding was performed. The press platen temperature was set at 170°C during molding. Conventional example 4 Nine prepregs similar to those in Example 2 were laminated and pressed into six
A 1.6 inch thick laminate was produced by heating and pressing for 0 minutes.

(以下従来品4という)この際プレス熱盤間にプリプレ
グを挿入直後圧力を100kg/〜に昇圧させて成形し
た。プレス熱盤温度は成形中170℃に設定した。発明
品1,2,従来品1乃至4の外観、絶縁抵抗及び吸水量
を測定した結果を第1表に示す。
(Hereinafter referred to as conventional product 4) At this time, immediately after inserting the prepreg between press hot platens, the pressure was increased to 100 kg/~ and molded. The press platen temperature was set at 170° C. during molding. Table 1 shows the results of measuring the appearance, insulation resistance, and water absorption of Invention Products 1 and 2 and Conventional Products 1 to 4.

第1表の結果より、基材にガラス不織布を使用した積層
板において従来技術では成形圧力30k9/dの従来品
1の場合基材切れを防止できるが絶縁抵抗が低くて吸水
量が多く、また成形圧力80k9/への従来品2の場合
は絶縁抵抗吸水量については良好であるが基材切れが発
生している。一方発明品1は成形圧力80k9/Crl
でも基材切れがなく性能的に良好なことがわかる。また
、基材に紙を使用した積層板においても発明品2は基材
切れすることなく性能的に良好なことがわかる。
From the results in Table 1, it can be seen that in the case of conventional product 1 with a molding pressure of 30k9/d in the case of a laminate using glass nonwoven fabric as the base material, breakage of the base material can be prevented, but the insulation resistance is low and the amount of water absorbed is large. In the case of conventional product 2 under a molding pressure of 80k9/, the insulation resistance and water absorption were good, but the base material broke. On the other hand, invention product 1 has a molding pressure of 80k9/Crl.
However, it can be seen that the performance is good as there is no breakage of the base material. Furthermore, it can be seen that even in the case of a laminate using paper as the base material, Invention Product 2 has good performance without the base material being cut.

上述のように本発明によれば、基材として特に湿潤状態
での強度が弱く、密度の小さいガラスマツト、ガラス不
織布などを使用して成形する際にも基材切れ現象を防止
し気泡の少ない良好な積層板を得ることができる。
As described above, according to the present invention, even when molding is performed using glass matte, glass nonwoven fabric, etc., which have low strength especially in a wet state and low density as a base material, the phenomenon of base material breakage is prevented and the molding process is performed with few bubbles. laminates can be obtained.

更に比較的湿潤状態での強度が強く、密度の高い紙など
を基材に使用する場合においても、コストダウンを目的
として樹脂に充填剤を多量に添加する場合とか、耐薬品
性を向上させる目的で樹脂量を増やす場合なども本発明
によれば成形圧力を高めてしかも基材切れ現象を防止し
、気泡の少ない良好な積層板を得ることができる。本発
明は特に湿潤状態での強度が弱く、密度が小きい基材に
適用するものであるが、湿潤状態での強度が強く、密度
の大きい基材に対しても有効であり工業的価値は極めて
大なるものである。
Furthermore, even when paper, which has relatively strong strength in wet conditions and high density, is used as a base material, a large amount of filler may be added to the resin for the purpose of reducing costs, or for the purpose of improving chemical resistance. According to the present invention, even when the amount of resin is increased, the molding pressure can be increased, the phenomenon of substrate breakage can be prevented, and a good laminate with few bubbles can be obtained. Although the present invention is particularly applicable to base materials with low strength and low density in a wet state, it is also effective for base materials with high strength and high density in a wet state, and has no industrial value. It is extremely large.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は積層板成形中の熱硬化性樹脂粘度の経時変化を
示す曲線図、第2図は本発明における成形圧力の経時変
化を示す曲線図である。
FIG. 1 is a curve diagram showing the change over time in the viscosity of the thermosetting resin during laminate molding, and FIG. 2 is a curve diagram showing the change over time in the molding pressure in the present invention.

Claims (1)

【特許請求の範囲】[Claims] 1 基材に熱硬化性樹脂を含浸、予備乾燥して得たプリ
プレグを積み重ねプレス熱盤間に挿入して加熱、加圧す
るに際し、加熱によつて一旦溶融する熱硬化性樹脂が最
低粘度に至る前において、基材を押し流さない粘度にな
るまでまず接触圧で加熱し、その後所定の圧力まで昇圧
して加熱、加圧成形することを特徴とする積層板の製造
方法。
1 When prepregs obtained by impregnating a base material with thermosetting resin and pre-drying are stacked and inserted between press hot plates and heated and pressurized, the thermosetting resin, which is once melted by heating, reaches its lowest viscosity. 1. A method for producing a laminate, which comprises first heating with contact pressure until the viscosity reaches a level that does not wash away the base material, and then increasing the pressure to a predetermined pressure, heating, and pressure forming.
JP51096561A 1976-08-12 1976-08-12 Method of manufacturing laminates Expired JPS5928462B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51096561A JPS5928462B2 (en) 1976-08-12 1976-08-12 Method of manufacturing laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51096561A JPS5928462B2 (en) 1976-08-12 1976-08-12 Method of manufacturing laminates

Publications (2)

Publication Number Publication Date
JPS5322572A JPS5322572A (en) 1978-03-02
JPS5928462B2 true JPS5928462B2 (en) 1984-07-13

Family

ID=14168445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51096561A Expired JPS5928462B2 (en) 1976-08-12 1976-08-12 Method of manufacturing laminates

Country Status (1)

Country Link
JP (1) JPS5928462B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3413434A1 (en) * 1984-04-10 1985-10-17 Dielektra GmbH, 5000 Köln METHOD FOR CONTINUOUSLY PRODUCING COPPER-COATED BASE MATERIAL FOR CIRCUIT BOARDS

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52142770A (en) * 1976-05-22 1977-11-28 Toho Beslon Co Method of formation of composite material

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52142770A (en) * 1976-05-22 1977-11-28 Toho Beslon Co Method of formation of composite material

Also Published As

Publication number Publication date
JPS5322572A (en) 1978-03-02

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