JPS59232436A - 多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法 - Google Patents

多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法

Info

Publication number
JPS59232436A
JPS59232436A JP58108421A JP10842183A JPS59232436A JP S59232436 A JPS59232436 A JP S59232436A JP 58108421 A JP58108421 A JP 58108421A JP 10842183 A JP10842183 A JP 10842183A JP S59232436 A JPS59232436 A JP S59232436A
Authority
JP
Japan
Prior art keywords
sheet
ring
wafer ring
wafer
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58108421A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6329412B2 (enrdf_load_stackoverflow
Inventor
Susumu Kamiyama
進 神山
Takeshi Sato
武 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58108421A priority Critical patent/JPS59232436A/ja
Publication of JPS59232436A publication Critical patent/JPS59232436A/ja
Publication of JPS6329412B2 publication Critical patent/JPS6329412B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
JP58108421A 1983-06-15 1983-06-15 多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法 Granted JPS59232436A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58108421A JPS59232436A (ja) 1983-06-15 1983-06-15 多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58108421A JPS59232436A (ja) 1983-06-15 1983-06-15 多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法

Publications (2)

Publication Number Publication Date
JPS59232436A true JPS59232436A (ja) 1984-12-27
JPS6329412B2 JPS6329412B2 (enrdf_load_stackoverflow) 1988-06-14

Family

ID=14484333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58108421A Granted JPS59232436A (ja) 1983-06-15 1983-06-15 多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法

Country Status (1)

Country Link
JP (1) JPS59232436A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0378242A (ja) * 1989-08-22 1991-04-03 Hiyuuguru Electron Kk 粘着性フイルムの固定方法及びその装置
JP2008135513A (ja) * 2006-11-28 2008-06-12 Disco Abrasive Syst Ltd テープ拡張装置
JP2008140874A (ja) * 2006-11-30 2008-06-19 Disco Abrasive Syst Ltd テープ拡張装置
JP2012178471A (ja) * 2011-02-25 2012-09-13 Lintec Corp シート貼付装置および貼付方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5831696B2 (ja) * 2011-09-14 2015-12-09 株式会社東京精密 ダイボンダ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0378242A (ja) * 1989-08-22 1991-04-03 Hiyuuguru Electron Kk 粘着性フイルムの固定方法及びその装置
JP2008135513A (ja) * 2006-11-28 2008-06-12 Disco Abrasive Syst Ltd テープ拡張装置
JP2008140874A (ja) * 2006-11-30 2008-06-19 Disco Abrasive Syst Ltd テープ拡張装置
JP2012178471A (ja) * 2011-02-25 2012-09-13 Lintec Corp シート貼付装置および貼付方法

Also Published As

Publication number Publication date
JPS6329412B2 (enrdf_load_stackoverflow) 1988-06-14

Similar Documents

Publication Publication Date Title
US5769297A (en) Apparatus and method for dicing semiconductor wafers
US3562057A (en) Method for separating substrates
US6471806B1 (en) Method of adhering a wafer to wafer tape
TW527671B (en) Die pickup method and die pickup apparatus
TWI728144B (zh) 剝離方法及剝離裝置
WO2004038779A1 (ja) エキスパンド方法及びエキスパンド装置
JP2015123558A (ja) フィルムの切断装置、離型フィルムの切断方法、フィルムの切断方法、被樹脂封止部品の樹脂封止装置、被樹脂封止部品の樹脂封止方法、及び樹脂封止成形品製造装置
JPS59232436A (ja) 多数個の半導体素子を載せた伸縮性シートのウェハリングへのセッティング方法
US20060180136A1 (en) Tape expansion apparatus
KR920004514B1 (ko) 반도체소자 제조장치
CN208655593U (zh) 自动扩膜装置
JPH0541451A (ja) 半導体ウエハのペレタイズ方法と装置
TW201519300A (zh) 半導體製程
KR102556329B1 (ko) 반도체 기판을 지지하는 진공척
CN209471990U (zh) 一种承载晶元的扩晶环
DE102016110503A1 (de) Wafer-Expander
CN222355117U (zh) 一种晶圆检测用夹料装置
JPS6343327A (ja) エピスパイククラツシユ装置
JPS6079953A (ja) 紗張装置
CN212290915U (zh) 一种套臂式胶带携带装置
JP3807247B2 (ja) 半導体ウェーハの剥離装置及び化合物半導体チップの製造方法
CN218698073U (zh) 一种激光器芯片检测夹具
JPS60110135A (ja) ペレットピックアップ装置
CN211578702U (zh) 单铁环扩张装置
JPH0224379B2 (enrdf_load_stackoverflow)