JPS5928048B2 - automatic wire bonding equipment - Google Patents
automatic wire bonding equipmentInfo
- Publication number
- JPS5928048B2 JPS5928048B2 JP51130885A JP13088576A JPS5928048B2 JP S5928048 B2 JPS5928048 B2 JP S5928048B2 JP 51130885 A JP51130885 A JP 51130885A JP 13088576 A JP13088576 A JP 13088576A JP S5928048 B2 JPS5928048 B2 JP S5928048B2
- Authority
- JP
- Japan
- Prior art keywords
- amount
- lead frame
- semiconductor pellet
- bonding
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7865—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
本発明は半導体や半導体集積回路の組立工程の一つであ
るワイヤボンディングに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to wire bonding, which is one of the assembly processes for semiconductors and semiconductor integrated circuits.
半導体や半導体集積回路の製造においては、半導体ペレ
ットの電極と外部リードとの間のコネクタ線による接続
は重要な工程の一つであり、このコネクタ線接続にはワ
イヤボンディング装置が使用されている。In the manufacture of semiconductors and semiconductor integrated circuits, connection between the electrodes of semiconductor pellets and external leads using connector wires is one of the important steps, and a wire bonding device is used for this connector wire connection.
自動ワイヤボンディング装置の従来例の一つは、半導体
ペレットがダイボンディングされたリードフレームを所
定位置に移送、固定し、加熱するための移送機構と、所
定位置に固定、加熱されたリードフレーム上の、ダイボ
ンディングされた半導体ペレットの基準の位置からのズ
レ量を検出する検出装置と、コネクタ線をひき出して熱
圧着作用によリボンディングを行なうための、キャピラ
リを主体とするボンディングヘッド部と、このボンディ
ングヘッド部を、検出された半導体ペレットの位置ズレ
量に基づき、半導体ペレットの電極と外部リードの所定
位置に移動させる移動部とを備えており、半導体ペレッ
トをダイボンディングしたリードフレームを１個の半導
体ペレット毎に所定位置に移送、固定し、加熱し、検出
装置で半導体ペレットの位置ズレ量を検出後、そのズレ
量に基づき半導体ペレットの電極と外部リードの所定位
置にボンディングヘッドを移動させ、ワイヤボンディン
グを行なう。One of the conventional examples of automatic wire bonding equipment includes a transfer mechanism for transferring, fixing, and heating a lead frame to which a semiconductor pellet is die-bonded to a predetermined position, and a transfer mechanism for transferring, fixing, and heating a lead frame to which a semiconductor pellet is die-bonded, and a transfer mechanism for transferring, fixing, and heating a lead frame to which semiconductor pellets are die-bonded. , a detection device for detecting the amount of deviation of a die-bonded semiconductor pellet from a reference position; a bonding head section mainly composed of a capillary for pulling out a connector wire and performing rebonding by thermocompression bonding; It is equipped with a moving part that moves this bonding head part to a predetermined position of the electrode of the semiconductor pellet and the external lead based on the detected positional shift amount of the semiconductor pellet, and one lead frame to which the semiconductor pellet is die-bonded is provided. After each semiconductor pellet is transferred to a predetermined position, fixed, and heated, and the amount of positional deviation of the semiconductor pellet is detected by a detection device, the bonding head is moved to the predetermined position of the electrode of the semiconductor pellet and the external lead based on the amount of deviation. , perform wire bonding.
上記の動作をすべて自動的に行なう従来例の自動ワイヤ
ボンディング装置においては、位置ズレの検出とワイヤ
ボンディングとが終了するまでリードフレームを固定し
ているのでボンディングの位置精度は良いが、一個の半
導体ペレット毎に位置ズレ量の検出とワイヤボンディン
グを続けて行なう為行業性が良くない。In conventional automatic wire bonding equipment that automatically performs all of the above operations, the lead frame is fixed until the position shift detection and wire bonding are completed, so the bonding position accuracy is good; The workability is not good because detection of the amount of positional deviation and wire bonding are performed continuously for each pellet.
