JPS59232344A - 配線パタ−ン検出装置 - Google Patents
配線パタ−ン検出装置Info
- Publication number
- JPS59232344A JPS59232344A JP58106750A JP10675083A JPS59232344A JP S59232344 A JPS59232344 A JP S59232344A JP 58106750 A JP58106750 A JP 58106750A JP 10675083 A JP10675083 A JP 10675083A JP S59232344 A JPS59232344 A JP S59232344A
- Authority
- JP
- Japan
- Prior art keywords
- light
- wiring
- wiring pattern
- light source
- detection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58106750A JPS59232344A (ja) | 1983-06-16 | 1983-06-16 | 配線パタ−ン検出装置 |
DE19843422395 DE3422395A1 (de) | 1983-06-16 | 1984-06-15 | Verfahren und vorrichtung zum ermitteln von verdrahtungsmustern |
US06/832,692 US4816686A (en) | 1983-06-16 | 1986-02-25 | Method and apparatus for detecting wiring patterns |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58106750A JPS59232344A (ja) | 1983-06-16 | 1983-06-16 | 配線パタ−ン検出装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5641289A Division JPH0629861B2 (ja) | 1989-03-10 | 1989-03-10 | プリント基板上の配線パターン検出装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59232344A true JPS59232344A (ja) | 1984-12-27 |
JPS6319855B2 JPS6319855B2 (enrdf_load_stackoverflow) | 1988-04-25 |
Family
ID=14441585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58106750A Granted JPS59232344A (ja) | 1983-06-16 | 1983-06-16 | 配線パタ−ン検出装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59232344A (enrdf_load_stackoverflow) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62126332A (ja) * | 1985-11-27 | 1987-06-08 | Hitachi Ltd | 回路基板の配線パターン検出装置 |
JPS62133341A (ja) * | 1985-12-06 | 1987-06-16 | Hitachi Ltd | はんだ付部検査装置 |
JPS62235510A (ja) * | 1986-04-07 | 1987-10-15 | Hitachi Ltd | 回路基板検査装置 |
JPH01250847A (ja) * | 1988-02-19 | 1989-10-05 | Kla Instr Corp | 自動高速光学検査装置 |
JPH032548A (ja) * | 1989-05-30 | 1991-01-08 | Matsushita Electric Works Ltd | 回路パターンの検査法 |
JPH032549A (ja) * | 1989-05-30 | 1991-01-08 | Matsushita Electric Works Ltd | 回路パターンの検査法 |
JPH04152343A (ja) * | 1990-10-17 | 1992-05-26 | Hitachi Chem Co Ltd | プリント配線板の製造方法 |
US6792359B2 (en) | 2000-07-26 | 2004-09-14 | Hitachi, Ltd. | Method for inspecting defect and system therefor |
WO2011027882A1 (ja) * | 2009-09-07 | 2011-03-10 | 東洋合成工業株式会社 | パターン形成用光硬化性組成物及びこれを用いた膜厚測定方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4933643A (enrdf_load_stackoverflow) * | 1972-07-23 | 1974-03-28 | ||
JPS5345180A (en) * | 1976-10-06 | 1978-04-22 | Hitachi Ltd | Photoetching method |
JPS5555204A (en) * | 1978-10-20 | 1980-04-23 | Fujitsu Ltd | Pattern detection method of printed board for lamination |
JPS5734402A (en) * | 1980-08-11 | 1982-02-24 | Hitachi Ltd | Inspecting method for defect in circuit pattern |
-
1983
- 1983-06-16 JP JP58106750A patent/JPS59232344A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4933643A (enrdf_load_stackoverflow) * | 1972-07-23 | 1974-03-28 | ||
JPS5345180A (en) * | 1976-10-06 | 1978-04-22 | Hitachi Ltd | Photoetching method |
JPS5555204A (en) * | 1978-10-20 | 1980-04-23 | Fujitsu Ltd | Pattern detection method of printed board for lamination |
JPS5734402A (en) * | 1980-08-11 | 1982-02-24 | Hitachi Ltd | Inspecting method for defect in circuit pattern |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62126332A (ja) * | 1985-11-27 | 1987-06-08 | Hitachi Ltd | 回路基板の配線パターン検出装置 |
JPS62133341A (ja) * | 1985-12-06 | 1987-06-16 | Hitachi Ltd | はんだ付部検査装置 |
JPS62235510A (ja) * | 1986-04-07 | 1987-10-15 | Hitachi Ltd | 回路基板検査装置 |
JPH01250847A (ja) * | 1988-02-19 | 1989-10-05 | Kla Instr Corp | 自動高速光学検査装置 |
JPH032548A (ja) * | 1989-05-30 | 1991-01-08 | Matsushita Electric Works Ltd | 回路パターンの検査法 |
JPH032549A (ja) * | 1989-05-30 | 1991-01-08 | Matsushita Electric Works Ltd | 回路パターンの検査法 |
JPH04152343A (ja) * | 1990-10-17 | 1992-05-26 | Hitachi Chem Co Ltd | プリント配線板の製造方法 |
US6792359B2 (en) | 2000-07-26 | 2004-09-14 | Hitachi, Ltd. | Method for inspecting defect and system therefor |
US7010447B2 (en) | 2000-07-26 | 2006-03-07 | Hitachi, Ltd. | Method for inspecting defect and system therefor |
US7305314B2 (en) | 2000-07-26 | 2007-12-04 | Hitachi, Ltd. | Method for inspecting defect and system therefor |
US7558683B2 (en) | 2000-07-26 | 2009-07-07 | Hitachi, Ltd. | Method for inspecting defect and system therefor |
WO2011027882A1 (ja) * | 2009-09-07 | 2011-03-10 | 東洋合成工業株式会社 | パターン形成用光硬化性組成物及びこれを用いた膜厚測定方法 |
JPWO2011027882A1 (ja) * | 2009-09-07 | 2013-02-04 | 東洋合成工業株式会社 | パターン形成用光硬化性組成物及びこれを用いた膜厚測定方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6319855B2 (enrdf_load_stackoverflow) | 1988-04-25 |
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