JPS5923429Y2 - マルチ・チツプ実装用基板 - Google Patents
マルチ・チツプ実装用基板Info
- Publication number
- JPS5923429Y2 JPS5923429Y2 JP1979003217U JP321779U JPS5923429Y2 JP S5923429 Y2 JPS5923429 Y2 JP S5923429Y2 JP 1979003217 U JP1979003217 U JP 1979003217U JP 321779 U JP321779 U JP 321779U JP S5923429 Y2 JPS5923429 Y2 JP S5923429Y2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- chip
- board
- insulating plate
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/90—
-
- H10W72/50—
-
- H10W72/5363—
-
- H10W72/5445—
-
- H10W72/59—
-
- H10W72/884—
-
- H10W72/932—
-
- H10W90/734—
-
- H10W90/754—
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979003217U JPS5923429Y2 (ja) | 1979-01-13 | 1979-01-13 | マルチ・チツプ実装用基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979003217U JPS5923429Y2 (ja) | 1979-01-13 | 1979-01-13 | マルチ・チツプ実装用基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55103958U JPS55103958U (enExample) | 1980-07-19 |
| JPS5923429Y2 true JPS5923429Y2 (ja) | 1984-07-12 |
Family
ID=28807009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979003217U Expired JPS5923429Y2 (ja) | 1979-01-13 | 1979-01-13 | マルチ・チツプ実装用基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5923429Y2 (enExample) |
-
1979
- 1979-01-13 JP JP1979003217U patent/JPS5923429Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55103958U (enExample) | 1980-07-19 |
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