自動ワイヤボンディング装置の第２の従来例としては、
半導体ペレットがダイボンディングされたリードフレー
ムを所定位置（検出ステージ及びボンディングステージ
）に移送、固定し、加熱するための移送機構と、所定位
置（検出ステージ）に移送、固定されたリードフレーム
上の、ダイボンディングされた半導体ペレットの基準の
位置からのズレ量を検出する検出装置と、検出した半導
体ペレットの位置ズレ量を記憶する記憶装置と、コネク
タ線をひき出して熱圧着作用によリボンディングを行な
うためのキャピラリを主体とするボンデイングヘツド部
と、このボンデイングベツド部を記憶装置に記憶した各
半導体ペレツトのズレ量に基づき所定位置（ボンデイン
グステージ）に移送、固定、加熱されたリードフレーム
上のダイボンデイングされた半導体ペレツトの電極と外
部リードの所定位置に移動させる移動部とを備えており
、半導体ペレツトをダイボンデイングしたリードフレー
ムを一個の半導体ペレツト毎に所定位置（検出ステージ
）に移送、固定し、検出装置で半導体ペレツトのズレ量
を検出し、検出したズレ量を記憶装置に記憶し、リード
フレームを一個の半導体ペレツト毎に前記所定位置（検
出ステージ）と別の所定位置（ボンデイングステージ）
に移送、固定し、加熱し、記憶装置に記憶したワイヤボ
ンデイングしようとしている半導体ペレツトのズレ量に
基づき半導体ペレツトの電極と外部リードの所定位置に
ボンデイングヘツドを移動させワイヤボンデイングを行
なう。As a second conventional example of automatic wire bonding equipment,
A transfer mechanism for transferring, fixing and heating the lead frame to which the semiconductor pellet is die-bonded to a predetermined position (detection stage and bonding stage); A detection device that detects the amount of deviation from the reference position of the die-bonded semiconductor pellet, a storage device that stores the detected amount of positional deviation of the semiconductor pellet, and a connector wire that is pulled out and bonded by thermocompression bonding. A die on a lead frame is transferred to a predetermined position (bonding stage), fixed, and heated based on the amount of misalignment between each semiconductor pellet, which is stored in a storage device. It is equipped with a moving part that moves the bonded semiconductor pellet electrodes and external leads to predetermined positions, and transfers and fixes the lead frame to which semiconductor pellets are die-bonded to a predetermined position (detection stage) one semiconductor pellet at a time. , the amount of deviation of the semiconductor pellet is detected by a detection device, the detected amount of deviation is stored in a storage device, and the lead frame is moved from the predetermined position (detection stage) to another predetermined position (bonding stage) for each semiconductor pellet.
The wire bonding is performed by moving the bonding head to a predetermined position between the electrode of the semiconductor pellet and the external lead based on the amount of deviation of the semiconductor pellet to be wire bonded stored in the memory device.
これらの動作はすべて自動的に行なわれる。上記の第２
の従来例の自動ワイヤボンデイング装置においては、半
導体ペレツトのズレ量を検出する検出ステージとワイヤ
ボンデイングをおこなうボンデイングステージが別であ
るため、リードフレームを所定位置（検出ステージ及び
ボンデイングステージ）に移送、固定した時のリードフ
レームの位置の誤差が、ボンデイングの位置の誤差とな
るため、ボンデイングの位置、精度は良くないＯしかし
、同時に、１個の半導体ペレツトのズレ量の検出と別の
一個の半導体ペレツトのボンデイングをおこなえるので
作業性は良い。All these operations are performed automatically. 2nd above
In conventional automatic wire bonding equipment, the detection stage that detects the amount of deviation of the semiconductor pellet and the bonding stage that performs wire bonding are separate, so the lead frame is transferred and fixed to a predetermined position (detection stage and bonding stage). The error in the position of the lead frame when the lead frame is placed will result in the error in the bonding position, so the accuracy of the bonding position is not good. Workability is good because bonding can be performed.
したがつて本発明の目的は、ボンデイングの位置精度が
良くかつ作業性の良い自動ワイヤボンデイング装置を提
供することにある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an automatic wire bonding apparatus with good bonding position accuracy and good workability.
