JPS5955720A - Manufacture of laminated board - Google Patents

Manufacture of laminated board

Info

Publication number
JPS5955720A
JPS5955720A JP57168096A JP16809682A JPS5955720A JP S5955720 A JPS5955720 A JP S5955720A JP 57168096 A JP57168096 A JP 57168096A JP 16809682 A JP16809682 A JP 16809682A JP S5955720 A JPS5955720 A JP S5955720A
Authority
JP
Japan
Prior art keywords
resin
prepreg
base material
laminate
laminated board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57168096A
Other languages
Japanese (ja)
Other versions
JPS636323B2 (en
Inventor
Takahiro Yamaguchi
貴寛 山口
Kiyoshi Osaka
喜義 大坂
Masayuki Noda
雅之 野田
Kenichi Kariya
刈屋 憲一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP57168096A priority Critical patent/JPS5955720A/en
Publication of JPS5955720A publication Critical patent/JPS5955720A/en
Publication of JPS636323B2 publication Critical patent/JPS636323B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulding By Coating Moulds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To obtain a laminated board by preventing a basic material from tearing in the time of molding, by accelerating curing reaction of impregnated resin which is in a state of not flowing or its resemblance by heating and pressing a prepreg under first impregnating and drying processes of resin to a basic material. CONSTITUTION:A prepreg is obtained by impregnating non-woven fabrics with epoxy resin varnish consisting of 100 weight parts epoxy resin, 3 weight parts curing agent of dicyandiamide and 0.2 weight parts accelerator of 2-methyl-4- methylimidazole and drying the same so as to get 60wt% resin quantity and 0% flow value, which is further impregnated with the epoxy resin and dried so as to get 75wt% total resin quantity and 20% flow value. A laminated board is obtained by laminating eight sheets of the prepregs which are heated and pressed for 30min at pressure of 60kg/cm<2> and temperature of 160 deg.C.

Description

【発明の詳細な説明】 本発明は、成形時ζこおける基材切れを防止した積層板
の製造法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a laminate that prevents substrate breakage during molding.

積層板は、周知の如く熱硬化性樹脂を基材に 1 − 含浸、乾燥して得られるプリプレグを積層し、加熱加圧
して得られる。例えば、ガラス不織布を基材として用い
た場合、プリプレグの樹脂の硬化度が小さければ成形時
の樹脂の溶融粘度は低く基材切れは少ないが得られる積
層板の板厚精度が悪くなる。一方、プリプレグの樹脂の
硬化度を進めである場合は、成形時の樹脂の溶融粘度が
上昇り基材切れを起こしおくなる。
As is well known, the laminate is obtained by laminating prepregs obtained by impregnating and drying a thermosetting resin as a base material and heating and pressurizing the prepregs. For example, when a glass nonwoven fabric is used as a base material, if the degree of curing of the prepreg resin is low, the melt viscosity of the resin during molding will be low and there will be less base material breakage, but the thickness accuracy of the resulting laminate will be poor. On the other hand, if the degree of curing of the prepreg resin is too high, the melt viscosity of the resin increases during molding, which tends to cause the base material to break.

本発明°は、成形時における基材切れを防止した積層板
の製造法を提供することを目的とするものである。
An object of the present invention is to provide a method for manufacturing a laminate that prevents the substrate from breaking during molding.

即ち、基材への樹脂含浸、乾燥工程を2度繰り返して得
られるプリプレグを一部乃至全部として用いる積層板の
製造において、基材への1度目の樹脂含浸、乾燥工程で
はプリプレグを加熱加圧しても樹脂が流動しないかそれ
に近い状態まで含浸樹脂の硬化反応を進めることを特徴
とするものである。1度目に含浸した樹脂を加熱加圧し
ても流動しないかほとんど流動しない程度まで硬化させ
ておくことによって、基材の 9 − 繊維間は確実に結合され繊維間を結合している樹脂は成
形時に流動しないかほとんど流動しない状態にあるので
、基材の強度を高めて成形時における基材切れを良好に
防止することになる。
That is, in the manufacture of a laminate using prepreg obtained by repeating the resin impregnation and drying process twice into the base material as part or all of the base material, the prepreg is heated and pressurized in the first resin impregnation and drying process. It is characterized by proceeding with the curing reaction of the impregnated resin to a state where the resin does not flow, or is close to it, even if the resin does not flow. By curing the resin impregnated for the first time to the extent that it does not flow or hardly flows even when heated and pressurized, the fibers of the base material are reliably bonded, and the resin bonding between the fibers is bonded during molding. Since it is in a state where it does not flow or hardly flows, the strength of the base material is increased and breakage of the base material during molding is effectively prevented.

