JPS636323B2 - - Google Patents
Info
- Publication number
- JPS636323B2 JPS636323B2 JP57168096A JP16809682A JPS636323B2 JP S636323 B2 JPS636323 B2 JP S636323B2 JP 57168096 A JP57168096 A JP 57168096A JP 16809682 A JP16809682 A JP 16809682A JP S636323 B2 JPS636323 B2 JP S636323B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- laminate
- prepreg
- impregnation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 19
- 238000005470 impregnation Methods 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 6
- 239000004745 nonwoven fabric Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2-methyl-4-methylimidazole Natural products CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Moulding By Coating Moulds (AREA)
- Reinforced Plastic Materials (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
本発明は、成形時における基材切れを防止した
積層板の製造法に関する。
積層板は、周知の如く熱硬化性樹脂を基材に含
浸、乾燥して得られるプリプレグを積層し、加熱
加圧して得られる。ガラス不織布を基材として用
いた場合、プリプレグの樹脂の硬化度が小さけれ
ば成形時の樹脂の溶融粘度は低く基材切れは少な
いが得られる積層板の板厚精度が悪くなる。一
方、プリプレグの樹脂の硬化度を進めてある場合
は、成形時の樹脂の溶融粘度が上昇し基材切れを
起こし易くなる。
本発明は、ガラス不織布基材を用いる場合に、
成形時における基材切れを防止した積層板の製造
法を提供することを目的とするものである。
即ち、基材への樹脂含浸、乾燥工程を２度繰り
返して得られるプリプレグを一部乃至全部として
用いる積層板の製造において、基材への１度目の
樹脂含浸、乾燥工程ではプリプレグを加熱加圧し
ても樹脂が流動しないかそれに近い状態まで含浸
樹脂の硬化反応を進めることを特徴とするもので
ある。１度目に含浸した樹脂を加熱加圧しても流
動しないかほとんど流動しない程度まで硬化させ
ておくことによつて、基材の繊維間は確実に結合
され繊維間を結合している樹脂は成形時に流動し
ないかほとんど流動しない状態にあるので、基材
の強度を高めて成形時における基材切れを良好に
防止することになる。一方、基材層間の接着は２
度目に含浸した樹脂によつて確実に行なわれる。
本発明に用いるガラス不織布とは、ポバール、
エポキシ樹脂などの水系樹脂をバインダーとして
ガラス繊維を結着したもの、ガラス繊維にセルロ
ース繊維を混抄したものなどである。
また、本発明に用いる熱硬化性樹脂は、エポキ
シ樹脂、フエノール樹脂、メラミン樹脂、ポリエ
ステル樹脂など積層板用に使用できるすべての熱
硬化性樹脂であり、１度目の含浸に用いる樹脂と
２度目の含浸に用いる樹脂は相違してもよい。ま
た、１度目に含浸した樹脂を加熱加圧しても流動
しないかそれに近い状態まで硬化させたプリプレ
グは積層板を構成するプリプレグの一部乃至全部
に適宜用いればよい。
次に、本発明の実施例を説明する。
実施例
エポキシ樹脂（EPON−1001、シエル化学製）
100重量部、硬化剤ジシアンジアミド３重量部、
促進剤２−メチル−４−メチルイミダゾール0.2
重量部よりなるエポキシ樹脂ワニスをガラス不織
布（EP−4475、日本バイリーン製）に樹脂量60
重量％、フロー値０％になる様含浸、乾燥し、さ
らに同ワニスを総樹脂量75重量％、フロー値20％
になる様含浸、乾燥してプリプレグを得た。該プ
リプレグを８枚積層し、圧力60Kg／cm2、温度160
℃で30分間加熱加圧して積層板を得た。
尚、フロー値とは、９cm角のプリプレグ９枚
（重量W0）を積層し、圧力60Kg／cm2、温度160℃
で加熱加圧したとき流出した樹脂重量をW1とす
ると、フロー値（％）＝W1／W0×100で定義される。
比較例
実施例と同様に、但し１度目の含浸、乾燥工程
で樹脂量60重量％、フロー値５％とし２度目の含
浸、乾燥工程で総樹脂量75重量％、フロー値20％
としたプリプレグ８枚を用いて同様に積層板を得
た。
従来例 １
実施例と同様のワニスおよび基材を用いて、１
度の含浸、乾燥工程で樹脂量75重量％、フロー値
20％としたプリプレグ８枚を用いて同様に積層板
を得た。
従来例 ２
従来例１と同様に、但し樹脂量75重量％、フロ
ー値10％としたプリプレグ８枚を用いて積層板を
得た。
以上得られた各積層板の基材切れの有無、板厚
精度、及び性能を第１表に示す。
The present invention relates to a method for manufacturing a laminate that prevents substrate breakage during molding. As is well known, the laminate is obtained by laminating prepregs obtained by impregnating a base material with a thermosetting resin and drying the prepregs, followed by heating and pressing. When a glass nonwoven fabric is used as a base material, if the degree of curing of the prepreg resin is low, the melt viscosity of the resin during molding will be low and there will be little base material breakage, but the thickness accuracy of the resulting laminate will be poor. On the other hand, if the degree of curing of the prepreg resin is advanced, the melt viscosity of the resin increases during molding, making it easier for the base material to break. In the present invention, when using a glass nonwoven fabric base material,
The object of the present invention is to provide a method for manufacturing a laminate that prevents the base material from breaking during molding. That is, in the manufacture of a laminate using prepreg obtained by repeating the resin impregnation and drying process twice into the base material as part or all of the base material, the prepreg is heated and pressurized in the first resin impregnation and drying process. It is characterized by proceeding with the curing reaction of the impregnated resin to a state where the resin does not flow, or is close to it, even if the resin does not flow. By curing the first impregnated resin to the extent that it does not flow or hardly flows even when heated and pressurized, the fibers of the base material are reliably bonded, and the resin bonding between the fibers is bonded during molding. Since it is in a state where it does not flow or hardly flows, the strength of the base material is increased and breakage of the base material during molding is effectively prevented. On the other hand, the adhesion between the base material layers is 2
This is ensured by the repeated impregnation of the resin. The glass nonwoven fabric used in the present invention includes Poval,
These include those in which glass fibers are bound using a water-based resin such as epoxy resin as a binder, and those in which cellulose fibers are mixed with glass fibers. In addition, the thermosetting resin used in the present invention is any thermosetting resin that can be used for laminated boards, such as epoxy resin, phenolic resin, melamine resin, and polyester resin, and the resin used for the first impregnation and the second impregnation The resin used for impregnation may be different. Further, a prepreg that is cured to a state where the resin impregnated for the first time does not flow even when heated and pressurized, or is almost cured, may be used as appropriate for part or all of the prepreg constituting the laminate. Next, examples of the present invention will be described. Example Epoxy resin (EPON-1001, manufactured by Ciel Chemical)
100 parts by weight, 3 parts by weight of curing agent dicyandiamide,
Accelerator 2-methyl-4-methylimidazole 0.2
Add 60 parts by weight of epoxy resin varnish to glass nonwoven fabric (EP-4475, manufactured by Nippon Vilene).