本発明によれば、複数個の半導体ペレツトがダイボンデ
イングされたリードフレームを所定位置に移送、固定し
、加熱し、各半導体ペレツトの基準の位置からのズレ量
を検出装置で順次検出し、検出し終つた半導体ペレツト
から順次、検出した各半導体ペレツトの位置ズレ量を記
憶装置に記憶し、記憶装置に記憶した各半導体ペレツト
のズレ量に基づき、複数個のボンデイングヘツドにより
並列に複数個の半導体ペレツトそれぞれの電極と外部リ
ードの所定位置にワイヤボンデイングを行なうことを特
徴とする自動ワイヤボンデイング装置が得られる。According to the present invention, a lead frame on which a plurality of semiconductor pellets are die-bonded is transferred to a predetermined position, fixed, and heated, and a detection device sequentially detects the amount of deviation of each semiconductor pellet from a reference position. Starting from the semiconductor pellets that have been bonded, the detected amount of positional deviation of each semiconductor pellet is stored in a storage device, and based on the amount of deviation of each semiconductor pellet stored in the storage device, multiple bonding heads are used to bond multiple semiconductors in parallel. An automatic wire bonding apparatus is obtained which is characterized in that wire bonding is performed at predetermined positions of the electrodes and external leads of each pellet.
以下に本発明を図面を参照して詳述する。The present invention will be explained in detail below with reference to the drawings.
第１図は本発明の一実施例を示す概略図であり、第２図
は複数のワイヤボンデイング動作の関係を示すタイミン
グチヤートである。FIG. 1 is a schematic diagram showing an embodiment of the present invention, and FIG. 2 is a timing chart showing the relationship between a plurality of wire bonding operations.
リードフレーム供給用トレー１に収納されている、複数
個の半導体ペレツトがダイボンデイングされているリー
ドフレーム２をヒータプロツク３上の所定位置に移送、
固定し、加熱し、検出装置４を移送方向（図面のＸ軸方
向）に移動させ、リードフレーム２にダイボンデイング
されている各半導体ペレツト５〜１９の基準位置からの
ズレ量を順次検出し、検出し終つた半導体ペレツトから
順次検出した各半導体ペレツト５〜１９の位置ズレ量を
記憶装置（図示されていない）に記憶する。まず、半導
体ペレツト５のズレ量を検出、記憶した時点ｔ１で記憶
装置に記憶した半導体ペレツト５のズレ量に基づき、コ
ネクタ線をひき出して熱圧着作用によリボンデイングを
行なうためのキヤビラリ２０を主体とするボンデイング
ヘツド２１をＸＹ方向に移動して半導体ペレツト５の電
極と外部リードの所定位置にワイヤボンデイングを行な
う。ボンデイングヘツド２１が半導体ペレツト５のワイ
ヤボンデイングを終えた時点Ｔｌｌでは、半導体ペレツ
ト６〜１１のズレ量はすでに検出、記憶されているので
記憶装置に記憶した半導体ペレツト６のズレ量に基づき
ボンデイングヘツド２１をＸＹ方向に移動して半導体ペ
レツト６の電極と外部リードの所定位置にワイヤボンデ
イングを行ない、以下同様に順次ボンデイングヘツド２
１で半導体ペレツト７〜９のワイヤボンデイングを行な
う。一方、半導体ペレツト１０のズレ量を検出、記憶し
た時点Ｔ２で記憶装置に記憶した半導体ペレツト１０の
ズレ量に基づきボンデイングヘツド２２をＸＹ方向に移
動して半導体ペレツト１０の電極と外部リードの所定位
置にワイヤボンデイングを行ない、ボンデイングヘツド
２２が半導体ペレツト１０のワイヤボンデイングを終え
た時点Ｔ２２では、既に半導体ペレツト１１のズレ量を
検出、記憶しているので、記憶装置に記憶した半導体ペ
レツト１１のズレ量に基づきボンデイングヘツド２２を
ＸＹ方向に移動して半導体ペレツト１１の電極と外部リ
ードの所定位置にワイヤボンデイングを行ない、以下同
様に順次ボンデイングヘツド２２で半導体ペレツト１２
〜１４のワイヤボンデイングを行なう。又、半導体ペレ
ツト１５のズレ量を検出記憶した時点Ｔ３で記憶装置に
記憶した半導体ペレツト１５のズレ量に基づきボンデイ
ングヘツド２３をＸＹ方向に移動して半導体ペレツト１
５の電極と外部リードの所定位置にワイヤボンデイング
を行なう。ボンデイングヘツド２３が半導体ペレツト１
５のワイヤボンデイングを終えた時点Ｔ３，では、すべ
ての半導体ペレツト５〜１９のズレ量を検出、記憶して
いるので記憶装置に記憶した半導体ペレツト１６のズレ
量に基づきボンデイングヘツド２３をＸＹ方向に移動し
て半導体ペレツト１６の電極と外部リードの所定位置に
ワイヤボンデイングを行ない、以下同様に順次小ンデイ
ングヘツド２３で半導体ペレツト１７〜１９のワイヤボ
ンデイングを行なう。半導体ペレツト５〜１９のワイヤ
ボンデイングが終つたら、リードフレーム２をリードフ
レーム収納用トレー２４に移送収容し、同時にリードフ
レーム供給用トレー１に収納されているリードフレーム
２をヒータプロツク３上の所定位置に移送、固定し、加
熱し、順次前記の動作をくり返す。Transferring a lead frame 2, on which a plurality of semiconductor pellets are die-bonded, stored in a lead frame supply tray 1, to a predetermined position on a heater block 3;
