JPS5923403A - 合成シリカおよびこれを含有してなる電子部品封止用樹脂組成物 - Google Patents
合成シリカおよびこれを含有してなる電子部品封止用樹脂組成物Info
- Publication number
- JPS5923403A JPS5923403A JP57133249A JP13324982A JPS5923403A JP S5923403 A JPS5923403 A JP S5923403A JP 57133249 A JP57133249 A JP 57133249A JP 13324982 A JP13324982 A JP 13324982A JP S5923403 A JPS5923403 A JP S5923403A
- Authority
- JP
- Japan
- Prior art keywords
- silica
- synthetic silica
- parts
- resin composition
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Inorganic Insulating Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57133249A JPS5923403A (ja) | 1982-07-30 | 1982-07-30 | 合成シリカおよびこれを含有してなる電子部品封止用樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57133249A JPS5923403A (ja) | 1982-07-30 | 1982-07-30 | 合成シリカおよびこれを含有してなる電子部品封止用樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5923403A true JPS5923403A (ja) | 1984-02-06 |
JPS6310846B2 JPS6310846B2 (enrdf_load_stackoverflow) | 1988-03-09 |
Family
ID=15100189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57133249A Granted JPS5923403A (ja) | 1982-07-30 | 1982-07-30 | 合成シリカおよびこれを含有してなる電子部品封止用樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5923403A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61190556A (ja) * | 1985-02-12 | 1986-08-25 | Rishiyou Kogyo Kk | 電子部品封止用樹脂組成物 |
JPS6230632A (ja) * | 1985-08-01 | 1987-02-09 | Shinetsu Sekiei Kk | 高純度石英ガラスの製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10250032B2 (en) | 2015-04-24 | 2019-04-02 | Vertiv Corporation | Intelligent power strip with management of bistable relays to reduce current in-rush |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5030652A (enrdf_load_stackoverflow) * | 1973-07-23 | 1975-03-26 | ||
JPS5420995A (en) * | 1977-07-18 | 1979-02-16 | Stamicarbon | Method of making pure porous silica |
JPS5698845A (en) * | 1980-01-09 | 1981-08-08 | Hitachi Ltd | Semiconductor memory device |
JPS56116647A (en) * | 1980-02-20 | 1981-09-12 | Hitachi Ltd | Manufacturing of silica-alumina type filler for semiconductor memory element covering resin |
-
1982
- 1982-07-30 JP JP57133249A patent/JPS5923403A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5030652A (enrdf_load_stackoverflow) * | 1973-07-23 | 1975-03-26 | ||
JPS5420995A (en) * | 1977-07-18 | 1979-02-16 | Stamicarbon | Method of making pure porous silica |
JPS5698845A (en) * | 1980-01-09 | 1981-08-08 | Hitachi Ltd | Semiconductor memory device |
JPS56116647A (en) * | 1980-02-20 | 1981-09-12 | Hitachi Ltd | Manufacturing of silica-alumina type filler for semiconductor memory element covering resin |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61190556A (ja) * | 1985-02-12 | 1986-08-25 | Rishiyou Kogyo Kk | 電子部品封止用樹脂組成物 |
JPS6230632A (ja) * | 1985-08-01 | 1987-02-09 | Shinetsu Sekiei Kk | 高純度石英ガラスの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6310846B2 (enrdf_load_stackoverflow) | 1988-03-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3800277B2 (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
JPS6157347B2 (enrdf_load_stackoverflow) | ||
US4677026A (en) | Resin composition for sealing electronic parts, and hydration-resistant magnesia powder and process for preparation thereof | |
JPS644540B2 (enrdf_load_stackoverflow) | ||
JPS58127354A (ja) | 半導体素子封止用樹脂組成物 | |
JP2021161005A (ja) | 粒子材料、その製造方法、フィラー材料及び熱伝導物質 | |
JPS5923403A (ja) | 合成シリカおよびこれを含有してなる電子部品封止用樹脂組成物 | |
JP3458196B2 (ja) | 高熱伝導性樹脂組成物 | |
JPH11269302A (ja) | 樹脂製品の熱伝導性向上用充填剤及びその製造方法 | |
JP3986154B2 (ja) | 窒化珪素質充填材及び半導体封止用樹脂組成物 | |
JPS6296567A (ja) | 半導体封止用エポキシ樹脂組成物 | |
JPH0369939B2 (enrdf_load_stackoverflow) | ||
US4683253A (en) | Resin molding compound for sealing electronic parts | |
JP2684396B2 (ja) | 溶融球状シリカ及びこれを用いた封止用樹脂組成物 | |
JPH03211A (ja) | 半導体封止用エポキシ樹脂成形材料の製造方法 | |
JPH01234319A (ja) | 球状シリカの製造方法 | |
JP2649054B2 (ja) | 粒子状無機質複合体及びその製造方法 | |
CN108455617B (zh) | 一种球形方石英的制备方法 | |
JP2955672B2 (ja) | 半導体樹脂封止用シリカフィラーおよびその製造方法 | |
JP4040715B2 (ja) | 充填材及び半導体封止用樹脂組成物 | |
JPS6296313A (ja) | 高純度球状シリカフイラ−の製造方法 | |
JPH02158637A (ja) | シリカフィラーおよびこれを用いた封止用樹脂組成物 | |
JP2789088B2 (ja) | 粒子状無機質複合体の製造方法 | |
JPH0641347A (ja) | 電子部品封止材用充填材 | |
JPH01161065A (ja) | シリカおよびその製造方法 |