JPS59232344A - 配線パタ−ン検出装置 - Google Patents

配線パタ−ン検出装置

Info

Publication number
JPS59232344A
JPS59232344A JP58106750A JP10675083A JPS59232344A JP S59232344 A JPS59232344 A JP S59232344A JP 58106750 A JP58106750 A JP 58106750A JP 10675083 A JP10675083 A JP 10675083A JP S59232344 A JPS59232344 A JP S59232344A
Authority
JP
Japan
Prior art keywords
light
wiring
wiring pattern
light source
detection device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58106750A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6319855B2 (enrdf_load_stackoverflow
Inventor
Yasuhiko Hara
靖彦 原
Koichi Tsukazaki
柄崎 晃一
Noriaki Ujiie
氏家 典明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58106750A priority Critical patent/JPS59232344A/ja
Priority to DE19843422395 priority patent/DE3422395A1/de
Publication of JPS59232344A publication Critical patent/JPS59232344A/ja
Priority to US06/832,692 priority patent/US4816686A/en
Publication of JPS6319855B2 publication Critical patent/JPS6319855B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP58106750A 1983-06-16 1983-06-16 配線パタ−ン検出装置 Granted JPS59232344A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58106750A JPS59232344A (ja) 1983-06-16 1983-06-16 配線パタ−ン検出装置
DE19843422395 DE3422395A1 (de) 1983-06-16 1984-06-15 Verfahren und vorrichtung zum ermitteln von verdrahtungsmustern
US06/832,692 US4816686A (en) 1983-06-16 1986-02-25 Method and apparatus for detecting wiring patterns

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58106750A JPS59232344A (ja) 1983-06-16 1983-06-16 配線パタ−ン検出装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP5641289A Division JPH0629861B2 (ja) 1989-03-10 1989-03-10 プリント基板上の配線パターン検出装置

Publications (2)

Publication Number Publication Date
JPS59232344A true JPS59232344A (ja) 1984-12-27
JPS6319855B2 JPS6319855B2 (enrdf_load_stackoverflow) 1988-04-25

Family

ID=14441585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58106750A Granted JPS59232344A (ja) 1983-06-16 1983-06-16 配線パタ−ン検出装置

Country Status (1)

Country Link
JP (1) JPS59232344A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62126332A (ja) * 1985-11-27 1987-06-08 Hitachi Ltd 回路基板の配線パターン検出装置
JPS62133341A (ja) * 1985-12-06 1987-06-16 Hitachi Ltd はんだ付部検査装置
JPS62235510A (ja) * 1986-04-07 1987-10-15 Hitachi Ltd 回路基板検査装置
JPH01250847A (ja) * 1988-02-19 1989-10-05 Kla Instr Corp 自動高速光学検査装置
JPH032548A (ja) * 1989-05-30 1991-01-08 Matsushita Electric Works Ltd 回路パターンの検査法
JPH032549A (ja) * 1989-05-30 1991-01-08 Matsushita Electric Works Ltd 回路パターンの検査法
JPH04152343A (ja) * 1990-10-17 1992-05-26 Hitachi Chem Co Ltd プリント配線板の製造方法
US6792359B2 (en) 2000-07-26 2004-09-14 Hitachi, Ltd. Method for inspecting defect and system therefor
WO2011027882A1 (ja) * 2009-09-07 2011-03-10 東洋合成工業株式会社 パターン形成用光硬化性組成物及びこれを用いた膜厚測定方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933643A (enrdf_load_stackoverflow) * 1972-07-23 1974-03-28
JPS5345180A (en) * 1976-10-06 1978-04-22 Hitachi Ltd Photoetching method
JPS5555204A (en) * 1978-10-20 1980-04-23 Fujitsu Ltd Pattern detection method of printed board for lamination
JPS5734402A (en) * 1980-08-11 1982-02-24 Hitachi Ltd Inspecting method for defect in circuit pattern

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933643A (enrdf_load_stackoverflow) * 1972-07-23 1974-03-28
JPS5345180A (en) * 1976-10-06 1978-04-22 Hitachi Ltd Photoetching method
JPS5555204A (en) * 1978-10-20 1980-04-23 Fujitsu Ltd Pattern detection method of printed board for lamination
JPS5734402A (en) * 1980-08-11 1982-02-24 Hitachi Ltd Inspecting method for defect in circuit pattern

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62126332A (ja) * 1985-11-27 1987-06-08 Hitachi Ltd 回路基板の配線パターン検出装置
JPS62133341A (ja) * 1985-12-06 1987-06-16 Hitachi Ltd はんだ付部検査装置
JPS62235510A (ja) * 1986-04-07 1987-10-15 Hitachi Ltd 回路基板検査装置
JPH01250847A (ja) * 1988-02-19 1989-10-05 Kla Instr Corp 自動高速光学検査装置
JPH032548A (ja) * 1989-05-30 1991-01-08 Matsushita Electric Works Ltd 回路パターンの検査法
JPH032549A (ja) * 1989-05-30 1991-01-08 Matsushita Electric Works Ltd 回路パターンの検査法
JPH04152343A (ja) * 1990-10-17 1992-05-26 Hitachi Chem Co Ltd プリント配線板の製造方法
US6792359B2 (en) 2000-07-26 2004-09-14 Hitachi, Ltd. Method for inspecting defect and system therefor
US7010447B2 (en) 2000-07-26 2006-03-07 Hitachi, Ltd. Method for inspecting defect and system therefor
US7305314B2 (en) 2000-07-26 2007-12-04 Hitachi, Ltd. Method for inspecting defect and system therefor
US7558683B2 (en) 2000-07-26 2009-07-07 Hitachi, Ltd. Method for inspecting defect and system therefor
WO2011027882A1 (ja) * 2009-09-07 2011-03-10 東洋合成工業株式会社 パターン形成用光硬化性組成物及びこれを用いた膜厚測定方法
JPWO2011027882A1 (ja) * 2009-09-07 2013-02-04 東洋合成工業株式会社 パターン形成用光硬化性組成物及びこれを用いた膜厚測定方法

Also Published As

Publication number Publication date
JPS6319855B2 (enrdf_load_stackoverflow) 1988-04-25

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