fixed, heated, and moved the detection device 4 in the transfer direction (X-axis direction in the drawing) to sequentially detect the amount of deviation of each semiconductor pellet 5 to 19 die-bonded to the lead frame 2 from the reference position, The amount of positional deviation of each of the semiconductor pellets 5 to 19 sequentially detected from the semiconductor pellets that have been detected is stored in a storage device (not shown). First, based on the amount of deviation of the semiconductor pellet 5 which was detected and stored in the storage device at the time t1, the connector wire is pulled out and the cavity 20 for performing rebonding by thermocompression bonding is installed. The bonding head 21, which is the main body, is moved in the X and Y directions to wire bond the electrodes of the semiconductor pellet 5 and the external leads at predetermined positions. At the time Tll when the bonding head 21 finishes wire bonding the semiconductor pellet 5, the amount of deviation of the semiconductor pellets 6 to 11 has already been detected and stored, so the bonding head 21 detects the amount of deviation of the semiconductor pellet 6 stored in the storage device. are moved in the X and Y directions to perform wire bonding to the predetermined positions of the electrodes and external leads of the semiconductor pellet 6.
1, wire bonding of semiconductor pellets 7 to 9 is performed. On the other hand, the bonding head 22 is moved in the X and Y directions based on the amount of deviation of the semiconductor pellet 10 stored in the storage device at the time T2 when the amount of deviation of the semiconductor pellet 10 is detected and stored, and the electrode of the semiconductor pellet 10 and the external lead are placed in the predetermined positions. At time T22 when the bonding head 22 finishes wire bonding the semiconductor pellet 10, the amount of deviation of the semiconductor pellet 11 has already been detected and stored, so the amount of deviation of the semiconductor pellet 11 stored in the storage device is Based on this, the bonding head 22 is moved in the X and Y directions to wire bond the electrodes and external leads of the semiconductor pellet 11 to predetermined positions.
-14 wire bonding is performed. Further, the bonding head 23 is moved in the X and Y directions based on the amount of deviation of the semiconductor pellet 15 stored in the storage device at time T3 when the amount of deviation of the semiconductor pellet 15 is detected and stored.
Wire bonding is performed at predetermined positions of the electrode No. 5 and the external lead. The bonding head 23 is the semiconductor pellet 1
At time T3 when the wire bonding of No. 5 is completed, the amount of deviation of all the semiconductor pellets 5 to 19 has been detected and stored, so the bonding head 23 is moved in the X and Y directions based on the amount of deviation of the semiconductor pellet 16 stored in the storage device. The semiconductor pellet 16 is moved and wire bonded to predetermined positions of the electrodes and external leads of the semiconductor pellet 16, and the semiconductor pellets 17 to 19 are similarly wire bonded one after another using the small bonding head 23. When the wire bonding of the semiconductor pellets 5 to 19 is completed, the lead frame 2 is transferred and stored in the lead frame storage tray 24, and at the same time, the lead frame 2 stored in the lead frame supply tray 1 is moved to a predetermined position on the heater block 3. Transfer, fix, heat, and repeat the above operations in sequence.