The varnish was impregnated and dried so that the total resin amount was 75% and the flow value was 0%, and the flow value was 20%.
A prepreg was obtained by impregnation and drying. 8 sheets of prepreg were laminated at a pressure of 60Kg/cm 2 and a temperature of 160℃.
A laminate was obtained by heating and pressing at ℃ for 30 minutes. In addition, the flow value is a stack of nine 9cm square prepreg sheets (weight W 0 ), pressure 60Kg/cm 2 , temperature 160℃.
Let W 1 be the weight of the resin that flows out when heated and pressurized, then the flow value (%) is defined as W 1 /W 0 ×100. Comparative Example Same as Example, except that in the first impregnation and drying process, the resin amount was 60% by weight and the flow value was 5%, and in the second impregnation and drying process, the total resin amount was 75% by weight and the flow value was 20%.
A laminate was similarly obtained using eight prepreg sheets. Conventional Example 1 Using the same varnish and base material as in Example, 1
Degree of impregnation, drying process resin content 75% by weight, flow value
A laminate was similarly obtained using eight sheets of prepreg with a concentration of 20%. Conventional Example 2 A laminate was obtained in the same manner as in Conventional Example 1, except that eight sheets of prepreg were used with a resin content of 75% by weight and a flow value of 10%. Table 1 shows the presence or absence of base material breakage, plate thickness accuracy, and performance of each of the laminates obtained above.
【表】
尚、基材切れの有無は目視にて判定した。板厚
の測定箇所は図面に示した×印の位置であり、そ
の最小置と最大値を第１表に示した。半田耐熱性
及び絶縁抵抗はJIS−Ｋ−6911に準拠して測定し
た。
第１表から明かなように、本発明によれば本来
引張り強度の弱いガラス不織布基材の繊維間結合
を補強して、基材切れがなく板厚のばらつきも小
さく、しかも従来と同等の性能を有する積層板を
得ることができ、その工業的価置は極めて大なる
ものである。[Table] The presence or absence of base material breakage was visually determined. The plate thickness was measured at the position of the x mark shown in the drawing, and the minimum and maximum values are shown in Table 1. Solder heat resistance and insulation resistance were measured in accordance with JIS-K-6911. As is clear from Table 1, according to the present invention, the interfiber bonds of the glass nonwoven fabric base material, which originally has low tensile strength, are reinforced, so there is no base material breakage, and the variation in board thickness is small, and the performance is equivalent to that of the conventional one. It is possible to obtain a laminate having the following characteristics, and its industrial value is extremely high.
図面は積層板の板厚の測定箇所を示す説明図で
ある。
The drawing is an explanatory view showing the locations where the thickness of the laminate is measured.
Claims (1)
２度繰り返して得られるプリプレグを一部乃至全
部として用い積層成形する積層板の製造におい
て、基材への１度目の樹脂含浸、乾燥工程ではプ
リプレグを加熱加圧しても樹脂が流動しないかそ
れに近い状態まで含浸樹脂の硬化反応を進めるこ
とを特徴とする積層板の製造法。1 In the production of a laminate plate that is laminated and molded using partially or entirely prepreg obtained by repeating the resin impregnation and drying process twice into the glass nonwoven fabric base material, the prepreg is used in the first resin impregnation and drying process into the base material. A method for producing a laminate, characterized in that the curing reaction of the impregnated resin is proceeded to a state where the resin does not flow or is close to flowing even when heated and pressurized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57168096A JPS5955720A (en) | 1982-09-27 | 1982-09-27 | Manufacture of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57168096A JPS5955720A (en) | 1982-09-27 | 1982-09-27 | Manufacture of laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5955720A JPS5955720A (en) | 1984-03-30 |
| JPS636323B2 true JPS636323B2 (en) | 1988-02-09 |
Family
ID=15861762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57168096A Granted JPS5955720A (en) | 1982-09-27 | 1982-09-27 | Manufacture of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5955720A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54122367A (en) * | 1978-03-15 | 1979-09-21 | Toshiba Corp | Manufacture of prepreg |
-
1982
- 1982-09-27 JP JP57168096A patent/JPS5955720A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54122367A (en) * | 1978-03-15 | 1979-09-21 | Toshiba Corp | Manufacture of prepreg |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5955720A (en) | 1984-03-30 |
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