JPS59232762A - ワイヤ・ソ−のスラリ洗浄装置 - Google Patents

ワイヤ・ソ−のスラリ洗浄装置

Info

Publication number
JPS59232762A
JPS59232762A JP10569983A JP10569983A JPS59232762A JP S59232762 A JPS59232762 A JP S59232762A JP 10569983 A JP10569983 A JP 10569983A JP 10569983 A JP10569983 A JP 10569983A JP S59232762 A JPS59232762 A JP S59232762A
Authority
JP
Japan
Prior art keywords
slurry
wire
abrasive grains
liquid tank
upper liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10569983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416309B2 (OSRAM
Inventor
Fumihiko Henmi
逸見 文彦
Masao Nakagi
中木 雅夫
Toru Kikuchi
徹 菊池
Narimitsu Shiina
椎名 成光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Setsubi Engineering Co Ltd
Hitachi Ltd
Original Assignee
Hitachi Setsubi Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Setsubi Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Setsubi Engineering Co Ltd
Priority to JP10569983A priority Critical patent/JPS59232762A/ja
Publication of JPS59232762A publication Critical patent/JPS59232762A/ja
Publication of JPH0416309B2 publication Critical patent/JPH0416309B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • B24B27/0633Grinders for cutting-off using a cutting wire
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/025Use, recovery or regeneration of abrasive mediums

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP10569983A 1983-06-15 1983-06-15 ワイヤ・ソ−のスラリ洗浄装置 Granted JPS59232762A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10569983A JPS59232762A (ja) 1983-06-15 1983-06-15 ワイヤ・ソ−のスラリ洗浄装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10569983A JPS59232762A (ja) 1983-06-15 1983-06-15 ワイヤ・ソ−のスラリ洗浄装置

Publications (2)

Publication Number Publication Date
JPS59232762A true JPS59232762A (ja) 1984-12-27
JPH0416309B2 JPH0416309B2 (OSRAM) 1992-03-23

Family

ID=14414617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10569983A Granted JPS59232762A (ja) 1983-06-15 1983-06-15 ワイヤ・ソ−のスラリ洗浄装置

Country Status (1)

Country Link
JP (1) JPS59232762A (OSRAM)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0767035A1 (en) * 1995-10-04 1997-04-09 Nippei Toyama Corporation Slurry managing system and slurry managing method for wire saws
EP0786317A3 (en) * 1996-01-26 1998-06-17 Shin-Etsu Handotai Co., Ltd System for reusing oily slurry waste fluid
US6161533A (en) * 1996-10-01 2000-12-19 Nippei Toyoma Corp. Slurry managing system and slurry managing method
CN103586988A (zh) * 2013-11-25 2014-02-19 王金生 一种线锯切割机
CN104057543A (zh) * 2014-06-19 2014-09-24 王金生 一种磁场辅助的多线锯切割机
CN106391456A (zh) * 2016-11-30 2017-02-15 广东轻工职业技术学院 一种自动化陶瓷加工装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0767035A1 (en) * 1995-10-04 1997-04-09 Nippei Toyama Corporation Slurry managing system and slurry managing method for wire saws
US5799643A (en) * 1995-10-04 1998-09-01 Nippei Toyama Corp Slurry managing system and slurry managing method for wire saws
US6053158A (en) * 1995-10-04 2000-04-25 Nippei Toyoma Corp. Slurry managing system and slurry managing method for wire saws
EP0786317A3 (en) * 1996-01-26 1998-06-17 Shin-Etsu Handotai Co., Ltd System for reusing oily slurry waste fluid
US6161533A (en) * 1996-10-01 2000-12-19 Nippei Toyoma Corp. Slurry managing system and slurry managing method
CN103586988A (zh) * 2013-11-25 2014-02-19 王金生 一种线锯切割机
CN104057543A (zh) * 2014-06-19 2014-09-24 王金生 一种磁场辅助的多线锯切割机
CN106391456A (zh) * 2016-11-30 2017-02-15 广东轻工职业技术学院 一种自动化陶瓷加工装置
CN106391456B (zh) * 2016-11-30 2019-02-22 广东轻工职业技术学院 一种自动化陶瓷加工装置

Also Published As

Publication number Publication date
JPH0416309B2 (OSRAM) 1992-03-23

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