一方、基材層間の接着は2度目に含浸した樹脂によって
確実に行なわれる。
On the other hand, adhesion between the base material layers is ensured by the second impregnated resin.

本発明に用いる基材は特に限定されないが、基材切れを
起こし昌いガラス不織布に適用すると有効である。ガラ
ス不織布とは、ポパール、エポキシ樹脂などの水系樹脂
をバインダーとしてガラス繊維を結着したもの、ガラス
繊維にセルロース繊維を混抄したものなどである。
Although the base material used in the present invention is not particularly limited, it is effective to apply the present invention to a glass nonwoven fabric that causes breakage of the base material. Glass nonwoven fabrics include those made by binding glass fibers using a water-based resin such as popal or epoxy resin as a binder, and those made by mixing cellulose fibers with glass fibers.

また、本発明に用いる熱硬化性樹脂は、エポキシ樹脂、
フェノール樹脂、メラミン樹脂、ポリエステル樹脂など
積層板用に使用できるすべての熱硬化性樹脂であり、1
度目の含浸に用いる樹脂と2度目の含浸に用いる樹脂は
相違してもよい。また、1度目に含浸した樹脂を加熱加
圧しても流動しないかそれに近い状態まで硬化させたプ
リプレグは積層板を構成するプリプレグの一部乃至全部
に適宜用いればよい。
Furthermore, the thermosetting resin used in the present invention includes epoxy resin,
All thermosetting resins that can be used for laminates, such as phenolic resin, melamine resin, and polyester resin.
The resin used for the first impregnation and the resin used for the second impregnation may be different. Further, a prepreg that is cured to a state where the resin impregnated for the first time does not flow even when heated and pressurized, or is almost cured, may be used as appropriate for part or all of the prepreg constituting the laminate.

次に、本発明の詳細な説明する。Next, the present invention will be explained in detail.

実施例 エポキシ樹脂(EPON−1001、シェル化学製)1
00重量部、硬化剤ジシアンジアミド3重量部、促進剤
2−メチル−4−メチルイミダゾール02重量部よりな
るエポキシ樹脂ワニスをカラス不織布(EP−4475
,日本バイリーン製)に樹脂量60重■%、フロー値0
%になる様含浸、乾燥し、さらに同フェスを総樹脂量7
5重量%、フロー値20%1こなる様含浸、乾燥してプ
リプレグを得た。該プリプレグを8枚積層し、圧力6o
xp/c!、温度160℃で30分間加熱加圧して積層
板を得た。
Example epoxy resin (EPON-1001, manufactured by Shell Chemical) 1
A glass non-woven fabric (EP-4475
, manufactured by Nippon Vilene) with a resin content of 60% by weight and a flow value of 0.
Impregnated and dried to a total resin content of 7%.
5% by weight, flow value 20%, and dried to obtain a prepreg. 8 sheets of the prepreg were laminated and the pressure was 6o.
xp/c! A laminate was obtained by heating and pressing at a temperature of 160° C. for 30 minutes.

尚、フロー値とは、9(:m角のプリプレグ9枚(重量
w0)を積層し、圧力60に9/Cd、温度160℃で
加熱加圧したとき流出した樹脂重量をWIとすると、フ
ロー値(96) =立X100で定義される。
In addition, the flow value is the flow value, where WI is the weight of the resin that flows out when nine sheets of prepreg (weight w0) of 9 m square are laminated and heated and pressurized at a pressure of 9/Cd and a temperature of 160°C. Value (96) = defined as 100 x 100.

比較例 実施例と同様に、但し1度目の含浸、乾燥工程で樹脂f
f160重1%、フロー値596とし2度目の含浸、乾
燥工程で総樹脂量75重量%、フロー値20%としたプ
リプレグ8枚を用いて同様に積層板を得た。
Comparative Example Same as Example, except that resin f was used in the first impregnation and drying process.
A laminate was similarly obtained using eight sheets of prepreg having a f160 weight of 1% and a flow value of 596, and a second impregnation, and a drying process in which the total resin amount was 75% by weight and the flow value was 20%.