これらの動作はすべて自動的に行なわれる。以上述べた
ように、本発明の自動ワイヤボンデイング装置によれば
、各半導体ペレツトのズレ量の検出後、ワイヤボンデイ
ングが終了するまでリードフレームを移動させないので
、ボンデイングの位置精度が良く、かつ、複数個のボン
デイングヘツドにより複数個の半導体ペレツトのワイヤ
ボンデイングを並列に行なうため作業性が良い。All these operations are performed automatically. As described above, according to the automatic wire bonding apparatus of the present invention, the lead frame is not moved until the wire bonding is completed after detecting the amount of deviation of each semiconductor pellet. Workability is good because wire bonding of a plurality of semiconductor pellets is performed in parallel using a single bonding head.
第１図は本発明の自動ワイヤボンデイング装置の一実施
例を示す概略図であり、第２図は複数個のボンデイング
ヘツドの並列動作関係を示すタイミングチヤートである
。
１・・・・・・リードフレーム供給用トレー ２・・・
・・・リードフレーム、３・・・・・・ヒータプロツク
、４・・・・・・位置ズレ検出装置、５〜１９・・・・
・・半導体ペレツト、２０・・・・・・キヤピラリ、２
１〜２３・・・・・・ボンデイングヘツド、２４・・・
・・・リードフレーム収納用トレー。FIG. 1 is a schematic diagram showing an embodiment of the automatic wire bonding apparatus of the present invention, and FIG. 2 is a timing chart showing the parallel operation relationship of a plurality of bonding heads. 1...Lead frame supply tray 2...
...Lead frame, 3...Heater block, 4...Position shift detection device, 5-19...
...Semiconductor pellet, 20...Capillary, 2
1-23... Bonding head, 24...
...Lead frame storage tray.
Claims (1)
ムと、予め定められた移動範囲をそれぞれ有する複数の
ワイヤボンディング手段と、前記リードフレームを移送
、固定する手段と、前記リードフレームの長手方向に移
動可能であり前記各ペレット設置位置と前記リードフレ
ームの予め定められた基準位置との位置ズレ量を検出す
る手段と、前記位置ズレ量を記憶する手段とを含み、前
記記憶された位置ズレ量に基づき、前記半導体ペレット
の位置ズレ量を検出した位置で前記複数個のボンディン
グ手段を並列動作させることを特徴とする自動ワイヤボ
ンディング装置。1. A lead frame on which a plurality of semiconductor pellets are installed, a plurality of wire bonding means each having a predetermined movement range, a means for transporting and fixing the lead frame, and a means capable of moving in the longitudinal direction of the lead frame. and means for detecting the amount of positional deviation between each pellet installation position and a predetermined reference position of the lead frame, and means for storing the positional deviation amount, and based on the stored positional deviation amount. . An automatic wire bonding apparatus, characterized in that the plurality of bonding means are operated in parallel at a position where the amount of positional deviation of the semiconductor pellet is detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51130885A JPS5928048B2 (en) | 1976-10-29 | 1976-10-29 | automatic wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51130885A JPS5928048B2 (en) | 1976-10-29 | 1976-10-29 | automatic wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5355964A JPS5355964A (en) | 1978-05-20 |
| JPS5928048B2 true JPS5928048B2 (en) | 1984-07-10 |
Family
ID=15044963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51130885A Expired JPS5928048B2 (en) | 1976-10-29 | 1976-10-29 | automatic wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5928048B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0614042U (en) * | 1992-07-27 | 1994-02-22 | 行男 佐藤 | Large paper container |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0789559B2 (en) * | 1986-09-02 | 1995-09-27 | 松下電子工業株式会社 | Wire-bonding device |
-
1976
- 1976-10-29 JP JP51130885A patent/JPS5928048B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0614042U (en) * | 1992-07-27 | 1994-02-22 | 行男 佐藤 | Large paper container |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5355964A (en) | 1978-05-20 |
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