従来例1 実施例と同様のフェスおよび基材を用いて、1度の含浸
、乾燥工程で樹脂量75重量%、フロー値20%とした
プリプレグ8枚を用いて同様に積層板を得た。
Conventional Example 1 Using the same face and base material as in Example, a laminate was similarly obtained using eight sheets of prepreg with a resin content of 75% by weight and a flow value of 20% in one impregnation and drying process.

従来例2 従来例1と同様に、但し樹脂量75重量%、フロー値1
0%としたプリプレグ8枚を用いて積層板を得た。
Conventional Example 2 Same as Conventional Example 1, except that the resin amount is 75% by weight and the flow value is 1.
A laminate was obtained using eight sheets of prepreg with a concentration of 0%.

以上得られた各積層板の基材切れの有無、板厚精度、及
び性能を第1表に示す。
Table 1 shows the presence or absence of base material breakage, plate thickness accuracy, and performance of each of the laminates obtained above.

 5− 第  1  表 尚、基材切れの有無は目視にて判定した。板厚の測定箇
所は図面に示したX印の位置であり、その最装置と最大
値を第1表に示した。半田耐熱性及び絶縁抵抗はJIS
−に−6911に準拠して測定した。
5-Table 1 The presence or absence of substrate breakage was visually determined. The plate thickness was measured at the X mark shown in the drawing, and its maximum value and equipment are shown in Table 1. Solder heat resistance and insulation resistance are JIS
- It was measured in accordance with -6911.

第1表から明かなように、本発明によれば基材切れがな
く板厚のばらつきも小さく、しかも従来と同等の性能を
有する積層板をm tf得ることができ、その工業的価値は極めて大なるも
のである。
As is clear from Table 1, according to the present invention, it is possible to obtain a laminate with no breakage of the base material, small variations in plate thickness, and performance equivalent to that of the conventional one, and its industrial value is extremely high. It is a big thing.

 6−6-

【図面の簡単な説明】[Brief explanation of the drawing]

図面は積層板の板厚の測定箇所を示す説明図である。 特許出願人  7− 129− The drawing is an explanatory view showing the locations where the thickness of the laminate is measured. patent applicant 7- 129-

Claims (1)

【特許請求の範囲】 1 基材への樹脂含浸、乾燥工程を2度繰り返して得ら
れるプリプレグを一部乃至全部として用い積層成形する
積層板の製造において、基材への1度目の樹脂含浸、乾
燥工程ではプリプレグを加熱加圧しても樹脂か流動しな
いかそれに近い状態まで含浸樹脂の硬化反応を進めるこ
とを特徴とする積層板の製造法。 2 基材かガラス不織布である特許請求の範囲第1項記
載の積層板の製造法。 31度目の含浸樹脂と2度目の含浸樹脂か相違する特許
請求の範囲第1項記載の積層板の製造法。
[Scope of Claims] 1. In the production of a laminate plate that is laminated and molded using partially or entirely a prepreg obtained by repeating the steps of resin impregnation into the base material and drying twice, the first resin impregnation into the base material, A method for producing a laminate, which is characterized in that in the drying process, the curing reaction of the impregnated resin is advanced to a state where the resin does not flow or is close to flowing even when the prepreg is heated and pressurized. 2. The method for producing a laminate according to claim 1, wherein the base material is a glass nonwoven fabric. 3. The method for manufacturing a laminate according to claim 1, wherein the impregnating resin used for the 31st time is different from the resin used for the second impregnation.
JP57168096A 1982-09-27 1982-09-27 Manufacture of laminated board Granted JPS5955720A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57168096A JPS5955720A (en) 1982-09-27 1982-09-27 Manufacture of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57168096A JPS5955720A (en) 1982-09-27 1982-09-27 Manufacture of laminated board

Publications (2)

Publication Number Publication Date
JPS5955720A true JPS5955720A (en) 1984-03-30
JPS636323B2 JPS636323B2 (en) 1988-02-09

Family

ID=15861762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57168096A Granted JPS5955720A (en) 1982-09-27 1982-09-27 Manufacture of laminated board

Country Status (1)

Country Link
JP (1) JPS5955720A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54122367A (en) * 1978-03-15 1979-09-21 Toshiba Corp Manufacture of prepreg

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54122367A (en) * 1978-03-15 1979-09-21 Toshiba Corp Manufacture of prepreg

Also Published As

Publication number Publication date
JPS636323B2 (en) 1988-02-09

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